The Moscone Center
San Francisco, California, United States
6 - 11 March 2021
Conference LA104
Components and Packaging for Laser Systems VII
Conference Committee
Important Dates
Abstract Due:
26 August 2020

Author Notification:
2 November 2020

Manuscript Due Date:
12 February 2021

Additional Conference Information
Call for
Optical components are crucial for laser performance and form a foundation for advances in laser science and technology. All around the globe, vast and constantly growing research efforts are dedicated to developing new and more advanced laser components and systems. Along this line, packaging solutions for optical components enable their most efficient and consistent integration in laser systems. Laser component packaging is decisive for stable and reliable laser operations while not only improving laser characteristics but also enabling broader laser usability and applications.

This conference is dedicated to recent achievements and progress made in the field of optical components for lasers and laser systems as well as laser packaging solutions. A wide range of topics covers a variety of laser components and packaging technologies for semiconductor lasers, solid state lasers, fiber lasers, gas lasers, CW and pulsed lasers, ultra-short pulsed lasers, and others.

  • components for high-power and high-energy laser systems
  • 2 micron and mid-IR optical components and packaging
  • components integration for ultra-short pulsed laser (USPL) systems
  • optics for ultrafast lasers
  • beam-transforming components for laser diode arrays
  • diffractive optical elements (DOE) and holographic optical elements (HOE)
  • lenses and lens arrays
  • grating components for lasers: volume Bragg gratings, fiber Bragg gratings, blazed gratings, holographic phase gratings, and others
  • components for laser line narrowing, mode locking, and mode selection
  • components for coherent and spectral beam combining of CW and pulsed lasers
  • components for laser beam engineering
  • high-power and high-energy beam delivery components
  • high laser-induced damage threshold (LIDT) materials and components
  • frequency generation components: components integrating nonlinear optics and novel optical designs (e.g. gas-filled fibers, resonant cavities, etc.) for SHG, THG, OPG, Raman shift, etc.
  • space qualification of laser components
  • AR coating of components for high-power laser applications
  • UV laser-induced / photochemical contamination of laser optical components
  • polarization optics for lasers
  • recent advances in isolators, couplers, splitters, etc.
  • emerging laser components
  • advanced cooling components and solutions
  • novel optical component design methodologies
  • modeling of optical components in laser systems
  • advanced manufacturing techniques for laser optical components
  • novel materials for optical components (high index glasses, polymers, diamond, etc.).

  • packaging, assembly, and mounting solutions of optical components in lasers
  • packaging technologies for high-power lasers
  • theoretical and practical packaging solutions for fiber coupling
  • laser array packaging solutions
  • thermal management of high-power lasers
  • thermal and structural management for very narrow linewidth frequency-locked laser systems
  • materials for laser packaging
  • materials for component attachment (epoxies, solders, etc.)
  • novel active and passive alignment techniques
  • reliability of laser systems
  • modeling and design of laser packaging.
Conference Committee
Conference Chairs
Program Committee
  • Jens Biesenbach, DILAS Diodenlaser GmbH (Germany)
  • Gunnar Böttger, Fraunhofer-Institut für Zuverlässigkeit und Mikrointegration IZM (Germany)
  • Jenna Campbell, Freedom Photonics, LLC (United States)
  • Joseph L. Dallas, Avo Photonics, Inc. (United States)
  • Martin Forrer, FISBA AG (Switzerland)
  • Manoj Kanskar, nLIGHT, Inc. (United States)
  • Alexander V. Laskin, AdlOptica Optical Systems GmbH (Germany)
  • Xingsheng Liu, Focuslight Technologies, Inc. (China)

Program Committee continued...
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