For over 50 years photolithography has been at the center of the growth of the semiconductor industry. The art of shaping matter with photons influences the way we live today and the drive into the future.

The need for more powerful chips and greater memory storage has driven the evolution of advanced lithography tooling, photomasks, processes and systems. The advent of extreme ultraviolet lithography (EUV) at 13.5 nm and its introduction in high volume manufacturing (HVM) ensures the extendibility of lithography to tighter dimensions for the fabrication of more powerful devices and support the exponential growth of data management. Its use in conjunction with optical lithography (g-line, i-line, KrF, ArF) enables a wide range of resolution for new devices in an ever-increasing array of applications, like AI, IoT, silicon photonics, MEMS, etc.

Many opportunities for lithography innovation as well as challenges remain. Progress in optical lithography equipment and optical mask-less tools enable improved efficiency and throughput, and more flexible use cases, respectively. Success in HVM and further extension of EUV lithography depend on advances in exposure tools stability, throughput, defectivity, imaging and overlay. Innovation in photomasks technology and tooling is a key component to both optical and EUV extendibility, as well as for continued support of a growing demand of established processes. Process optimization and stochastics control dictate implementation schemes of multiple patterning and EUV.

The new Optical and EUV Nanolithography XXXV conference covers both EUV and Optical projection-based lithography systems, practices and their applications in IC technology. It is the leading forum for scientists and engineers from around the world to present and discuss research on the advancement of lithography technologies.

We welcome technical and scientific papers in the following areas:

LITHOGRAPHY EQUIPMENT SOURCES MASKS PATTERNING SYSTEMS FOR IoT, ADVANCED PACKAGING, AND HETEROGENEOUS INTEGRATION Students submitting papers to Optical and EUV Nanolithography XXXV will be considered for the ASML Best Student Paper. This award is given each year at this conference and recognizes extraordinary work achieved by students interested in the photolithography field, and strongly supports the contributions made to scientific advancement at the conference. The award includes a plaque along with a monetary award to help the student’s future research activities.;
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Conference AL101

Optical and EUV Nanolithography XXXV

This conference has an open call for papers:
Abstract Due: 1 September 2021
Author Notification: 6 December 2021
Manuscript Due: 2 February 2022
For over 50 years photolithography has been at the center of the growth of the semiconductor industry. The art of shaping matter with photons influences the way we live today and the drive into the future.

The need for more powerful chips and greater memory storage has driven the evolution of advanced lithography tooling, photomasks, processes and systems. The advent of extreme ultraviolet lithography (EUV) at 13.5 nm and its introduction in high volume manufacturing (HVM) ensures the extendibility of lithography to tighter dimensions for the fabrication of more powerful devices and support the exponential growth of data management. Its use in conjunction with optical lithography (g-line, i-line, KrF, ArF) enables a wide range of resolution for new devices in an ever-increasing array of applications, like AI, IoT, silicon photonics, MEMS, etc.

Many opportunities for lithography innovation as well as challenges remain. Progress in optical lithography equipment and optical mask-less tools enable improved efficiency and throughput, and more flexible use cases, respectively. Success in HVM and further extension of EUV lithography depend on advances in exposure tools stability, throughput, defectivity, imaging and overlay. Innovation in photomasks technology and tooling is a key component to both optical and EUV extendibility, as well as for continued support of a growing demand of established processes. Process optimization and stochastics control dictate implementation schemes of multiple patterning and EUV.

The new Optical and EUV Nanolithography XXXV conference covers both EUV and Optical projection-based lithography systems, practices and their applications in IC technology. It is the leading forum for scientists and engineers from around the world to present and discuss research on the advancement of lithography technologies.

We welcome technical and scientific papers in the following areas:

LITHOGRAPHY EQUIPMENT
  • optical lithography equipment
  • optical mask-less exposure tools
  • optical and EUV tool design and innovation
  • high-NA EUV imaging systems
  • throughput, defectivity, and productivity
  • imaging performance
  • focus, dose, overlay control, and budgets
  • aberrations, flare, and out-of-band light
SOURCES
  • light sources for EUV and optical lithography systems
  • power scaling of EUV sources
  • efficiency and reliability
  • source characterization
  • EUV source collectors, cleaning and lifetime
MASKS
  • substrates and blanks
  • patterned and blank mask inspection
  • actinic, e-beam, and DUV inspection methods
  • defect characterization, mitigation and repair
  • optical and EUV mask absorber materials and patterning
  • mask process
  • mask roughness
  • pellicle development and platform integration
  • mask architectures for higher numerical apertures
  • mask writing techniques
  • mask design fit to multi-beam mask writers
PATTERNING
  • optical system and mask-induced defect, electrical and yield signatures
  • resolution enhancement techniques
  • imaging simulations and source-mask optimization (SMO)
  • optical and EUV lithography mixing
  • EUV to Optical matching
  • multi-patterning, 193i and EUVL
  • edge placement control
  • on-product overlay control
  • EUV process optimization
  • stochastics control
SYSTEMS FOR IoT, ADVANCED PACKAGING, AND HETEROGENEOUS INTEGRATION
  • Equipment design and characterization for non-IC applications
  • Light sources for non-IC applications
  • Mask technology for non-IC applications
Students submitting papers to Optical and EUV Nanolithography XXXV will be considered for the ASML Best Student Paper. This award is given each year at this conference and recognizes extraordinary work achieved by students interested in the photolithography field, and strongly supports the contributions made to scientific advancement at the conference. The award includes a plaque along with a monetary award to help the student’s future research activities.
Conference Chair
Intel Corp. (United States)
Conference Co-Chair
IBM Thomas J. Watson Research Ctr. (United States)
Program Committee
Intel Corp. (United States)
Program Committee
Cymer, LLC (United States)
Program Committee
Fraunhofer-Institut für Integrierte Systeme und Bauelementetechnologie IISB (Germany)
Program Committee
IBM Corp. (United States)
Program Committee
IBM Corp. (United States)
Program Committee
Lawrence Berkeley National Lab. (United States)
Program Committee
Carl Zeiss SMT GmbH (Germany)
Program Committee
Dai Nippon Printing Co., Ltd. (Japan)
Program Committee
KIOXIA Corp. (Japan)
Program Committee
SAMSUNG Electronics Co., Ltd. (Korea, Republic of)
Program Committee
HOYA Corp. (United States)
Program Committee
SAMSUNG Electronics Co., Ltd. (Korea, Republic of)
Program Committee
Toppan Printing Co., Ltd. (Japan)
Program Committee
Intel Corp. (United States)
Program Committee
SK Hynix, Inc. (Korea, Republic of)
Program Committee
IBM Corp. (United States)
Program Committee
Synopsys, Inc. (United States)
Program Committee
Gigaphoton Inc. (Japan)
Program Committee
Canon Inc. (Japan)
Program Committee
Patrick P. Naulleau
Lawrence Berkeley National Lab. (United States)
Program Committee
Applied Materials, Inc. (United States)
Program Committee
Nikon Corp. (Japan)
Program Committee
imec (Belgium)
Program Committee
Carl Zeiss Semiconductor Manufacturing Technology, Inc. (United States)
Program Committee
IMEC (Belgium)
Program Committee
Infineon Technologies Dresden GmbH (Germany)
Program Committee
Rochester Institute of Technology (United States)
Program Committee
Gigaphoton Inc. (Japan)
Program Committee
Lasertec U.S.A., Inc. Zweigniederlassung Deutschland (Germany)
Program Committee
Mentor Graphics Corp. (United States)
Program Committee
imec (Belgium)
Program Committee
ASML Netherlands B.V. (Netherlands)
Program Committee
ASML Brion (United States)
Program Committee
GLOBALFOUNDRIES Inc. (United States)
Program Committee
TSMC North America (United States)