The Moscone Center
San Francisco, California, United States
23 - 28 January 2021
Conference LA301
Laser Applications in Microelectronic and Optoelectronic Manufacturing (LAMOM) XXVI
Important
Dates
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Abstract Due:
15 July 2020

Author Notification:
21 September 2020

Manuscript Due Date:
5 January 2021

Conference
Cosponsors
Conference
Committee
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Conference Chairs
  • Carlos Molpeceres, Univ. Politécnica de Madrid (Spain)
  • Jie Qiao, Rochester Institute of Technology (United States)
  • Aiko Narazaki, National Institute of Advanced Industrial Science and Technology (Japan)

Program Committee
Program Committee continued...
Additional Conference
Information
Call for
Papers
This conference aims to provide a forum for discussion of fundamentals, methods, and techniques in laser materials processing and their relation to the applications and manufacturing of micro- and nanoscale electronic, photonic, optical, mechanical, fluidic, energy, and hybrid devices. Topics cover process development and applications in technology and for consumer electronics and medical devices.

Papers are solicited on, but not limited to, the following topics within the broad area of microelectronics, photonic devices, and optoelectronics manufacturing:

DYNAMICS OF LASER-MATTER INTERACTION
  • fundamentals of laser-material interaction
  • generation and dynamics of laser ablation plumes, including gas-dynamic effects, charge generation, and charge transfer
  • modeling of laser-material and laser-plume interactions for quantitative prediction of process parameters
  • novel approaches for laser micro and nano-processing including temporal and spatial beam shaping, pulse bursts, etc.
  • novel analytical methods.

LASER PROCESSES
  • AI for laser processing
  • laser modification of materials (annealing, doping, intermixing, photosensitivity)
  • laser cleaning, texturing, bending, and repair
  • laser nanoscale materials processing and manufacturing, including near-field nano-optical lithography
  • pulsed-laser deposition, laser-assisted thin-film epitaxy, atomic-layer epitaxy, resonant infrared pulsed-laser deposition, thin film and wafer processing
  • laser patterning
  • laser direct writing
  • laser additive manufacturing and rapid prototyping on micro- and nanoscale
  • laser-induced modification of glasses or transparent materials for applications in optoelectronics and photonics
  • laser transfer of materials (LIFT, BA-LIFT, etc.).

PRODUCTION TECHNOLOGIES
  • laser processing in microelectronic and optoelectronic manufacturing
  • parallel laser manufacturing
  • direct writing technologies for microelectronic and optoelectronic applications
  • laser processes for photovoltaic industry
  • digital photonic production
  • laser manufacture of microsystems (including microfluidic chips) and photonic and optoelectronic devices (LED, OLED)
  • novel systems and sub-systems for microelectronic and optoelectronic materials processing and device fabrication.

JOINT SESSIONS are planned with:
  • Laser-based Micro- and Nanoprocessing (LA302)
  • Synthesis and Photonics of Nanoscale Materials (LA303)
  • Frontiers in Ultrafast Optics (LA304)
  • Laser 3D Manufacturing (LA401)

BEST STUDENT PRESENTATION AWARD
Supported by the conference cosponsors, we will offer awards for the best oral and poster presentations given by students (honored with a cash prize of $500 for each). Student contributions will be judged based on scientific content and quality of presentation. To be eligible for the awards, you must:
  • be a graduate or undergraduate full-time student;
  • have conducted the majority of the work to be presented;
  • submit your abstract online by the deadline;
  • be the primary author;
  • select “Yes” when asked if you are a full-time student;
  • select yourself as the speaker;
  • under TOPIC selection, choose “Consider for Best Student Paper Award”;
  • be accepted to present at conference LA301;
  • submit your manuscript online by the deadline;
  • make the oral/poster presentation.
Note that prior prize holders will not be eligible.
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