Photomask Technology, formerly known as BACUS, stands as a distinguished forum where professionals and academics from the semiconductor industry and related organizations come together to present and discuss the latest advancements in photomask technology. The event covers a wide range of topics, including materials, design, fabrication, quality control, and wafer imaging characterization in EUV, DUV, and other related technology areas. The event is also situated alongside the EUV Lithography Symposium, and this co-location provides participants with a comprehensive scope and an opportunity to engage in productive discussions, exchange insights, and address challenges related to photomask and its crucial role in lithography.

 

With EUV lithography integrated into several generations of semiconductor products, the necessity for multiple patterning across more layers becomes inevitable. Given the significant costs associated with patterning, there is an imperative need for innovation in materials for EUV masks and pellicles, MDP (OPC, MPC, fracture) methods, writing techniques, metrology, and inspection capabilities to enhance resolution, yield, and productivity. Furthermore, the introduction of high-NA EUV scanners to the field necessitates the immediate securing of the entire infrastructure and refining of mask-making processes. Legacy technologies also require improvement to support existing applications and explore new opportunities in areas such as 5G, silicon photonics, IoT, MEMS, automotive, AR/VR, and others.

 

We extend a warm invitation to technologists, researchers, and students in the photomask and related fields to actively participate in our conference. This event serves as an excellent platform to exchange knowledge, insights, and ideas crucial for advancing the semiconductor industry. We encourage submissions covering a wide range of topics related to photomask research, development, manufacturing, and application. While we have a particular interest in the areas highlighted below, we welcome submissions from all related fields leveraging photomask technology. So, submit your abstract today and join us in shaping the future of our industry.

Whether you are working on leading-edge technologies or enhancing legacy ones, this is your chance to showcase your work, gain new knowledge, and network with colleagues and collaborators. We encourage you to participate by submitting your abstract(s) and motivating your colleagues to do the same. We express our gratitude for the technical contributions and support from participating companies that make this symposium possible.

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Conference PM01

Photomask Technology 2024

This conference has an open call for papers:
Abstract Due: 15 May 2024
Author Notification: 8 July 2024
Manuscript Due: 11 September 2024

Photomask Technology, formerly known as BACUS, stands as a distinguished forum where professionals and academics from the semiconductor industry and related organizations come together to present and discuss the latest advancements in photomask technology. The event covers a wide range of topics, including materials, design, fabrication, quality control, and wafer imaging characterization in EUV, DUV, and other related technology areas. The event is also situated alongside the EUV Lithography Symposium, and this co-location provides participants with a comprehensive scope and an opportunity to engage in productive discussions, exchange insights, and address challenges related to photomask and its crucial role in lithography.

 

With EUV lithography integrated into several generations of semiconductor products, the necessity for multiple patterning across more layers becomes inevitable. Given the significant costs associated with patterning, there is an imperative need for innovation in materials for EUV masks and pellicles, MDP (OPC, MPC, fracture) methods, writing techniques, metrology, and inspection capabilities to enhance resolution, yield, and productivity. Furthermore, the introduction of high-NA EUV scanners to the field necessitates the immediate securing of the entire infrastructure and refining of mask-making processes. Legacy technologies also require improvement to support existing applications and explore new opportunities in areas such as 5G, silicon photonics, IoT, MEMS, automotive, AR/VR, and others.

 

We extend a warm invitation to technologists, researchers, and students in the photomask and related fields to actively participate in our conference. This event serves as an excellent platform to exchange knowledge, insights, and ideas crucial for advancing the semiconductor industry. We encourage submissions covering a wide range of topics related to photomask research, development, manufacturing, and application. While we have a particular interest in the areas highlighted below, we welcome submissions from all related fields leveraging photomask technology. So, submit your abstract today and join us in shaping the future of our industry.

  • Design and verification, data prep and automation (DFM, OPC, SMO, DTCO, MRC, LRC, Fracture)
  • Curvilinear masks and inverse lithography technology
  • DUV mask blanks (substrates, binary and phase shifting)
  • EUV mask blanks (substrate, multilayers, capping layer and various absorbers)
  • E-beam and optical resist (CAR, non-CAR),
  • Mask writing technologies (MBMW, laser writers, corrections, process compensation)
  • Mask processes (resist, resist process, etch, cleaning)
  • Mask metrology (CD, registration, defects, AIMS, AFM, SEM)
  • Mask inspection, repair, defect mitigation
  • Use of deep learning and machine learning, GPU or other hardware and software accelerations for mask computations
  • Pellicles and contamination control (DUV and EUV)
  • Mask infrastructure for high-NA EUVL
  • Simulation and imaging of mask transfer to wafer (MEEF, LER, PW, stochastics)
  • Novel and maskless technologies (imprints, direct write, Talbot)
  • Mature mask technologies for new markets (packaging, photonics, sensors, biosciences, MEMS, displays)
  • Emerging device technology (AR/VR, quantum) requiring unique mask and patterning
  • Strategy and challenges in cost, cycle time, sustainability and legacy equipment use

Whether you are working on leading-edge technologies or enhancing legacy ones, this is your chance to showcase your work, gain new knowledge, and network with colleagues and collaborators. We encourage you to participate by submitting your abstract(s) and motivating your colleagues to do the same. We express our gratitude for the technical contributions and support from participating companies that make this symposium possible.

Conference Chair
Seoul National Univ. (Korea, Republic of)
Conference Co-Chair
Synopsys, Inc. (United States)
Program Committee
Intel Corp. (United States)
Program Committee
UBC Microelectronics (Germany)
Program Committee
Siemens EDA (United States)
Program Committee
Entegris, Inc. (Korea, Republic of)
Program Committee
Micron Technology, Inc. (United States)
Program Committee
SAMSUNG Electronics Co., Ltd. (Korea, Republic of)
Program Committee
D2S, Inc. (United States)
Program Committee
imec (Belgium)
Program Committee
Lasertec USA Inc. (United States)
Program Committee
Dai Nippon Printing Co., Ltd. (Japan)
Program Committee
Photronics, Inc. (United States)
Program Committee
HOYA Corp. USA (United States)
Program Committee
E-SOL, Inc. (Korea, Republic of)
Program Committee
IBM Thomas J. Watson Research Ctr. (United States)
Program Committee
Intel Corp. (United States)
Program Committee
Meta (United States)
Program Committee
Toppan Photomasks, Inc. (United States)
Program Committee
ASML (United States)
Program Committee
HOYA Corp. (Japan)
Program Committee
TSMC North America (United States)
Program Committee
IBM Corp. (United States)
Program Committee
Canon Nanotechnologies, Inc. (United States)
Program Committee
Carl Zeiss SMS Ltd. (Israel)
Program Committee
KLA Corp. (United States)
Program Committee
SK Hynix System IC Inc. (Korea, Republic of)
Program Committee
Siemens EDA (United States)
Program Committee
Lasertec U.S.A., Inc. Zweigniederlassung Deutschland (Germany)
Program Committee
ASML Netherlands B.V. (Netherlands)
Program Committee
Applied Materials, Inc. (United States)
Program Committee
FUJIFILM Corp. (Japan)
Program Committee
SAMSUNG Electronics Co., Ltd. (Korea, Republic of)
Program Committee
NuFlare Technology, Inc. (Japan)
Program Committee
Meta (United States)
Program Committee
Keysight Technologies, Inc. (United States)