San Jose Marriott and San Jose Convention Center
San Jose, California, United States
27 February - 3 March 2011
Conference 7973
Optical Microlithography XXIV
Tuesday - Thursday 1 - 3 March 2011
Important
Dates
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Abstract Due:
16 August 2010

Author Notification:
25 October 2010

Manuscript Due Date:
31 January 2011

Conference
Committee
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Tuesday 1 March Show All Abstracts
Introduction, Opening Remarks, and Special Recognition
Tuesday 1 March 2011
8:20 AM - 8:40 AM
Location: Conv. Ctr. Ballroom A2
Session 1:
Invited Session
Tuesday 1 March 2011
8:40 AM - 10:10 AM
Location: Conv. Ctr. Ballroom A2
Microlithography beyond the IC (Invited Paper)
Paper 7973-1
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Design architecture, metrology, and integration: OPC at the age of discovery (Invited Paper)
(Canceled)
Paper 7973-2
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Present and future of NAND flash scaling at the lithography crossroad (Invited Paper)
Paper 7973-3
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Session 2:
FreeForm and SMO
Tuesday 1 March 2011
10:40 AM - 12:10 PM
Location: Conv. Ctr. Ballroom A2
Freeform and SMO (Invited Paper)
Paper 7973-4
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Qualification, monitoring, and integration into a production environment of the world's first fully programmable illuminator
Paper 7973-5
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Agile and accurate control of lithographic imaging using a freeform illuminator
Paper 7973-6
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Design specific joint optimization of masks and sources on a very large scale
Paper 7973-7
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Session 3:
Source and Mask Optimization I
Tuesday 1 March 2011
2:00 PM - 3:40 PM
Location: Conv. Ctr. Ballroom A2
Illuminator predictor for effective SMO solutions
Paper 7973-8
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Full-chip source and mask optimization
Paper 7973-9
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Joint optimization of layout and litho for SRAM and logic towards the 20nm node using 193i
Paper 7973-10
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Applicability of global source mask optimization to 22/20nm node and beyond
Paper 7973-11
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Supreme lithographic performance by simple mask layout based on lithography and layout co-optimization
Paper 7973-12
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Session 4:
Double Patterning I
Tuesday 1 March 2011
4:10 PM - 6:10 PM
Location: Conv. Ctr. Ballroom A2
Simultaneous OPC and decomposition for double exposure lithography
Paper 7973-13
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Towards manufacturing of advanced logic devices by double-patterning
Paper 7973-14
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Innovative self-aligned triple patterning for 1x half pitch using single "spacer deposition-spacer etch" step
Paper 7973-15
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DPT restricted design rules for advanced logic applications
Paper 7973-16
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Scanner alignment performance for double patterning
Paper 7973-17
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Effective decomposition algorithm for self-aligned double patterning lithography
Paper 7973-18
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Panel Discussion: Progress Toward the Sub-22-Node
Tuesday 1 March 2011
7:30 PM - 9:30 PM
Location: Conv. Ctr. Ballroom J

Panel Moderators:
Will Conley, Freescale Semiconductor, Inc.; Mircea V. Dusa, ASML US, Inc.
Wednesday 2 March Show All Abstracts
Session 5:
Double Patterning II
Wednesday 2 March 2011
8:00 AM - 9:30 AM
Location: Conv. Ctr. Ballroom A2
Mandrel-based patterning: density multiplication techniques for 15nm nodes (Invited Paper)
Paper 7973-19
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Characterization of a 'thermal freeze' litho-litho-etch (LLE) process for predictive simulation
Paper 7973-20
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Improving double patterning flow by analyzing the diffractive orders in the pupil plane
Paper 7973-21
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Spacer-defined double patterning for 20nm and beyond logic BEOL technology
Paper 7973-22
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Session 6:
Mask 3D Modeling
Wednesday 2 March 2011
9:30 AM - 10:10 AM
Location: Conv. Ctr. Ballroom A2
Accuracy and performance of 3D mask models in optical projection lithography
Paper 7973-23
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Accounting for mask topography effects in source-mask optimization for advanced nodes
Paper 7973-24
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Session 7:
Tools and Process Control I
Wednesday 2 March 2011
10:40 AM - 12:00 PM
Location: Conv. Ctr. Ballroom A2
Improved fab CDU with FlexRay and LithoTuner
Paper 7973-25
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Optical proximity stability control of ArF immersion clusters
Paper 7973-26
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Scanner matching using pupil intensity control between scanners in 30nm DRAM device
Paper 7973-27
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Enabling 22-nm logic node with advanced RET solutions
Paper 7973-68
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Session 8:
Tools and Process Control II
Wednesday 2 March 2011
1:20 PM - 2:20 PM
Location: Conv. Ctr. Ballroom A2
Solutions for 22-nm node patterning using ArFi technology
Paper 7973-29
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Characterization and control of dynamic lens heating effects under high volume manufacturing conditions
Paper 7973-30
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An aberration control of projection optics for multi-patterning lithography
Paper 7973-31
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Session 9:
Computational Lithography
Wednesday 2 March 2011
2:20 PM - 3:00 PM
Location: Conv. Ctr. Ballroom A2
Fine calibration of physical resist models: the importance of Jones pupil, laser bandwidth, mask error and CD metrology for accurate modeling at advanced lithographic nodes
Paper 7973-32
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Criteria of photomask line-edge roughness for computational lithography and EUV lithography
Paper 7973-33
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Session 10:
Innovative Lithography Process Control: Joint Session with Conference 7971
Wednesday 2 March 2011
3:30 PM - 5:30 PM
Location: Conv. Ctr. Ballroom A2
Stability and calibration of overlay and focus control for a double patterning immersion scanner
Paper 7973-34
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Advanced CDU improvement for 22nm and below
Paper 7973-35
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Combined overlay, focus and CD metrology for leading edge lithography
Paper 7973-36
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Correcting image placement errors using registration control (RegC) technology
Paper 7973-37
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Session PS:
Posters-Wednesday
Wednesday 2 March 2011
6:00 PM - 8:00 PM
Location: Conv. Ctr. Exhibit Hall 2

The following posters will be on display after 10:00 am on Wednesday. The interactive poster session with authors in attendance will be Wednesday evening from 6:00 to 8:00 pm.
Session PS1:
Computational Lithography
Wednesday 2 March 2011
6:00 PM - 8:00 PM
Location: Conv. Ctr. Exhibit Hall 2
Hotspot fixing using ILT
Paper 7973-56
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Fast algorithm for quadratic aberration model based on cross triple correlation
Paper 7973-57
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Choosing objective functions for inverse lithography patterning
Paper 7973-58
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Physical conversion of Stokes parameters which are multiplied by a general Mueller matrix into Jones vectors applicable to the lithographic calculation
Paper 7973-59
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Session PS2:
Double Patterning
Wednesday 2 March 2011
6:00 PM - 8:00 PM
Location: Conv. Ctr. Exhibit Hall 2
Self-aligned triple patterning for continuous IC scaling to half-pitch 15nm
Paper 7973-60
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Sidewall spacer quadruple patterning for 15nm half-pitch
Paper 7973-61
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Spacer defined double patterning for (sub-)20nm half pitch single damascene structures
Paper 7973-62
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Recessive self-aligned double patterning with gap-fill technology
Paper 7973-63
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Spatial frequency multiplication techniques towards half-pitch 10nm patterning
Paper 7973-64
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Session PS3:
FreeForm and SMO
Wednesday 2 March 2011
6:00 PM - 8:00 PM
Location: Conv. Ctr. Exhibit Hall 2
Influence of the illumination source on model-based SRAF placement
Paper 7973-65
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Comparison of clear-field and dark-field images with optimized masks
Paper 7973-66
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Custom source and mask optimization for 20nm SRAM and logic
Paper 7973-67
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Improvement of lithography process by using a FlexRay illuminator for memory applications
Paper 7973-69
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Quantification of the difference between two sources by Zernike polynomial decomposition
Paper 7973-70
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A simple method of source optimization for advanced NAND FLASH process
Paper 7973-71
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Gradient-based fast source mask optimization (SMO)
Paper 7973-72
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Beam shaping: top hat and customized intensity distributions for semiconductor manufacturing and inspection
Paper 7973-73
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Source and mask optimization applications in manufacturing
Paper 7973-74
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Hierarchical kernel generation for SMO application
Paper 7973-75
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Aberration-aware source and mask optimization to enhance the optical lithography performance
(Canceled)
Paper 7973-76
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Session PS4:
Laser
Wednesday 2 March 2011
6:00 PM - 8:00 PM
Location: Conv. Ctr. Exhibit Hall 2
Multiphoton micro/nanolithography technique with femtosecond laser direct-writing processing
Paper 7973-77
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High-range laser light bandwidth measurement and tuning
Paper 7973-78
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DUV light source availability improvement via further enhancement of gas management technologies
Paper 7973-79
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Session PS5:
Scanner-Lithography Optimization
Wednesday 2 March 2011
6:00 PM - 8:00 PM
Location: Conv. Ctr. Exhibit Hall 2
Focus drilling for increased process latitude in high-NA immersion lithography
Paper 7973-80
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Compensation of mask induced aberrations by projector wavefront control
Paper 7973-81
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Advanced scanner matching using freeform source and lens manipulators
Paper 7973-82
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Measurement of wavefront distortions in DUV optics due to lens heating
Paper 7973-83
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Improved immersion scanning speed using superhydrophobic surfaces
Paper 7973-84
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New 0.75 NA ArF scanning lithographic tool
Paper 7973-85
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Simulation-based scanner tuning using FlexRay capability and scatterometry
Paper 7973-111
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Session PS6:
Mask/Wafer Topography, Layout, and OPC
Wednesday 2 March 2011
6:00 PM - 8:00 PM
Location: Conv. Ctr. Exhibit Hall 2
Investigating the performance of directional boundary layer model through staged modeling method
Paper 7973-87
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Large scale model of wafer topography effects
Paper 7973-88
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Study of model-assisted rule base SRAF for random contact
Paper 7973-89
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Physical simulation for verification and OPC on full chip level
Paper 7973-90
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Mask data correction methodology in the context of model-based fracturing and advanced mask models
Paper 7973-91
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Optimizing OPC data sampling based on "orthogonal vector space"
Paper 7973-92
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Effect of pattern-image log slope on OPC model
Paper 7973-93
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Tolerance-based OPC and solution to MRC-constrained OPC
Paper 7973-94
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Study of various RET for process margin improvement in 3Xnm DRAM contact
Paper 7973-95
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A cost-driven fracture heuristics to minimize external sliver length
Paper 7973-96
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A recursive cost-based approach to fracturing
Paper 7973-97
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A novel mask error modeling approach for OPC
Paper 7973-98
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Full-chip OPC and verification with a fast mask 3D model
Paper 7973-99
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Overcome the process limitation by using inverse lithography technology with assist feature
Paper 7973-100
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Improvement on post-OPC verification efficiency for contact/via coverage check by final CD biasing of metal lines and considering their location on the metal layout
Paper 7973-101
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Measurement of local pellicle thinning and line-width variation with different pellicle thicknesses
Paper 7973-102
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Session PS7:
Modeling
Wednesday 2 March 2011
6:00 PM - 8:00 PM
Location: Conv. Ctr. Exhibit Hall 2
Performance of a bilinear photoresist model
Paper 7973-103
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Application of an inverse Mack model for negative tone development simulation
Paper 7973-104
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A study of quantum lithography for diffraction limit
Paper 7973-105
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Evaluating the performance of DP and EUVL by using analytical equations for resolution of optical lithography with considering required DOF
Paper 7973-106
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Session PS8:
Tool and Process Control
Wednesday 2 March 2011
6:00 PM - 8:00 PM
Location: Conv. Ctr. Exhibit Hall 2
Lithography process control using focus and dose optimisation technique
Paper 7973-108
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Feasibility study on the mask compensation of gate CD non-uniformity caused by etching process
Paper 7973-110
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Study of air-bubble-induced defect in 193-nm immersion lithography
(Canceled)
Paper 7973-112
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Thursday 3 March Show All Abstracts
Session 11:
Mask and Layout Optimization
Thursday 3 March 2011
8:00 AM - 10:00 AM
Location: Conv. Ctr. Ballroom A2
Ground rule considerations for the 20-nm logic node
Paper 7973-38
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Optical lithography applied to 20-nm CMOS Logic and SRAM
Paper 7973-39
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3D lithography modeling for ground rule development
Paper 7973-40
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Mask enhancer technology with source mask optimization (SMO) for 2Xnm-node logic layout gate fabrication
Paper 7973-41
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Evaluation of a new model of mask topography effects
Paper 7973-42
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High-performance intensity slope correction method for global process variability band improvement and printability enhancement in RET applications
Paper 7973-43
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Session 12:
Optical/DFM: Joint Session with Conference 7974
Thursday 3 March 2011
10:30 AM - 12:10 PM
Location: Conv. Ctr. Ballroom A2
Contact patterning strategies for 32nm and 28nm technology
Paper 7973-44
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Best Student Paper Award
Thursday 3 March 2011
1:10 PM - 1:20 PM
Location: Conv. Ctr. Ballroom A2

This Award was generously sponsored by

Session 13:
Source and Mask Optimization II
Thursday 3 March 2011
1:20 PM - 3:00 PM
Location: Conv. Ctr. Ballroom A2
Polarization holograms for source-mask optimization
Paper 7973-45
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Extending SMO into the lens pupil domain
Paper 7973-46
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Enhancing fullchip ILT mask synthesis capability for IC manufacturability
Paper 7973-47
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A numerical continuation approach to inverse lithography
(Canceled)
Paper 7973-48
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A study of source mask optimization for logic device through experiment and simulations
Paper 7973-49
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Session 14:
Tools
Thursday 3 March 2011
3:30 PM - 5:30 PM
Location: Conv. Ctr. Ballroom A2
Practical performance and enabling technologies in immersion scanners for the double patterning generation
Paper 7973-50
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Advanced wavefront engineering for improved imaging and overlay applications on a 1.35 NA immersion scanner
Paper 7973-51
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Pupilgram adjusting scheme using intelligent illuminator for ArF immersion exposure tool
Paper 7973-52
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Scanner matching for standard and freeform illumination shapes using FlexRay
Paper 7973-53
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Light source technology advances to enable high-volume manufacturing for ArF immersion double patterning
Paper 7973-54
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Ecology and high-durability injection locked laser with flexible power for double-patterning ArF immersion lithography
Paper 7973-55
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