There is a critical unmet need for new measurement techniques for characterization and testing, operating during production, and for lifetime cycle prediction. Optics and photonics systems are paving the way to meet this increasing demand. Optical metrology provides accurate diagnostics while non-destructive, non-contact and particularly appropriate for probing any materials destined to optoelectronic and photonic devices. Advances in material science, image processing, processing units and digital technologies are enabling integration and development of exciting new approaches for dimensional metrology. Micromechanical components, optics, electronics, sensors and actuators are also developing and growing at high rate.

This conference will focus on the theory, development and applications of optics and photonics systems related to advanced measuring techniques at nano-, micro- and macro- scales, for reliability study, failure analysis, and characterization of every type of systems requiring precision metrology. The complete research and development process including modeling, simulation, and implementation and testing shall be demonstrated on different examples. Special emphasis is directed to the development of new methods and algorithms into modern sensor systems, as well as application of these systems in production. Proposed topics include:

  • model-based metrology: sensor fusion, scattering, scatterometry, super-resolution, correlation
  • machine learning for optical metrology: neural networks, deep learning
  • on-machine and in-process metrology: ultrafast sensors, sensor networks, big data handling
  • measuring instruments using advanced photonic devices: frequency-comb lasers, metamaterials, terahertz sensors, broadly-tunable semiconductor lasers
  • metrology for digital optics for immersive displays: AR/VR/MR
  • miniature dimensional sensors based on nanofabrication techniques, silicon wafer interferometers, hybrid sensors
  • optical surface texture metrology
  • optical measurements of length, form, and position
  • instruments based on consumer electronics: smartphone microscopes, 3d imaging cameras for portable devices
  • quantitative imaging for 3d metrology
  • traceability, calibration and uncertainty in optical metrology
  • optical micro- and nano-metrology.
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    Conference PE108

    Optics and Photonics for Advanced Dimensional Metrology II

    This conference has an open call for papers:
    Abstract Due: 20 October 2021
    Author Notification: 12 January 2022
    Manuscript Due: 30 March 2022
    There is a critical unmet need for new measurement techniques for characterization and testing, operating during production, and for lifetime cycle prediction. Optics and photonics systems are paving the way to meet this increasing demand. Optical metrology provides accurate diagnostics while non-destructive, non-contact and particularly appropriate for probing any materials destined to optoelectronic and photonic devices. Advances in material science, image processing, processing units and digital technologies are enabling integration and development of exciting new approaches for dimensional metrology. Micromechanical components, optics, electronics, sensors and actuators are also developing and growing at high rate.

    This conference will focus on the theory, development and applications of optics and photonics systems related to advanced measuring techniques at nano-, micro- and macro- scales, for reliability study, failure analysis, and characterization of every type of systems requiring precision metrology. The complete research and development process including modeling, simulation, and implementation and testing shall be demonstrated on different examples. Special emphasis is directed to the development of new methods and algorithms into modern sensor systems, as well as application of these systems in production. Proposed topics include:

  • model-based metrology: sensor fusion, scattering, scatterometry, super-resolution, correlation
  • machine learning for optical metrology: neural networks, deep learning
  • on-machine and in-process metrology: ultrafast sensors, sensor networks, big data handling
  • measuring instruments using advanced photonic devices: frequency-comb lasers, metamaterials, terahertz sensors, broadly-tunable semiconductor lasers
  • metrology for digital optics for immersive displays: AR/VR/MR
  • miniature dimensional sensors based on nanofabrication techniques, silicon wafer interferometers, hybrid sensors
  • optical surface texture metrology
  • optical measurements of length, form, and position
  • instruments based on consumer electronics: smartphone microscopes, 3d imaging cameras for portable devices
  • quantitative imaging for 3d metrology
  • traceability, calibration and uncertainty in optical metrology
  • optical micro- and nano-metrology.
  • Conference Chair
    Zygo Corporation (United States)
    Conference Chair
    The Univ. of Nottingham (United Kingdom)
    Conference Chair
    Lab. d'Acoustique de l'Univ. du Maine (France)
    Program Committee
    Technische Univ. Dresden (Germany)
    Program Committee
    Fengzhou Fang
    Tianjin Univ. (China)
    Program Committee
    Istituto Nazionale di Ottica (Italy)
    Program Committee
    Worcester Polytechnic Institute (United States)
    Program Committee
    Utsunomiya Univ. (Japan)
    Program Committee
    Warsaw Univ. of Technology (Poland)
    Program Committee
    College of Optical Sciences, The Univ. of Arizona (United States)
    Program Committee
    Univ. Kassel (Germany)
    Program Committee
    Univ. de Strasbourg (France)
    Program Committee
    Ruhr-Univ. Bochum (Germany)
    Program Committee
    Utsunomiya Univ. (Japan)
    Program Committee
    Vrije Univ. Brussel (Belgium)
    Program Committee
    FEMTO-ST (France)
    Program Committee
    Univ. of Illinois (United States)
    Program Committee
    Univ. Stuttgart (Germany)
    Program Committee
    Shanghai Institute of Optics and Fine Mechanics, Chinese Academy of Sciences (China)
    Program Committee
    The Univ. of Nottingham (United Kingdom)
    Program Committee
    Ctr. Spatial de Liège (Belgium)
    Program Committee
    Nankai Univ. (China)