12 - 14 October 2024
Nantong, Jiangsu, China
Laser processing and manufacturing has become one of the most convenient and enabling technologies for manufacturing with a reduced carbon footprint and are applicable to related industries such as automobile, railway, shipbuilding, aerospace, microelectronics, photonics, biomedical and energy. It offers unprecedented versatility and range in terms of feature size, material, phase, and processing option. During the last decade, there have been significant advances on laser processing and manufacturing research and development including laser additive manufacturing, laser welding, laser drilling, laser cutting, laser peening, laser cleaning, laser surface texturing, and laser nanofabrication. The primary goal of this conference is to provide a platform for professionals to share and discuss the latest advances in laser processing and manufacturing. The solicited exemplary topics include, but are not limited to: ;
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Conference PA103

Advanced Laser Processing and Manufacturing VIII

This conference has an open call for papers:
Abstract Due: 29 May 2024
Author Notification: 22 July 2024
Manuscript Due: 25 September 2024
Laser processing and manufacturing has become one of the most convenient and enabling technologies for manufacturing with a reduced carbon footprint and are applicable to related industries such as automobile, railway, shipbuilding, aerospace, microelectronics, photonics, biomedical and energy. It offers unprecedented versatility and range in terms of feature size, material, phase, and processing option. During the last decade, there have been significant advances on laser processing and manufacturing research and development including laser additive manufacturing, laser welding, laser drilling, laser cutting, laser peening, laser cleaning, laser surface texturing, and laser nanofabrication. The primary goal of this conference is to provide a platform for professionals to share and discuss the latest advances in laser processing and manufacturing. The solicited exemplary topics include, but are not limited to:
  • laser welding and joining
  • laser cladding and remanufacturing
  • laser additive manufacturing and 3D printing
  • laser cutting and drilling
  • laser peening, forming, polishing, cleaning, and texturing
  • laser re-melting and alloying
  • laser micro and nano fabrication
  • pico- / femto-second laser processing
  • laser-based hybrid/combined processing and manufacturing
  • novel industry lasers and optical technologies
  • upgrading and improvement of laser devices
  • novel techniques for key elements in optical systems such as laser sources
  • novel elements and components in laser processing and manufacturing systems such as diffractive optical elements and multi-axis scan heads
  • industrial applications of laser processing and manufacturing technologies
  • applications of machine learning, AI (artificial intelligence), and DX (digital transformation) in laser processing and manufacturing.
Conference Chair
Xiamen Univ. (China)
Conference Chair
Beijing Univ. of Technology (China)
Conference Chair
Institute for Molecular Science (Japan), Osaka Univ. (Japan)
Conference Chair
Zhejiang Univ. of Technology (China)
Program Committee
Southern Univ. of Science and Technology (China)
Program Committee
The Univ. of Tennessee Knoxville (United States)
Program Committee
Shanghai Jiao Tong Univ. (China)
Program Committee
Sungho Jeong
Gwangju Institute of Science and Technology (Korea, Republic of)
Program Committee
PolarOnyx, Inc. (United States)
Program Committee
Osaka Univ. (Japan)
Program Committee
Huazhong Univ. of Science and Technology (China)
Program Committee
Tsinghua Univ. (China)
Program Committee
Beijing Univ. of Technology (China)
Program Committee
MKS Instruments, Inc. (United States)
Program Committee
Ningbo Institute of Materials Technology and Engineering (China)
Program Committee
Jiangsu Univ. (China)
Additional Information

View call for papers


What you will need to submit

  • Presentation title
  • Author(s) information
  • Speaker biography (1000-character max including spaces)
  • Abstract for technical review (200-300 words; text only)
  • Summary of abstract for display in the program (50-150 words; text only)
  • Keywords used in search for your paper (optional)
Note: Only original material should be submitted. Commercial papers, papers with no new research/development content, and papers with proprietary restrictions will not be accepted for presentation.