The Moscone Center
San Francisco, California, United States
1 - 6 February 2020
Conference LA105
High-Power Diode Laser Technology XVIII
Important
Dates
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Abstract Due:
24 July 2019

Author Notification:
30 September 2019

Manuscript Due Date:
8 January 2020

Conference
Committee
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Conference Chair
Program Committee
Program Committee continued...
Call for
Papers
The High-Power Diode Laser Technology conference provides a forum to introduce the latest advancements in brightness and power scaling of semiconductor laser devices and packages. Innovations in laser architectures based on multi-emitter bars, single emitters and multi-chip arrays are invited. Technologies of special interest include developments in beam combining – coherent, spatial, spectral, and polarization, wavelength stabilization, high-brightness fiber coupling, high-power semiconductor device design, device-level and package-level reliability, failure mode analysis, high-efficiency operation, high-temperature operation, plus recent progress in power scaling of short wavelength devices.

Papers are solicited on a wide range of topics related to high-power diode laser technology:

HIGH-POWER VISIBLE LASER DIODES FOR:
  • industrial materials processing
  • cinema and other display applications
  • automotive light sources and other lighting applications
  • medical therapeutic and bioinstrumentation applications.

HIGH-POWER INFRARED LASER DIODES FOR:
  • industrial materials processing
  • autonomous vehicle LIDAR and other applications for navigation, collision avoidance, and general 3D Sensing illumination
  • pump sources for fiber lasers, solid-state lasers, and alkali lasers
  • direct diode industrial applications
  • surgical, aesthetic and other medical applications
  • large-scale pump arrays for fusion energy systems and high energy physics research.

ADVANCES IN HIGH-POWER LASER DIODE DEVICES AND HIGH-BRIGHTNESS INTEGRATION
  • low-SWaP (Size, Weight and Power consumption) diode lasers for defense applications
  • novel material systems for high-density packaging and thermal management
  • high-brightness beam combination architectures and fiber coupling schemes
  • spectral control with on-chip gratings or external cavities
  • beam shaping and homogenization technologies
  • near- and far-field beam profile control
  • device modeling and multi-physics simulation
  • high-efficiency epitaxy and low-loss optical coupling
  • reliability modeling, expected lifetime assessment, and failure analysis.

ABSTRACT REQUIREMENTS
Contributions are accepted based on a peer reviewing process. Contributions to this conference must include the following two separate abstracts:
  • 100-word text abstract (for online program)
  • 250-word text abstract (for abstract digest)
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