San Jose Convention Center
San Jose, California, United States
23 - 27 February 2020
Conference 11325
Metrology, Inspection, and Process Control for Microlithography XXXIV
Monday - Thursday 24 - 27 February 2020
Conference
Committee
show | hide
Conference Chair
Conference Co-Chair
Program Committee
Program Committee continued...
Additional Conference
Information


Conference Chair
Ofer Adan
Applied Materials.



Conference Co-Chair
John Robinson
KLA Corp.
Monday 24 February Show All Abstracts
AL20 Plenary Session
Monday 24 February 2020
8:00 AM - 10:00 AM
Location: Convention Center, Grand Ballroom 220A

8:00 am to 8:30 am

Welcome and Announcements
Symposium Chairs: Will Conley, Cymer, An ASML Company (USA), and Kafai Lai, IBM T. J. Watson Research Ctr. (USA)

    *Introduction of New SPIE Fellows
    *Presentation of the Zernike Awards
    *Presentation of the Nick Cobb Memorial Scholarship
High performance mapping for deep learning applications (Plenary Presentation)
Paper 11323-502
Time: 8:30 AM - 9:10 AM
Author(s):
Show Abstract
In-memory computing for AI applications (Plenary Presentation)
Paper 11323-500
Time: 9:10 AM - 9:50 AM
Author(s): Evangelos Eleftheriou, IBM Research - Zürich (Switzerland)
Show Abstract
Process technologies leading a future of semiconductor memory (KIOKU) devices (Plenary Presentation)
Paper 11323-501
Time: 9:50 AM - 10:30 AM
Author(s): Koji Hashimoto, kioxia Corporation (Japan)
Show Abstract
Coffee Break 10:30 AM - 10:50 AM
Opening Remarks and Award Announcements
Monday 24 February 2020
10:50 AM - 11:10 AM
Location: Convention Center, Grand Ballroom 220B
Session Chairs:
Ofer Adan, Applied Materials Israel, Ltd. (Israel) ;
John C. Robinson, KLA Corp. (United States)

Presentation of the 2019 Diana Nyyssonen Best Paper Award in Metrology

Award Sponsored by


Session 1:
Keynote Session
Monday 24 February 2020
11:10 AM - 12:30 PM
Location: Convention Center, Grand Ballroom 220B
Session Chairs:
Ofer Adan, Applied Materials Israel, Ltd. (Israel) ;
John C. Robinson, KLA Corp. (United States)
Metrology for advanced transistor and memristor devices and materials (Keynote Presentation)
Paper 11325-1
Time: 11:10 AM - 11:50 AM
Author(s): Alain C. Diebold, Nathaniel C. Cady, SUNY Polytechnic Institute (United States)
Show Abstract
Metrology requirements driven by memory scaling (Keynote Presentation)
Paper 11325-100
Time: 11:50 AM - 12:30 PM
Author(s): Cornel Bozdog, Micron Technology, Inc. (United States)
Show Abstract
Lunch Break 12:30 PM - 1:30 PM
Session 2:
Pattern Placement and Overlay Metrology I
Monday 24 February 2020
1:30 PM - 3:30 PM
Location: Convention Center, Grand Ballroom 220B
Session Chairs:
Alexander Starikov, I&I Consulting (United States) ;
Jason P. Cain, Advanced Micro Devices, Inc. (United States)
Computational phase imaging technique for the wafer inspection
Paper 11325-101
Time: 1:30 PM - 1:50 PM
Author(s): Seung Beom Park, Jaehyeon Son, Kyungwon Yun, Taewan Kim, Myungjun Lee, SAMSUNG Electronics Co., Ltd. (Korea, Republic of)
Show Abstract
Contour based metrology: “make measurable what is not so”
Paper 11325-3
Time: 1:50 PM - 2:10 PM
Author(s): Bertrand Le-Gratiet, Regis Bouyssou, Julien Ducote, Christophe Dezauzier, Alain Ostrovsky, Charlotte Beylier, Christian Gardin, STMicroelectronics S.A. (France); Nivea G. Schuch, Paolo Petroni, Loïc Schneider, Matthieu Millequant, Patrick Schiavone, ASELTA Nanographics (France)
Show Abstract
Understanding advanced DRAM edge placement error budget and opportunities for control
Paper 11325-4
Time: 2:10 PM - 2:30 PM
Author(s): Jaeseung Jeong, Jinho Lee, Jinsun Kim, Sunyoung Yea, Chan Hwang, Seung Yoon Lee, Jeongjin Lee, Joon-Soo Park, SAMSUNG Electronics Co., Ltd. (Korea, Republic of); Peter Nikolsky, ASML Netherlands B.V. (Netherlands); Daniel Park, ASML Netherlands B.V. (Korea, Republic of); Antonio Corradi, Hyun-Woo Yu, Sun Wook Jung, Denis Ovchinnikov, Vadim Timoshkov, Isabel de la Fuente Valentin, Yuxiang Yin, Kaustubh Padhye, Wim Tel, Harm Dillen, Koen Thuijs, Daan Slotboom, ASML Netherlands B.V. (Netherlands); Miao Wang, Rhys Su, Marc Kea, ASML Netherlands B.V. (United States); Jin-Woo Lee, Yun-A Sung, Sang-Uk Kim, Young-Hoon Song, Oh-Sung Kwon, ASML Netherlands B.V. (Korea, Republic of); James Lee, ASML Korea Co., Ltd. (Korea, Republic of)
Show Abstract
Real-time full-wafer design-based interlayer virtual metrology
Paper 11325-5
Time: 2:30 PM - 2:50 PM
Author(s): John L. Sturtevant, Lianghong Yin, Shumay Shang, Kostas Adam, Mentor, a Siemens Business (United States); Young-Chang Kim, Mentor Graphics Korea Co. Inc. (United States); Marko Chew, Abhinandan Nath, Mentor, a Siemens Business (United States); Alberto López Gómez, Boris Habets, Qoniac GmbH (Germany)
Show Abstract
Optical scribe target vs. on device overlay bias accuracy validation
Paper 11325-106
Time: 2:50 PM - 3:10 PM
Author(s): Yaniv Abramovitz, Applied Materials Israel, Ltd. (Israel)
Show Abstract
Application of high throughput contour based edge placement error metrology in leading edge DRAM process development
Paper 11325-107
Time: 3:10 PM - 3:30 PM
Author(s): Sudharshanan Raghunathan, Teng Wang, Lingling Pu, Stefan Hunsche, ASML US, Inc. (United States); Daniel Park, Jaden Song, ASML Korea Co., Ltd. (Korea, Republic of); Jung-chan Kim, Sun-keun Ji, Sang-woo Kim, Gyun Yoo, Cheol-Kyun Kim, Chan-ha Park, SK Hynix, Inc. (Korea, Republic of)
Show Abstract
Coffee Break 3:30 PM - 3:50 PM
Session 3:
Challenges and New Methods
Monday 24 February 2020
3:50 PM - 5:30 PM
Location: Convention Center, Grand Ballroom 220B
Session Chairs:
Shunsuke Koshihara, Hitachi High-Technologies Corp. (Japan) ;
Christopher J. Raymond, Nanometrics Inc. (United States)
Atom probe tomography using Extreme-Ultraviolet Light
Paper 11325-6
Time: 3:50 PM - 4:10 PM
Author(s): Luis Miaja Avila, Ann Chiaramonti, Benjamin Caplins, National Institute of Standards and Technology (United States); David Diercks, Brian Gorman, Colorado School of Mines (United States); Norman Sanford, National Institute of Standards and Technology (United States)
Show Abstract
VIA Dishing Metrology for Novel 3D NAND Using Neural Network Assisted White Light Interferometry
Paper 11325-7
Time: 4:10 PM - 4:30 PM
Author(s): Si-Cong Wang, Xiao-Ye Ding, Yi Zhou, Yangtze Memory Technologies Co., Ltd. (China); Chi Chen, Le Yang, Yan-Zhong Ma, Skyverse Ltd. (China)
Show Abstract
High resolution acoustic metrology by combining high GHZ frequency ultrasound and scanning probe microscopy
Paper 11325-8
Time: 4:30 PM - 4:50 PM
Author(s): Maarten H. van Es, Paul L.M.J. van Neer, Benoit A. I. Quesson, Daniele Piras, Laurent Fillinger, Abbas Mohtashami, Rob Willekers, TNO (Netherlands)
Show Abstract
Inline Part Average Testing (I-PAT) for automotive die reliability
Paper 11325-9
Time: 4:50 PM - 5:10 PM
Author(s): John C. Robinson, David W. Price, KLA Corp. (United States)
Show Abstract
E-TEST validation of EPE budget and metrology
Paper 11325-10
Time: 5:10 PM - 5:30 PM
Author(s): Etienne De Poortere, ASML Belgium (Belgium); Guillaume Schelcher, imec (Belgium); Nicola Kissoon, ASML Belgium (Belgium); Sara Paolillo, imec (Belgium); Cyrus Tabery, ASML US, Inc. (United States); Sandip Halder, Philippe Leray, imec (Belgium); Jan Mulkens, Moyra McManus, ASML Netherlands B.V. (Netherlands)
Show Abstract
Tuesday 25 February Show All Abstracts
Session 4:
Inspection and Mass Metrology
Tuesday 25 February 2020
8:40 AM - 10:00 AM
Location: Convention Center, Grand Ballroom 220B
Session Chairs:
Timothy Crimmins, Intel Corp. (United States) ;
Byoung-Ho Lee, SK Hynix, Inc. (Korea, Republic of)
Multi-beam Inspection (MBI) development progress and applications
Paper 11325-11
Time: 8:40 AM - 9:00 AM
Author(s): Eric Long Ma, Weiming Ren, Xinan Luo, Xuerang Hu, Xuedong Liu, Chiyan Kuan, Kevin Chou, Martijn Maassen, Weihua Yin, Aiden Chen, Niladri Sen, Martin Ebert, Lei Liu, Fei Wang, Oliver D. Patterson, Hermes-Microvision Inc., USA (United States)
Show Abstract
Quantitative inspection
(Canceled)
Paper 11325-12
Time: 9:00 AM - 9:20 AM
Author(s):
Show Abstract
Novel post-lithography macro inspection strategies for advanced legacy fabs challenges
Paper 11325-13
Time: 9:20 AM - 9:40 AM
Author(s): Annalisa Bordogna, STMicroelectronics SRL (Italy); Simona Seminato, STMicroelectronics (Italy); Andrea Corno, Alberto Beccalli, Lavinia Motta, STMicroelectronics SRL (Italy); Giovanna Pistone, STMicroelectronics (Italy); Francesco Ferrario, Paolo Piacentini, STMicroelectronics SRL (Italy); Bernardo Micali, STMicroelectronics (Italy); Parikshit Sharma, Loemba Bouckou, Paolo Parisi, Thomas Groos, KLA Corp. (United States)
Show Abstract
Massive metrology of 2D logic patterns on BEOL EUVL
Paper 11325-14
Time: 9:40 AM - 10:00 AM
Author(s): Sayantan Das, imec (Belgium); Seul-Ki Kang, NGR Inc. (Japan); Sandip Halder, imec (Belgium); Kotaro Maruyama, NGR Inc. (Japan); Philippe Leray, imec (Belgium); Yuichiro Yamazaki, NGR Inc. (Japan)
Show Abstract
Coffee Break 10:00 AM - 10:30 AM
Session 5:
High Aspect Ratio Metrology
Tuesday 25 February 2020
10:30 AM - 12:10 PM
Location: Convention Center, Grand Ballroom 220B
Session Chairs:
Richard M. Silver, National Institute of Standards and Technology (United States) ;
Hugo Cramer, ASML Netherlands B.V. (Netherlands)
Determination of deep hole structure for advanced semiconductor devices analyzed by transmission X-ray scattering
Paper 11325-15
Time: 10:30 AM - 10:50 AM
Author(s): Kazuhiko Omote, Yoshiyasu Ito, Goto Takumi, Rigaku Corp. (Japan)
Show Abstract
3D-NAND wafer process monitoring using high voltage SEM with auto e-Beam tilt technology
Paper 11325-16
Time: 10:50 AM - 11:10 AM
Author(s): Leeming Tu, Jian Mi, Henry Fan, Haydn Zhou, Felix Xiong, Louis Tu, Yangtze Memory Technologies Co., Ltd. (China); Gangyi Chen, Hitachi High-Technologies (Shanghai) Co., Ltd. (China); Chuanyu Shao, Long Zhang, Shinji Kubo, Hitachi High-Technologies Corp. (Japan)
Show Abstract
3D analysis of high-aspect ratio features in 3D-NAND
Paper 11325-17
Time: 11:10 AM - 11:30 AM
Author(s): Jens-Timo Neumann, Dmitry Klochkov, Thomas Korb, Carl Zeiss SMT GmbH (Germany); Sheetal B. Gupta, Carl Zeiss India (Bangalore) Pvt. Ltd. (India); Amir Avishai, Ramani Pichumani, Keum Sil Lee, Alex Buxbaum, Carl Zeiss X-Ray Microscopy, Inc. (United States); Eugen Foca, Carl Zeiss SMT GmbH (Germany)
Show Abstract
Accuracy improvement of 3D-profiling for HAR features using deep learning
Paper 11325-18
Time: 11:30 AM - 11:50 AM
Author(s): Wei Sun, Pushe Zhao, Hitachi, Ltd. (Japan); Yasunori Goto, Takuma Yamamoto, Taku Ninomiya, Hitachi High-Technologies Corp. (Japan)
Show Abstract
Machine learning and hybrid metrology using HV-SEM and optical methods to monitor channel hole tilting in-line for 3D NAND wafer production
Paper 11325-19
Time: 11:50 AM - 12:10 PM
Author(s): Michael Meng, Leeming Tu, Jian Mi, Haydn Zhou, Yangtze Memory Technologies Co., Ltd. (China); Xi Zou, Nanometrics Inc. (United States)
Show Abstract
Lunch Break 12:10 PM - 1:20 PM
Session 6:
Roughness Metrology
Tuesday 25 February 2020
1:20 PM - 3:00 PM
Location: Convention Center, Grand Ballroom 220B
Session Chairs:
Xiaomeng Chen, Taiwan Semiconductor Manufacturing Co. Ltd. (Taiwan) ;
Masafumi Asano, Tokyo Electron Ltd. (Japan)
Comparing algorithms for edge detection and their impact on unbiased roughness measurement precision and accuracy
Paper 11325-20
Time: 1:20 PM - 1:40 PM
Author(s): Chris A. Mack, Fractilia, LLC (United States)
Show Abstract
Comparison of SEM and AFM performances for LER reference metrology
Paper 11325-21
Time: 1:40 PM - 2:00 PM
Author(s): Ryosuke Kizu, Ichiko Misumi, Akiko Hirai, Satoshi Gonda, National Institute of Advanced Industrial Science and Technology (Japan)
Show Abstract
Reference metrology using 3D-PSD of post-etch LWR
Paper 11325-22
Time: 2:00 PM - 2:20 PM
Author(s): Kiyoshi Takamasu, Satoru Takahashi, The Univ. of Tokyo (Japan); Hiroki Kawada, Masami Ikota, Hitachi High-Technologies Corp. (Japan)
Show Abstract
Line top loss and top roughness characterizations of EUV resists
Paper 11325-23
Time: 2:20 PM - 2:40 PM
Author(s): Daniel Schmidt, Karen Petrillo, Mary A. Breton, Jennifer Fullam, IBM Thomas J. Watson Research Ctr. (United States); Sean Hand, Jason Osborne, Weijie Wang, David Fey, Bruker Nano Inc. (United States)
Show Abstract
Characterization of defects in line/space patterns
Paper 11325-105
Time: 2:40 PM - 3:00 PM
Author(s): Vassilios Constantoudis, NCSR Demokritos (Greece), Nanometrisis P.C. (Greece); Bradley Williams, MOXTEK, Inc. (United States); Nikolaos Kehagias, Institut Català de Nanociència i Nanotecnologia (Spain); George Papavieros, NCSR Demokritos (Greece), Nanometrisis P.C. (Greece); Clivia M. Sotomoyor Torres, Institut Català de Nanociència i Nanotecnologia (Spain), 6ICREA, Institució Catalana de Recerca i Estudis Avançats (Spain); Evangelos Gogolides, NCSR Demokritos (Greece), Nanometrisis P.C. (Greece)
Show Abstract
Coffee Break 3:00 PM - 3:30 PM
Session 7:
New Methods: Student Session
Tuesday 25 February 2020
3:30 PM - 5:10 PM
Location: Convention Center, Grand Ballroom 220B
Session Chairs:
Alexander Starikov, I&I Consulting (United States) ;
Benjamin D. Bunday, Abeam Technologies, Inc. (United States)
White-light Mueller-matrix Fourier scatterometry for the characterization of nanostructures with large parameter spaces
Paper 11325-24
Time: 3:30 PM - 3:50 PM
Author(s): Maria Laura Gödecke, Karsten Frenner, Wolfgang Osten, Univ. Stuttgart (Germany)
Show Abstract
Metrology of Nanowire/ Nanosheet FETs for advanced technology nodes
Paper 11325-25
Time: 3:50 PM - 4:10 PM
Author(s): Madhulika S. Korde, SUNY Polytechnic Institute (United States); Joseph Kline, Daniel F. Sunday, National Institute of Standards and Technology (United States); Nick Keller, Nanometrics Inc. (United States); Subhadeep Kal, Cheryl Alix, Aelan Mosden, TEL Technology Ctr., America, LLC (United States); Alain C. Diebold, SUNY Polytechnic Institute (United States)
Show Abstract
Nanoscale grating characterization through EUV spectroscopy aided by machine learning techniques
Paper 11325-26
Time: 4:10 PM - 4:30 PM
Author(s): Lukas Bahrenberg, Sven Glabisch, Serhiy Danylyuk, Moein Ghafoori, Sascha Brose, RWTH Aachen Univ. (Germany); Jochen Stollenwerk, Peter Loosen, Fraunhofer-Institut für Lasertechnik ILT (Germany)
Show Abstract
Plasma halogenated amorphous carbon as growth inhibiting layer for area-selective deposition of titanium oxide
Paper 11325-27
Time: 4:30 PM - 4:50 PM
Author(s): Mikhail Krishtab, KU Leuven (Belgium), imec (Belgium); Rob Ameloot, KU Leuven (Belgium); Silvia Armini, imec (Belgium); Joey Hung, Nova Measuring Instruments Inc. (United States); Roy Koret, Igor Turovets, Nova Measuring Instruments Ltd. (Israel); Kavita Shah, Srinivasan Rangarajan, Laxmi Warad, Vanessa Zhang, Nova Measuring Instruments Inc. (United States)
Show Abstract
Understanding the influence of 3D sidewall roughness on observed line-edge roughness in scanning electron microscopy images
Paper 11325-28
Time: 4:50 PM - 5:10 PM
Author(s): Luc Van Kessel, Technische Univ. Delft (Netherlands); Thomas Huisman, ASML (Netherlands); Cornelis Hagen, Technische Univ. Delft (Netherlands)
Show Abstract
Wednesday 26 February Show All Abstracts
Session 8:
3D Profile and Shape Analysis
Wednesday 26 February 2020
8:00 AM - 10:00 AM
Location: Convention Center, Grand Ballroom 220B
Session Chairs:
John A. Allgair, BRIDG (United States) ;
Benjamin D. Bunday, Abeam Technologies, Inc. (United States)
Looking inside buried 3D silicon structures by X-ray tomography
(Canceled)
Paper 11325-29
Time: 8:00 AM - 8:20 AM
Author(s): Diana A. Grishina, Cornelis Harteveld, Univ. of Twente (Netherlands); Alexandra Pacureanu, Peter Cloetens, European Synchrotron Radiation Facility (France); Ad Lagendijk, Willem Vos, Univ. of Twente (Netherlands)
Show Abstract
Three-dimensional feature characterization by inline Xe plasma FIB: delayering and deep milling implementation
Paper 11325-30
Time: 8:20 AM - 8:40 AM
Author(s): Franz Niedermeier, Agnes Fros, Max Boeckl, Wolfgang Kipferl, Michaela Braun, Albert Birner, Infineon Technologies AG (Germany); Thomas Schubert, Allen Lee, Applied Materials, Inc. (United States); Haim Pearl, Applied Materials Inc (United States)
Show Abstract
Immediate observation of embedded structure after top-down delayering by using “Dig and See” technology for GFIS-SIM based accurate overlay metrology
Paper 11325-31
Time: 8:40 AM - 9:00 AM
Author(s): Shinichi Matsubara, Hiroyasu Shichi, Tomihiro Hashizume, Hitachi, Ltd. (Japan); Masami Ikota, Hitachi High-Technologies Corp. (Japan)
Show Abstract
AFM characterization for GAA devices
Paper 11325-32
Time: 9:00 AM - 9:20 AM
Author(s): Mary A. Breton, Jennifer Fullam, Lan Yu, Dexin Kong, Daniel Schmidt, Andrew Greene, Liying Jiang, IBM Thomas J. Watson Research Ctr. (United States); Sean Hand, Jason Osborne, Bruker Nano Inc. (United States)
Show Abstract
3D shape evaluation by AFM integrated on Wafer-SEM platform with high precision XY navigation stage
Paper 11325-33
Time: 9:20 AM - 9:40 AM
Author(s): Toru Ikegami, Hitachi High-Technologies Corp. (Japan); Kazuhisa Hasumi, Masakazu Kanezawa, Hitachi High-Tech Science Corp. (Japan); Kenichi Nishigata, Hajime Shimada, Ritsuo Fukaya, Hitachi High-Technologies Corp. (Japan); Andrew D. L. Humphris, Lei Feng, Matthew Tedaldi, Lawrence Mudarikwa, David Ockwell, Jenny Goulden, Infinitesima Ltd. (United Kingdom)
Show Abstract
A hybrid total measurement uncertainty methodology for dual beam FIB/SEM metrology
Paper 11325-34
Time: 9:40 AM - 10:00 AM
Author(s): Ardavan Zandiatashbar, Chester Chien, Western Digital Corp. (United States)
Show Abstract
Coffee Break 10:00 AM - 10:30 AM
Session 9:
Scatterometry
Wednesday 26 February 2020
10:30 AM - 12:10 PM
Location: Convention Center, Grand Ballroom 220B
Session Chairs:
Phillipe Leray, imec (Belgium) ;
Christopher J. Raymond, Nanometrics Inc. (United States)
EUV scatterometer with multiple orders of high-harmonic generation
Paper 11325-35
Time: 10:30 AM - 10:50 AM
Author(s): Yi-Sha Ku, Yi-Chang Chen, Chia-Liang Yeh, Chun-Wei Lo, Industrial Technology Research Institute (Taiwan)
Show Abstract
Ruthenium direct etch scatterometry solution for self-aligning semi-damascene
Paper 11325-36
Time: 10:50 AM - 11:10 AM
Author(s): Sara Paolillo, Alain Moussa, Gayle Murdoch, Frederic Lazzarino, Anne-Laure Charley, Philippe Leray, imec (Belgium); Roy Koret, Nova Measuring Instruments Ltd. (Israel); Joey Hung, Nova Measuring Instruments Ltd. (Germany); Igor Turovets, Shay Wolfling, Avron Ger, Nova Measuring Instruments Ltd. (Israel)
Show Abstract
Critical-dimension grazing-incidence small angle X-Ray scattering: applications and development
Paper 11325-37
Time: 11:10 AM - 11:30 AM
Author(s): Guillaume Freychet, Brookhaven National Lab. (United States); Dinesh Kumar, Lawrence Berkeley National Lab. (United States); Isvar A. Cordova, The Ctr. for X-Ray Optics (United States); Ron J. Pandolfi, Advanced Light Source (United States); Patrick P. Naulleau, The Ctr. for X-Ray Optics (United States); Cheng Wang, Alex Hexemer, Lawrence Berkeley National Lab. (United States)
Show Abstract
Recent progress in nanostructure metrology by tomographic Mueller-matrix scatterometry
Paper 11325-38
Time: 11:30 AM - 11:50 AM
Author(s): Xiuguo Chen, Shiyuan Liu, Huazhong Univ. of Science and Technology (China)
Show Abstract
Sensitivity analysis for the detection of pitchwalk in self-aligned quadruple patterning by GISAXS
Paper 11325-39
Time: 11:50 AM - 12:10 PM
Author(s): Maren Casfor Zapata, Nando Farchmin, Mika Pflüger, Victor Soltwisch, Sebastian Heidenreich, Konstantin Nikolaev, Christian Laubis, Michael Kolbe, Markus Bär, Frank Scholze, Physikalisch-Technische Bundesanstalt (Germany)
Show Abstract
Lunch Break 12:10 PM - 1:40 PM
Session 10:
Machine Learning
Wednesday 26 February 2020
1:40 PM - 3:00 PM
Location: Convention Center, Grand Ballroom 220B
Session Chairs:
Narender Rana, Western Digital Corp. (United States) ;
Masafumi Asano, Tokyo Electron Ltd. (Japan)
Contrasting conventional and machine learning approaches to optical critical dimension measurements
Paper 11325-40
Time: 1:40 PM - 2:00 PM
Author(s): Bryan M. Barnes, Mark-Alexander Henn, National Institute of Standards and Technology (United States)
Show Abstract
Prediction of stochastic edge placement error with deep learning neural network
(Canceled)
Paper 11325-41
Time: 2:00 PM - 2:20 PM
Author(s):
Show Abstract
Advanced machine learning eco-system to address HVM optical metrology requirements
Paper 11325-42
Time: 2:20 PM - 2:40 PM
Author(s): Padraig R. Timoney, Roma Luthra, Alex Elia, GLOBALFOUNDRIES Inc. (United States); Haibo Liu, Paul K. Isbester, Avi Levy, Nova Measuring Instruments Inc. (United States); Michael Shifrin, Barak Bringoltz, Ariel Broitman, Eitan Rothstein, Nova Measuring Instruments Ltd. (Israel)
Show Abstract
Measuring local CD uniformity in EUV vias with scatterometry and machine learning
Paper 11325-43
Time: 2:40 PM - 3:00 PM
Author(s): Dexin Kong, Daniel Schmidt, Jennifer Church, Chi-Chun Liu, Mary A. Breton, Cody Murray, Luciana Meli, Liying Jiang, John Sporre, Nelson Felix, Ishtiaq Ahsan, IBM Thomas J. Watson Research Ctr. (United States); Aron J. Cepler, Marjorie Cheng, Nova Measuring Instruments Inc. (United States); Roy Koret, Igor Turovets, Nova Measuring Instruments Ltd. (Israel)
Show Abstract
Coffee Break 3:00 PM - 3:30 PM
Session 11:
Pattern Placement and Overlay Metrology II
Wednesday 26 February 2020
3:30 PM - 5:30 PM
Location: Convention Center, Grand Ballroom 220B
Session Chairs:
Hugo Cramer, ASML Netherlands B.V. (Netherlands) ;
Richard M. Silver, National Institute of Standards and Technology (United States)
Taking the multi-wavelength DBO to the next level of accuracy, robustness and speed
Paper 11325-44
Time: 3:30 PM - 3:50 PM
Author(s): Chan Hwang, SAMSUNG Electronics Co., Ltd. (Korea, Republic of); Kaustuve Bhattacharyya, ASML Netherlands B.V. (Netherlands)
Show Abstract
Run to run and model variability of overlay high order process corrections for mean intrafield signatures
Paper 11325-45
Time: 3:50 PM - 4:10 PM
Author(s): Benjamin Duclaux, Maxime Gatefait, Olivier Mermet, Jean-Damien Chapon, STMicroelectronics S.A. (France)
Show Abstract
Stitched overlay evaluation and improvement for large field applications
Paper 11325-46
Time: 4:10 PM - 4:30 PM
Author(s): Michael J. May, CEA-LETI (France); Blandine Minghetti, ASML Malta (France); Jérome Depre, ASML France S.a.r.l. (France); Pui L. Lam, ASML Netherlands B.V. (Netherlands); Céline Lapeyre, CEA-LETI-DOPT (France); Joungchel Lee, ASML Netherlands B.V. (Netherlands); Yoann Blancquaert, CEA-LETI (France)
Show Abstract
Monitoring and characterization of post etch overlay performance in relation to post lithography overlay performance (non-zero offset monitoring) in DRAM HVM
(Canceled)
Paper 11325-47
Time: 4:30 PM - 4:50 PM
Author(s):
Show Abstract
Process context based wafer level grouping control: an advanced process correction designed for overlay 1z nm node in high volume manufacturing
Paper 11325-48
Time: 4:50 PM - 5:10 PM
Author(s): Linmiao Zhang, William Susanto, Micron Technology, Inc. (Singapore); Katsumasa Takahashi, Micron Semiconductor Asia Pte. Ltd. (Japan); Albert Chen, ASML San Jose (United States); Yi Zou, ASML US, Inc. (United States); Chenxi Lin, Tim Tang, Simon Hastings, Manouk Rijpstra, Alfonso Sun, ASML San Jose (United States); Samee Ur-Rehman, ASML Netherlands B.V. (Netherlands)
Show Abstract
OPO metrology challenges and solutions in advanced nodes
Paper 11325-49
Time: 5:10 PM - 5:30 PM
Author(s): Yoav Grauer, KLA Corp. (Israel); Andrei V. Shchegrov, KLA Corp. (United States); Philippe Leray, imec (Belgium); Liran Yerushalmi, Efi Megged, KLA Corp. (Israel); Roel Gronheid, KLA Corp. (Belgium)
Show Abstract
Poster Session
Wednesday 26 February 2020
5:30 PM - 7:30 PM
Location: Convention Center, Hall 2

All symposium attendees – You are invited to attend the evening Poster Session to view the high-quality posters and engage the authors in discussion. Enjoy light refreshments while networking with colleagues in your field. Authors may set up their posters between 10:00 am and 5:00 pm the day of their poster session. Attendees are required to wear their conference registration badges to access the poster session.

Posters that are not set up by the 5:00 pm cut-off time will be considered no-shows, and their manuscripts may not be published. Poster authors should accompany their posters from 5:30 to 7:30 pm to answer questions from attendees. All posters and other materials must be removed no later than 7:45 pm. Any posters or materials left behind at the close of the poster session will be considered unwanted and will be discarded. SPIE assumes no responsibility for posters left up after the end of each poster session.
EB metrology of Ge channel gate-all-around FET: buckling evaluation and EB damage assessment
Paper 11325-65
Time: 5:30 PM - 7:30 PM
Author(s): Takeyoshi Ohashi, Hitachi, Ltd. (Japan); Kazuhisa Hasumi, Masami Ikota, Hitachi High-Tech Science Corp. (Japan); Gian F. Lorusso, Liesbeth Witters, Hans Mertens, Naoto Horiguchi, imec (Belgium)
Show Abstract
Automated semiconductor wafer defect classification dealing with imbalanced data
Paper 11325-66
Time: 5:30 PM - 7:30 PM
Author(s): Po-Hsuan Lee, Zhe Wang, Cho Teh, Wei Fang, ASML (United States)
Show Abstract
SEM image quality enhancement: an unsupervised deep learning approach
Paper 11325-67
Time: 5:30 PM - 7:30 PM
Author(s): Liangjiang Yu, Wentian Zhou, Lingling Pu, Wei Fang, ASML (United States)
Show Abstract
Massive metrology for process development and monitoring applications
Paper 11325-68
Time: 5:30 PM - 7:30 PM
Author(s): Kaushik Sah, KLA Corp. (United States); Sayantan Das, imec (Belgium); Shifang Li, KLA Corp. (United States); Christophe Béral, imec (Belgium); Andrew Cross, KLA Corp. (United States); Sandip Halder, imec (Belgium)
Show Abstract
Stochastic model prediction of pattern-failure
Paper 11325-69
Time: 5:30 PM - 7:30 PM
Author(s): John L. Sturtevant, Sophie Jin, Shumay Shang, Lianghong Yin, Kevin Ahi, Mentor, a Siemens Business (United States)
Show Abstract
Enabling accurate and robust optical metrology of in device overlay
Paper 11325-70
Time: 5:30 PM - 7:30 PM
Author(s): Min-Seok Kang, Chan Hwang, Seung Yoon Lee, Jeongjin Lee, Joon-Soo Park, SAMSUNG Electronics Co., Ltd. (Korea, Republic of); Christian Leewis, ASML Netherlands B.V. (Netherlands); Eun-Ji Yang, Do-Haeng Lee, James Lee, ASML Korea Co., Ltd. (Korea, Republic of); Sabil Huda, Noh-Kyoung Park, Anagnostis Tsiatmas, Giulio Bottegal, Amy Wang, Filippo Belletti, Jan Jitse Venselaar, Giacomo Miceli, Izabela Saj, Sam Chen, ASML Netherlands B.V. (Netherlands)
Show Abstract
Contour extraction algorithm for edge placement error measurement using machin learning
Paper 11325-71
Time: 5:30 PM - 7:30 PM
Author(s): Yosuke Okamoto, Shinichi Nakazawa, Akinori Kawamura, Tsugihiko Haga, Taihei Mori, Kotaro Maruyama, Seul-Ki Kang, Yuichiro Yamazaki, NGR Inc. (Japan)
Show Abstract
Color filter and numeric aperture selections for image based overlay measurement in critical recording head manufacturing process
Paper 11325-72
Time: 5:30 PM - 7:30 PM
Author(s): Gavin Mathias, Yi Liu, Seagate Technology LLC (United States); Richard Schuster, KLA Corp. (United States); Aaron Bowser, Seagate Technology LLC (United States)
Show Abstract
Machine learning for modeled-TIS and overlay reduction
Paper 11325-73
Time: 5:30 PM - 7:30 PM
Author(s): Shlomit Katz, Anna Golotsvan, Yoav Grauer, Boaz Ophir, Udi Shusterman, KLA Israel (Israel); Fiona Leung, Pek Beng Ong, Judith Yep, KLA Singapore (Singapore); Alimei Shih, Shi-Ming Wei, Jian Zhang, KLA China (China)
Show Abstract
A study on improving frequency-modulation electric force microscopy using a direct digital synthesizer (DDS)
Paper 11325-74
Time: 5:30 PM - 7:30 PM
Author(s): ChaeHo Shin, Korea Research Institute of Standards and Science (Korea, Republic of)
Show Abstract
Metrology Performance Enhancement using Color Per Layer Technology
Paper 11325-75
Time: 5:30 PM - 7:30 PM
Author(s): Shlomit Katz, Anna Golotsvan, Roie Volkivich, Efi Megged, KLA Israel (Israel); Do-Hwa Lee, Seong Jae Lee, Dongsub Choi, KLA Korea (Korea, Republic of); Honggoo Lee, DongYoung Lee, Jinsoo Kim, Jaesun Woo, Chunsoo Kang, Chan-Ha Park, SK Hynix, Inc. (Korea, Republic of)
Show Abstract
A trainable Die-To-Database for fast e-Beam inspection: learning normal images to detect defects
Paper 11325-76
Time: 5:30 PM - 7:30 PM
Author(s): Masanori Ouchi, Masayoshi Ishikawa, Hitachi, Ltd. (Japan); Shinichi Shinoda, Ryo Yumiba, Yasutaka Toyoda, Hiroyuki Shindo, Masayuki Izawa, Hitachi High-Technologies Corp. (Japan)
Show Abstract
A strengthen Mask r-CNN method for PFA image measurement
Paper 11325-77
Time: 5:30 PM - 7:30 PM
Author(s): Tung-Yu Wu, Chun Yen Liao, Chun-Hung Lin, Kao-Tsai Tsai, Chun-Sheng Wu, Chao-Yi Huang, Winbond Electronics Corp. (Taiwan)
Show Abstract
A novel high throughput probe microscope: for measuring 3D high aspect ratio structures, designed for In-line, integrated or standalone operation
Paper 11325-78
Time: 5:30 PM - 7:30 PM
Author(s): Lei Feng, Andrew D. L. Humphris, Matthew Tedaldi, Lawrence Mudarikwa, David Ockwell, Jenny Goulden, Infinitesima Ltd. (United Kingdom)
Show Abstract
Trench hole inspection of VNAND flash using through-focus scanning optical microscopy (TSOM)
Paper 11325-79
Time: 5:30 PM - 7:30 PM
Author(s): Shin-Woong Park, Hwi Kim, Korea Univ. Sejong Campus (Korea, Republic of); Jun Ho Lee, Kongju National Univ. (Korea, Republic of)
Show Abstract
OPO residuals improvement with imaging metrology for 3D-NAND
Paper 11325-81
Time: 5:30 PM - 7:30 PM
Author(s): Shlomit Katz, Yoav Grauer, Efi Megged, Anna Golotsvan, KLA Israel (Israel); Pek Beng Ong, KLA Singapore (Singapore); Linfei Gao, KLA China (China)
Show Abstract
Photosensitive organic insulator photo-cell monitoring through advanced macro inspection
Paper 11325-82
Time: 5:30 PM - 7:30 PM
Author(s): Andrea Corno, Annalisa Bordogna, Massimiliano Braga, Francesco Ferrario, Umberto Iessi, Paolo Canestrari, STMicroelectronics SRL (Italy); Parikshit Sharma, Matteo Salamone, Paolo Parisi, Thomas Groos, KLA Corp. (United States)
Show Abstract
Enhancing the applications space of diffraction based overlay metrology
Paper 11325-83
Time: 5:30 PM - 7:30 PM
Author(s): Simon Mathijssen, Herman Heijmerikx, Farzad Farhadzadeh, Marc Noot, Lineke van der Sneppen, Longfei Shen, Fei Jia, Rickye Wang, Huajun Qin, Arie Den Boef, Elliott McNamara, Kaustuve Bhattacharyya, ASML Netherlands B.V. (Netherlands); Chao Fang, Zhihu Gao, Yaobin Feng, Yangtze Memory Technologies Co., Ltd. (China)
Show Abstract
Wavelength influence on the determination of subwavelength grating parameters by using optical scatterometry
Paper 11325-84
Time: 5:30 PM - 7:30 PM
Author(s): Lauryna Siaudinyte, Silvania Pereira, Technische Univ. Delft (Netherlands)
Show Abstract
Nano-scale molecular analysis of positive tone photo-resist films with varying dose
Paper 11325-85
Time: 5:30 PM - 7:30 PM
Author(s): Michael J. Eller, California State Univ., Northridge (United States); Mingqi Li, Xisen Hou, DuPont Electronics & Imaging (United States); Stanislav V. Verkhoturov, Emile A. Schweikert, Texas A&M Univ. (United States); Peter Trefonas, DuPont Electronics & Imaging (United States)
Show Abstract
Integrated strategies to enhance predictive power of OPC model
Paper 11325-86
Time: 5:30 PM - 7:30 PM
Author(s): Hong Chen, HC Engineering Consultant (United States)
Show Abstract
Target design for diffraction-based overlay metrology by the multi-objective genetic algorithm
Paper 11325-87
Time: 5:30 PM - 7:30 PM
Author(s): Yating Shi, Kuangyi Li, Xiuguo Chen, Huazhong Univ. of Science and Technology (China); Shiyuan Liu, Huazhong Univ. of Science and Technology (China), Wuhan Eoptics Technology Co., Ltd. (China)
Show Abstract
Particle scattering calculation and analysis for dark field defect detection
Paper 11325-88
Time: 5:30 PM - 7:30 PM
Author(s): Shuang Xu, Cheng Liao, Chao Liu, Jun Chen, Wuhan Univ. of Science and Technology (China)
Show Abstract
Improved device overlay by litho aberration tracking with novel target design for DRAM
Paper 11325-89
Time: 5:30 PM - 7:30 PM
Author(s): Xiaolei Liu, KLA Corp. (China); Eitan Hajaj, Alon Volfman, Hedvi Spielberg, Yoav Grauer, Raviv Yohanan, KLA Corp. (Israel); Xindong Gao, KLA Corp. (China)
Show Abstract
OPO reduction by novel target design
Paper 11325-90
Time: 5:30 PM - 7:30 PM
Author(s): Zephyr Liu, KLA Corp. (China); Eitan Hajaj, Ira Naot, Raviv Yohanan, Yoav Grauer, KLA Israel (Israel)
Show Abstract
Analysis of defect perturbation in EUV mask blank
Paper 11325-91
Time: 5:30 PM - 7:30 PM
Author(s): Lituo Liu, Guannan Li, Weihu Zhou, Institute of Microelectronics, Chinese Academy of Sciences (China); Xiaobin Wu, Academy of Opto-Electronics, Chinese Academy of Sciences (China); Yu Wang, Institute of Microelectronics, Chinese Academy of Sciences (China)
Show Abstract
New improving metrology for advanced memory devices with high transmission attenuated phase shift mask
(Canceled)
Paper 11325-92
Time: 5:30 PM - 7:30 PM
Author(s):
Show Abstract
Saving scribe-lane space by using narrow alignment marks
(Canceled)
Paper 11325-93
Time: 5:30 PM - 7:30 PM
Author(s):
Show Abstract
High speed roughness measurement on blank silicon wafers using wave front phase imaging
Paper 11325-94
Time: 5:30 PM - 7:30 PM
Author(s): Juan Trujillp, José Manuel Rodrigues Ramos, Wooptix, S.L. (Spain); Jan O. Gaudestad, Wooptix, S.L. (United States)
Show Abstract
Improving after-etch overlay performance using high-density in-device metrology in DRAM manufacturing
Paper 11325-95
Time: 5:30 PM - 7:30 PM
Author(s): Ik-Hyun Jeong, SeungWoo Koo, Hyun-Sok Kim, Jung-Il Hwang, Jae-Wuk Ju, Young-Sik Kim, SK Hynix, Inc. (Korea, Republic of); Cees Lambregts, Rizvi Rahman, Marc Hauptmann, Raheleh Pishkari, ASML Netherlands B.V. (Netherlands); Kwang-Young Hu, ASML Korea Co., Ltd. (Netherlands); Paul Böcker, ASML Netherlands B.V. (Netherlands); Kang-San Lee, Minsub Hank Han, ASML Korea Co., Ltd. (Korea, Republic of)
Show Abstract
Improving Mask Tape Out productivity and accuracy in verification step
Paper 11325-96
Time: 5:30 PM - 7:30 PM
Author(s): Guillaume Landie, Charlotte Beylier, STMicroelectronics S.A. (France); Raphael La Greca, Laurent Depre, ASML France S.a.r.l. (France); Mark Simmons, Jen-Yi Wuu, Peigen Cao, Yi-Hsing Peng, Terrence Yang, Shibing Wang, ASML San Jose (United States)
Show Abstract
The application of a Rapid Probe Microscope (RPM) for investigating 1D and 2D structures from EUV lithography
Paper 11325-97
Time: 5:30 PM - 7:30 PM
Author(s): Lei Feng, Andrew D. L. Humphris, Jenny Goulden, Infinitesima Ltd. (United Kingdom)
Show Abstract
The improvement of measurement accuracy of SADP pitch walking issue
Paper 11325-98
Time: 5:30 PM - 7:30 PM
Author(s): Pei Liu, Cheng-Zhang Wu, Hung-Wen Chao, Wenzhan Zhou, Shanghai Huali Integrated Circuit Corp. (China); Masami Ikota, Hitachi High-Tech Science Corp. (Japan); Yujie Xu, Hitachi High-Technologies Corp. (China)
Show Abstract
Metrology of 3D-NAND structures using machine learning assisted fast marching level-sets algorithm
Paper 11325-99
Time: 5:30 PM - 7:30 PM
Author(s): Umesh P. S. Adiga, Derek Higgins, Sang Hoon Lee, Mark T. Biedrzycki, Dan Nelson, Thermo Fisher Scientific Inc. (United States)
Show Abstract
Deep Learning denoising of SEM images of lithographic patterns
Paper 11325-103
Time: 5:30 PM - 7:30 PM
Author(s): Eva Giannatou, Nanometrisis P.C. (Greece); Vassilios Constantoudis, George Papavieros, NCSR Demokritos (Greece), Nanometrisis P.C. (Greece); Harris Papagrorgiou, Institute for Language and Speech Processing (Greece); Gian Lorusso, imec (Belgium); Evangelos Gogolides, NCSR Demokritos (Greece), Nanometrisis P.C. (Greece)
Show Abstract
Noise fidelity in SEM simulation
Paper 11325-104
Time: 5:30 PM - 7:30 PM
Author(s): Benjamin D. Bunday, Consultant (United States)
Show Abstract
Detection of etching residue in HAR contact hole using Monte-Carlo simulation
Paper 11325-50
Time: 5:30 PM - 7:30 PM
Author(s): Daisuke Bizen, Fumiya Ishizaka, Hitachi High-Technologies Corp. (Japan); Makoto Sakakibara, Hitachi, Ltd. (Japan); Makoto Suzuki, Hitachi High-Technologies Corp. (Japan); Toshiyuki Yokosuka, Hitachi, Ltd. (Japan); Hideyuki Kazumi, Hitachi High-Technologies Corp. (Japan)
Show Abstract
Reconstruction of nanostructures with sub-nm accuracy using X-ray techniques
Paper 11325-108
Time: 5:30 PM - 7:30 PM
Author(s): Analía Fernández Herrero, Christian Laubis, Anna Andrle, Mika Pflüger, Qais Saadeh, Philipp Hönicke, Yves Kayser, Konstantin NIkolaev, Maren Casfor Zapata, Nando Farchmin, Michael Kolbe, Sebastian Heidenreich, Burkhard Beckhoff, Frank Scholze, Victor Soltwisch, Physikalisch-Technische Bundesanstalt (Germany)
Show Abstract
High speed, high accuracy displacement extraction from sinusoidal like Moiré fringes in a novel optical encoding technology
Paper 11325-109
Time: 5:30 PM - 7:30 PM
Author(s): Zhijian Zhong, Chenyi Li, Shiguang Li, Institute of Microelectronics (China); Jing Zhang, North China University of Technology (China); Yayi Wei, Institute of Microelectronics (China)
Show Abstract
High throughput multi-SPM metrology development progress and applications
Paper 11325-110
Time: 5:30 PM - 7:30 PM
Author(s): Hamed Sadeghian, Adam Chuang, Arseniy Kalinin, Nearfield Instruments B.V. (Netherlands)
Show Abstract
Thursday 27 February Show All Abstracts
Session 12:
Metrology for the EUV Era
Thursday 27 February 2020
8:00 AM - 9:40 AM
Location: Convention Center, Grand Ballroom 220B
Session Chairs:
Phillipe Leray, imec (Belgium) ;
Narender Rana, Western Digital Corp. (United States)
Influence and control of CD on defectivity for EUV Pitch 32 line-space
Paper 11325-51
Time: 8:20 AM - 8:40 AM
Author(s): Christophe Béral, Anne-Laure Charley, Philippe Leray, Frederic Lazzarino, Romuald Blanc, Poulomi Das, Ataklti Weldeslassie, Amir-Hossein Tamaddon, Werner Gillijns, imec (Belgium)
Show Abstract
EUV photo resist shrink characterization using low landing energy SEM
Paper 11325-52
Time: 8:40 AM - 9:00 AM
Author(s): Shimon Levi, Applied Materials Israel, Ltd. (Israel)
Show Abstract
EUV photoresist reference metrology using TEM tomography
Paper 11325-53
Time: 9:00 AM - 9:20 AM
Author(s): Mark T. Biedrzycki, Andrew Barnum, Umesh P. S. Adiga, Rose Marie Haynes, Jason Arjavac, Thermo Fisher Scientific Inc. (United States); Alain Mousa, Anne-Laure Charley, Phillipe Leray, Dmitry Batuk, imec (Belgium)
Show Abstract
Novel on-product focus metrology for EUV, enabling direct focus monitoring and control for EUV systems
Paper 11325-54
Time: 9:20 AM - 9:40 AM
Author(s): Inbeom Yim, Koshiba Dakeshi, Chan Hwang, Seung Yoon Lee, Jeongjin Lee, Joon-Soo Park, SAMSUNG Electronics Co., Ltd. (Korea, Republic of); Jenny Yueh, Ali Ghavami, Bart Segers, Miguel Garcia Granda, Yutao Gui, Eric Janda, Frank Staals, Se-Hui Lee, Seung-Bin Yang, Yoon-tae Lee, Se-Ra Jeon, Daniel Park, Elliott McNamara, Ewoud van West, ASML Netherlands B.V. (Netherlands)
Show Abstract
More accurate, higher speed, and smarter metrology in EUV era
Paper 11325-80
Time: 8:00 AM - 8:20 AM
Author(s): Zhigang Wang, Kei Sakai, Yasushi Ebizuka, Masumi Shirai, Makoto Suzuki, Hitachi High-Tech Corp. (Japan)
Show Abstract
2020 Karel Urbánek Best Student Paper Award Presentation
Thursday 27 February 2020
9:40 AM - 10:00 AM
Location: Convention Center, Grand Ballroom 220B
Session Chairs:
Ofer Adan, Applied Materials Israel, Ltd. (Israel) ;
John C. Robinson, KLA Corp. (United States)

Award sponsored by

Coffee Break 10:00 AM - 10:30 AM
Session 13:
Pattern Placement and Overlay Metrology III
Thursday 27 February 2020
10:30 AM - 12:10 PM
Location: Convention Center, Grand Ballroom 220B
Session Chairs:
Jason P. Cain, Advanced Micro Devices, Inc. (United States) ;
John A. Allgair, BRIDG (United States)
Using e-Beam inspection and overlay as tool for identifying process weaknesses in semiconductor processing
Paper 11325-55
Time: 10:30 AM - 10:50 AM
Author(s): Kwame Owusu-Boahen, Suraj Patil, Arun Vijayakumar, Alex Pate, Carl Han, Jorg Schwitzgebel, Chulwoo Kim, David Moreau, SAMSUNG Austin Semiconductor LLC (United States)
Show Abstract
Mitigating gain, effort and cost for EOW overlay control
Paper 11325-56
Time: 10:50 AM - 11:10 AM
Author(s): Olivier Mermet, Maxime Gatefait, Didier Dabernat, Florent Dettoni, Benjamin Duclaux, Bertrand Le-Gratiet, STMicroelectronics S.A. (France)
Show Abstract
Optical Imaging Metrology Calibration using High Voltage Scanning Electron Microscope at After-Development Inspection for Advanced Processes
Paper 11325-57
Time: 11:10 AM - 11:30 AM
Author(s): Nadav Gutman, KLA Israel (Israel); Roel Gronheid, KLA Belgium (Belgium); Inna Tarshish, Chen Dror, KLA Israel (Israel); Henning Backhauss, Detlef Michelsson, KLA Germany (Germany); Liat Levin, Vladimir Levinski, Yuri Paskover, KLA Israel (Israel); Slawomir Czerkas, Ulrich Pohlmann, Frank Laske, KLA Germany (Germany)
Show Abstract
High-order field distortion correction using standalone alignment technology with modeling and sampling optimization
Paper 11325-58
Time: 11:30 AM - 11:50 AM
Author(s): Takehisa Yahiro, Junpei Sawamura, Katsushi Makino, Yuji Shiba, Jun Ishikawa, Shinji Wakamoto, Masahiro Morita, Nikon Corp. (Japan); Steven Tottewitz, Boris Habets, Patrick Lomtscher, Qoniac GmbH (Germany); Jiro Hanaue, Qoniac Japan K.K. (Japan)
Show Abstract
Optical Overlay measurement accuracy improvement with machine learning
Paper 11325-59
Time: 11:50 AM - 12:10 PM
Author(s): Honggoo Lee, SK Hynix, Inc. (Korea, Republic of); Boaz Ophir, KLA Israel (Israel); Jeongpyo Lee, KLA Korea (Korea, Republic of); Alexander Verner, KLA Israel (Israel); JungTae Lee, Sanghuck Jeon, DongSub Choi, KLA Korea (Korea, Republic of)
Show Abstract
Lunch Break 12:10 PM - 1:40 PM
Session 14:
Late Breaking News
Thursday 27 February 2020
1:40 PM - 3:40 PM
Location: Convention Center, Grand Ballroom 220B
Session Chairs:
Ofer Adan, Applied Materials Israel, Ltd. (Israel) ;
John C. Robinson, KLA Corp. (United States)
Statistical local CD uniformity with novel SEM noise reduction method
Paper 11325-60
Time: 1:40 PM - 2:00 PM
Author(s): Shinji Kobayashi, Tokyo Electron Kyushu Ltd. (Japan)
Show Abstract
On-product focus monitoring and control for immersion lithography in 3D-NAND manufacturing
Paper 11325-61
Time: 2:00 PM - 2:20 PM
Author(s): Sangjun Han, Jeongsu Park, Beomki Shin, Jun-Yeob Kim, SK Hynix, Inc. (Korea, Republic of); Amine Lakcher, Ahmed Zayed, Jennifer Shumway, Jan-Pieter van Delft, Gratiela Isai, Ruxandra Mustata, Arno van den Brink, ASML Netherlands B.V. (Netherlands); Taeddy Kim, Jay Jung, Yong-Sik Shin, Soo-Kyung Lee, ASML Korea Co., Ltd. (Korea, Republic of)
Show Abstract
A novel accurate and robust technique in after-etch overlay metrology of 3D-NAND’s memory holes
Paper 11325-62
Time: 2:20 PM - 2:40 PM
Author(s): Yaobin Feng, Dean Wu, Pandeng Xuan, Yangtze Memory Technologies Co., Ltd. (China); Pavel Izikson, ASML Netherlands B.V. (Netherlands); Payne Qi, Huanian You, Yvon Chai, ASML Wuhan (China); Jan Jitse Venselaar, Giulio Bottegal, Gonzalo Sanguinetti, Bert Verstraeten, Koen van Witteveen, ASML Netherlands B.V. (Netherlands); Soon Thon Kian, ASML Wuhan (China); Tjitte Nooitgedagt, Babak Mozooni, ASML Netherlands B.V. (Netherlands)
Show Abstract
Advanced process control loop for SAQP pitch walk with combined lithography, deposition and etch actuators
Paper 11325-63
Time: 2:40 PM - 3:00 PM
Author(s): Huan Ren, KLA China (China); Antonio Mani, KLA Corp. (Belgium); Xin Li, Sixiao Han, KLA China (China); Xuemei Chen, KLA Corp. (United States); Dieter Van den Heuvel, imec (Belgium)
Show Abstract
Contact Etch process control application for advanced NAND memory structures
Paper 11325-102
Time: 3:00 PM - 3:20 PM
Author(s): Roman Kris, Grigory Klebanov, Einat Frishman, Sharon Duvdevani -Bar, Jannelle Geva, Applied Materials Israel, Ltd. (Israel); Dhananjay Rathore, Daniel Rogers, Applied Materials, Inc. (United States)
Show Abstract
Realizing more accurate OPC models by utilizing large field SEM contours
Paper 11325-2
Time: 3:20 PM - 3:40 PM
Author(s): Chih-I Wei, Rajiv Sejpal, Mentor Graphics Corp. (Belgium); Yunfei Deng, Ir Kusnadi, Germain Fenger, Mentor Graphics Corp. (United States); Masahiro Oya, Kotaro Maruyama, Yuichiro Yamazaki, NGR Inc. (Japan); Sayantan Das, Sandip Halder, Werner Gillijns, imec (Belgium)
Show Abstract
Back to Top