San Jose Convention Center
San Jose, California, United States
24 - 28 February 2019
Conference 10959
Metrology, Inspection, and Process Control for Microlithography XXXIII
Monday - Thursday 25 - 28 February 2019
Important
Dates
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Abstract Due:
29 August 2018

Manuscript Due Date:
29 January 2019

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Program Committee
Program Committee continued...
Monday 25 February Show All Abstracts
AL19 Plenary Session
Monday 25 February 2019
8:00 AM - 10:30 AM
Location: Convention Center, Grand Ballroom 220A

8:00 am to 8:30 am

Welcome and Announcements
Symposium Chairs: Will Conley, Cymer, An ASML Company (USA), and Kafai Lai, IBM T. J. Watson Research Ctr. (USA)

    *Introduction of New SPIE Fellows
    *Presentation of the Zernike Awards
    *Presentation of the Nick Cobb Memorial Scholarship
The Future is Quantum (Plenary Presentation)
Paper 10957-500
Time: 8:30 AM - 9:10 AM
Author(s): Dario Gil, IBM Research (United States)
Show Abstract
3D NAND flash technology: roadmap, process, design, and challenges (Plenary Presentation)
Paper 10957-501
Time: 9:10 AM - 9:50 AM
Author(s): Jeongdong Choe, Techinsights (Canada)
Show Abstract
Patterning in the Stressful World of 3D NAND (Plenary Presentation)
Paper 10957-502
Time: 9:50 AM - 10:30 AM
Author(s): Steven E. Steen, ASML (Netherlands)
Show Abstract
Coffee Break 10:30 AM - 11:00 AM
Opening Remarks and Award Announcement
Monday 25 February 2019
11:00 AM - 11:15 AM
Location: Convention Center, Grand Ballroom 220B
Session Chairs:
Vladimir A. Ukraintsev, Qorvo Corp. (United States) ;
Ofer Adan, Applied Materials Israel, Ltd. (Israel)

Presentation of the 2018 Diana Nyyssonen Best Paper Award in Metrology

Award Sponsored by


Session 1:
Keynote Session
Monday 25 February 2019
11:15 AM - 12:25 PM
Location: Convention Center, Grand Ballroom 220B
Session Chairs:
Vladimir A. Ukraintsev, Qorvo Corp. (United States) ;
Ofer Adan, Applied Materials Israel, Ltd. (Israel)
Tough road ahead for device overlay and edge placement error (Keynote Presentation)
Paper 10959-1
Time: 11:15 AM - 11:50 AM
Author(s): Kaustuve Bhattacharyya, ASML Netherlands B.V. (Netherlands)
Show Abstract
Silicon-based quantum computing: manufacturing and metrology challenges (Keynote Presentation)
Paper 10959-2
Time: 11:50 AM - 12:25 PM
Author(s): Richard M. Silver, National Institute of Standards and Technology (United States)
Show Abstract
Lunch Break 12:25 PM - 1:30 PM
Session 2:
Overlay News
Monday 25 February 2019
1:30 PM - 3:10 PM
Location: Convention Center, Grand Ballroom 220B
Session Chairs:
Alexander Starikov, I&I Consulting (United States) ;
Narender Rana, Western Digital Corp. (United States)
On device EPE: minimizing overlay, pattern placement, and pitch-walk, in presence of EUV stochastics and etch variations
Paper 10959-3
Time: 1:30 PM - 1:50 PM
Author(s): Ofer Adan, Applied Materials Ltd (Israel)
Show Abstract
Overlay error investigation for metal containing resist (MCR)
Paper 10959-4
Time: 1:50 PM - 2:10 PM
Author(s): Roel Gronheid, KLA-Tencor/ ICOS Belgium (Belgium); Satomi Higashibata, Toshiba Electronics Europe GmbH (Germany); Yusuke Tanaka, SanDisk Ltd. (Japan); Masaru Suzuki, Satoshi Nagai, Toshiba Memory Corp. (Japan); Waikin Li, Philippe Leray, IMEC (Belgium)
Show Abstract
Process drift compensation by tunable wavelength homing in scatterometry-based overlay
Paper 10959-5
Time: 2:10 PM - 2:30 PM
Author(s): Kun Gao, KLA-Tencor New York (United States); Vidya Ramanathan, KLA-Tencor (United States); Victoria Naipak, Meng Wang, KLA-Tencor (United States); Renan Milo, Nir BenDavid, Chen Dror, KLA-Tencor (Israel); Hao Mei, Weihua Li, Xindong Gao, KLA-Tencor (China); Motasim Bellah, Karsten Gutjahr, Dongyue Yang, Cheuk Wun Wong, Xueli Hao, Tony Joung, DeNeil Park, Yue Zhou, Abhishek Gottipati , GLOBALFOUNDRIES (United States)
Show Abstract
Measuring after etch overlay and characterizing tilt fingerprints in multi-tier 3D-NAND structures
Paper 10959-6
Time: 2:30 PM - 2:50 PM
Author(s): Jaap Karssenberg, ASML Netherlands B.V. (Netherlands); Honggoo Lee, Dong-Young Lee, Jun-Yeob Kim, Sangjun Han, Chan-Ha Park, SK Hynix, Inc. (Korea, Republic of); Aileen Soco, ASML Netherlands B.V. (Netherlands); Nang-Lyeom Oh, ASML Korea Co., Ltd. (Korea, Republic of); Arno van Leest, Mir Shahrjerdy, Tjitte Nooitgedagt, ASML Netherlands B.V. (Netherlands)
Show Abstract
Standalone alignment technology enabling feed forward compensation of on-product overlay errors
Paper 10959-7
Time: 2:50 PM - 3:10 PM
Author(s): Takehisa Yahiro, Junpei Sawamura, Sonyong Song, Sayuri Tanaka, Yuji Shiba, Satoshi Ando, Hiroyuki Nagayoshi, Jun Ishikawa, Masahiro Morita, Yuichi Shibazaki, Nikon Corp. (Japan)
Show Abstract
Coffee Break 3:10 PM - 3:40 PM
Session 3:
Challenges and New Methods
Monday 25 February 2019
3:40 PM - 5:20 PM
Location: Convention Center, Grand Ballroom 220B
Session Chairs:
Shunsuke Koshihara, Hitachi High-Technologies Corp. (Japan) ;
Christopher J. Raymond, Nanometrics Inc. (United States)
Effects of coherence on CDSAXS measurements of high aspect ratio 3D structures
Paper 10959-8
Time: 3:40 PM - 4:00 PM
Author(s): R. Joseph Kline, Daniel Sunday, National Institute of Standards and Technology (United States); Ruipeng Li, Masafumi Fukuto, Brookhaven National Lab. (United States)
Show Abstract
Machine learning and hybrid metrology using scatterometry and LE-XRF to detect voids in copper lines
Paper 10959-9
Time: 4:00 PM - 4:20 PM
Author(s): Dexin Kong, Koichi Motoyama, Abraham Arceo de la peña, Huai Huang, Brock Mendoza, Mary Breton, Gangadhara R. Muthinti, Hosadurga Shobha, John Gaudiello, IBM Corp. (United States); Aron Cepler, Matthew Sendelbach, Susan Emans, Nova Measuring Instruments Inc. (United States); Shay Wolfing, Avron Ger, Nova Measuring Instruments Ltd. (Israel); Kavita Shah, Nova Measuring Instruments Inc. (United States)
Show Abstract
Image quality enhancement of a CD-SEM image using conditional generative adversarial networks
Paper 10959-10
Time: 4:20 PM - 4:40 PM
Author(s): Yoshihiro Midoh, Koji Nakamae, Osaka Univ. (Japan)
Show Abstract
Statistical significance of STEM based metrology on advanced 3D transistor structures
Paper 10959-11
Time: 4:40 PM - 5:00 PM
Author(s): Laurens Kwakman, Thermo Fisher Scientific Inc. (Netherlands); Anne Kenslea, Hayley Johanesen, Jillian Cramer, Michael Strauss, Thermo Fisher Scientific Inc. (United States); Werner Boullart, Hans Mertens, Yong Kong Siew, Kathy Barla, IMEC (Belgium)
Show Abstract
Edge placement error measurement in lithography process with die to database algorithm
Paper 10959-12
Time: 5:00 PM - 5:20 PM
Author(s): Yoshishige Sato, NGR Inc. (Japan); Shang-Chieh Huang, NGR Inc. (Taiwan); Kotaro Maruyama, Yuichiro Yamazaki, NGR Inc. (Japan)
Show Abstract
Tuesday 26 February Show All Abstracts
Session 4:
Inspection I
Tuesday 26 February 2019
8:00 AM - 10:00 AM
Location: Convention Center, Grand Ballroom 220B
Session Chairs:
Timothy F. Crimmins, Intel Corp. (United States) ;
Byoung-Ho Lee, SK Hynix, Inc. (Korea, Republic of)
Super-resolution fluorescence nanoscopy opportunities for EUV resist inspection and metrology (Invited Paper)
Paper 10959-13
Time: 8:00 AM - 8:40 AM
Author(s): John S. Petersen, IMEC (Belgium)
Show Abstract
Machine learning for predictive electrical performance using OCD
Paper 10959-14
Time: 8:40 AM - 9:00 AM
Author(s): Sayantan Das, IMEC (Belgium); Joey Hung, Nova Measuring Instruments Ltd. (Israel); Guillaume Schelcher, Sandip Halder, IMEC (Belgium); Roy Koret, Igor Turovets, Nova Measuring Instruments Ltd. (Israel); Mohamed Saib, Anne-Laure Charley, IMEC (Belgium); Matthew Sandelbach, Nova Measuring Instruments Inc. (United States); Avron Ger, Nova Measuring Instruments Ltd. (Israel); Philippe Leray, IMEC (Belgium)
Show Abstract
Development of standard samples with programmed defects for evaluation of pattern inspection tools
Paper 10959-74
Time: 9:00 AM - 9:20 AM
Author(s): Susumu Iida, Takamitsu Nagai, Takayuki Uchiyama, Evolving Nano-process Infrastructure Development Ctr., Inc. (Japan)
Show Abstract
E-beam inspection of single exposure EUV direct print of M2 layer of N10 node test vehicle
Paper 10959-16
Time: 9:20 AM - 9:40 AM
Author(s): Yuichiro Yamazaki, NGR Inc. (Japan); Sayantan Das, IMEC (Belgium); Ryo Shimoda, NGR Inc. (Japan); Sandip Halder, IMEC (Belgium); Shinzi Mizutani, Kotaro Maruyama, NGR Inc. (Japan); Philippe Leray, IMEC (Belgium)
Show Abstract
Gas enhanced PFIB surface preparation enabled metrology and statistical analysis of 3D NAND devices
Paper 10959-17
Time: 9:40 AM - 10:00 AM
Author(s): Micah Ledoux, James Clarke, Brett Avedisian, Chad Rue, Umesh P. S. Adiga, Mark Biedrzycki, Thermo Fisher Scientific Inc. (United States)
Show Abstract
Coffee Break 10:00 AM - 10:30 AM
Session 5:
Advances in Physical Characterization
Tuesday 26 February 2019
10:30 AM - 12:10 PM
Location: Convention Center, Grand Ballroom 220B
Session Chairs:
Richard M. Silver, National Institute of Standards and Technology (United States) ;
Hugo Cramer, ASML Netherlands B.V. (Netherlands)
Latent imaging of resists via resonant x-ray scattering: unraveling the effects of chain scission to chemical amplification
Paper 10959-18
Time: 10:30 AM - 10:50 AM
Author(s): Isvar A. Cordova, Guillaume Freychet, Scott D. Dhuey, Alexander Hexemer, Patrick P. Naulleau, Cheng Wang, Lawrence Berkeley National Lab. (United States)
Show Abstract
Improved sub-surface AFM using photothermal actuation
Paper 10959-19
Time: 10:50 AM - 11:10 AM
Author(s): Maarten E. van Reijzen, Sasan Keyvani, Mehmet S. Tamer, Maarten H. van Es, TNO (Netherlands); Hamed Sadeghian, TNO Science and Industry (Netherlands); Marco van der Lans, Martijn M. C. J. M. van Riel, TNO (Netherlands)
Show Abstract
Quantitative tomography with subsurface scanning ultrasound resonance force microscopy
Paper 10959-20
Time: 11:10 AM - 11:30 AM
Author(s): Maarten H. van Es, TNO Science and Industry (Netherlands); Laurent Fillinger, TNO (Netherlands); Hamed Sadeghian, TNO Science and Industry (Netherlands)
Show Abstract
Full structure transistor process monitoring of boron and germanium in PFET EPI using In-line XPS
Paper 10959-21
Time: 11:30 AM - 11:50 AM
Author(s): Jusang Lee, Ganesh Subramanian, Manasa Medikonda, Hossam Lazkani, Judson Holt, Churamani Gaire, GLOBALFOUNDRIES Inc. (United States); Paul Isbester, Mark Klare, Nova Measuring Instruments Inc. (United States)
Show Abstract
Nano-scale molecular analysis of photo-resist films with massive cluster secondary ion mass spectrometry
Paper 10959-22
Time: 11:50 AM - 12:10 PM
Author(s): Michael J. Eller, Texas A&M Univ. (United States); Mingqi Li, Xisen Hou, Dow Electronic Materials (United States); Stanislav V. Verkhoturov, Emile A. Schweikert, Texas A&M Univ. (United States); Peter Trefonas, Dow Electronic Materials (United States)
Show Abstract
Lunch/Exhibition Break 12:10 PM - 1:30 PM
Session 6:
LWR
Tuesday 26 February 2019
1:30 PM - 3:10 PM
Location: Convention Center, Grand Ballroom 220B
Session Chairs:
John C. Robinson, KLA-Tencor Corp. (United States) ;
Matthew J. Sendelbach, Nova Measuring Instruments Inc. (United States)
Understanding the role of scanning electron microscope image noise in the measurement of pattern roughness
Paper 10959-23
Time: 1:30 PM - 1:50 PM
Author(s): Chris A. Mack, Fractilia, LLC (United States)
Show Abstract
Line width and roughness measurement of SAOP by using FIB and Planer-TEM as reference metrology
Paper 10959-24
Time: 1:50 PM - 2:10 PM
Author(s): Kiyoshi Takamasu, Satoru Takahashi, The Univ. of Tokyo (Japan); Hiroki Kawada, Masami Ikota, Hitachi High-Technologies Corp. (Japan); Stefan Decoster, Frederic Lazzarino, Gian F. Lorusso, IMEC (Belgium)
Show Abstract
Using critical-dimension grazing-incidence small angle x-ray scattering to study line edge roughness
Paper 10959-25
Time: 2:10 PM - 2:30 PM
Author(s): Guillaume Freychet, Dinesh Kumar, Ron J. Pandolfi, Isvar A. Cordova, Patrick P. Naulleau, Alexander Hexemer, Lawrence Berkeley National Lab. (United States); Gian F. Lorusso, IMEC (Belgium)
Show Abstract
LER and LWR measurements used for monitoring wiggling and stochastic-failure
Paper 10959-26
Time: 2:30 PM - 2:50 PM
Author(s): Hiroki Kawada, Yasushi Ebizuka, Takumichi Sutani, Takahiro Kawasaki, Hitachi High-Technologies Corp. (Japan)
Show Abstract
Roughness decomposition: an on-wafer methodology to discriminate mask, metrology, and shot noise contributions
Paper 10959-27
Time: 2:50 PM - 3:10 PM
Author(s): Gian F. Lorusso, IMEC (Belgium)
Show Abstract
Coffee Break 3:10 PM - 3:40 PM
Session 7:
New Methods: Student Session
Tuesday 26 February 2019
3:40 PM - 5:20 PM
Location: Convention Center, Grand Ballroom 220B
Session Chairs:
Alok Vaid, GLOBALFOUNDRIES Inc. (United States) ;
Timothy F. Crimmins, Intel Corp. (United States)
Application of PSD for the extraction of programmed line roughness from SAXS
Paper 10959-28
Time: 3:40 PM - 4:00 PM
Author(s): Jérôme Reche, CEA-LETI (France), CNRS (France), Univ. Grenoble Alpes (France); Maxime Besacier, Univ. Grenoble Alpes, CNRS, CEA-LETI Minatec, LTM (France); Patrice Gergaud, Yoann Blancquaert, Univ. Grenoble Alpes, CEA, LETI, DPFT (France)
Show Abstract
Surface effects in simulations of scanning electron microscopy images
Paper 10959-29
Time: 4:00 PM - 4:20 PM
Author(s): Luc van Kessel, Cornelis Hagen, Pieter Kruit, Technische Univ. Delft (Netherlands)
Show Abstract
Progress on sub-wavelength nanoimaging with a coherent tabletop EUV source
Paper 10959-30
Time: 4:20 PM - 4:40 PM
Author(s): Charles S. Bevis, Robert Karl, Bin Wang, Peter Johnsen, Michael Tanksalvala, Christina L. Porter, Yuka Esashi, Henry Kapteyn, JILA (United States)
Show Abstract
Optical characterization of multi-NST nanowire test structures using Muller matrix spectroscopic ellipsometry (MMSE) based scatterometry for sub 5nm nodes
Paper 10959-31
Time: 4:40 PM - 5:00 PM
Author(s): Madhulika S. Korde, SUNY Polytechnic Institute (United States); Aelan Mosden, Subhadeep Kal, Cheryl Pereira, TEL Technology Ctr., America, LLC (United States); Nick Keller, Nanometrics Inc. (United States); Alain C. Diebold, SUNY Polytechnic Institute (United States)
Show Abstract
Tilted beam SEM, 3D metrology for industry
Paper 10959-32
Time: 5:00 PM - 5:20 PM
Author(s): Charles Valade, STMicroelectronics S.A. (France); Jérôme Hazart, Sébastien Bérard-Bergery, CEA-LETI (France); Elodie Sungauer, STMicroelectronics S.A. (France); Maxime Besacier, Cécile Gourgon, Lab. des Technologies de La Microélectronique (France)
Show Abstract
Wednesday 27 February Show All Abstracts
Session 8:
Machine Learning
Wednesday 27 February 2019
8:00 AM - 10:00 AM
Location: Convention Center, Grand Ballroom 220B
Session Chairs:
Narender Rana, Western Digital Corp. (United States) ;
Benjamin D. Bunday, Abeam Technologies, Inc. (United States)
Applications of machine learning at the limits of form-dependent scattering for defect metrology (Invited Paper)
Paper 10959-33
Time: 8:00 AM - 8:40 AM
Author(s): Mark-Alexander Henn, Bryan M. Barnes, Hui Zhou, Richard M. Silver, National Institute of Standards and Technology (United States)
Show Abstract
Engineering neural networks for improved defect detection and classification
Paper 10959-34
Time: 8:40 AM - 9:00 AM
Author(s): Ravi K. Bonam, IBM Corp. (United States); Assad Oberai, Dhruv Patel, The Univ. of Southern California (United States)
Show Abstract
Using Gaussian process regression for efficient parameter reconstruction
Paper 10959-35
Time: 9:00 AM - 9:20 AM
Author(s): Philipp-Immanuel Schneider, Martin Hammerschmidt, Lin Zschiedrich, Sven Burger, JCMwave GmbH (Germany)
Show Abstract
Deep learning's impact on contour extraction for design based metrology and design based inspection
Paper 10959-36
Time: 9:20 AM - 9:40 AM
Author(s): Ryo Yumiba, Masayoshi Ishikawa, Shinichi Shinoda, Shigetoshi Sakimura, Yasutaka Toyoda, Hitachi, Ltd. (Japan); Hiroyuki Shindo, Masayuki Izawa, Hitachi High-Technologies Corp. (Japan)
Show Abstract
OPC model accuracy study using high volume contour based gauges and deep learning on memory device
Paper 10959-37
Time: 9:40 AM - 10:00 AM
Author(s): Young-Seok Kim, ASML Korea Co., Ltd. (Korea, Republic of); Seil Lee, ASML (Korea, Republic of); Zhenyu Hou, Yiqiong Zhao, ASML San Jose (United States); Meng Liu, ASML (China); Yunan Zheng, ASML (United States); Qian Zhao, ASML San Jose (United States); Daekwon Kang, ASML (Korea, Republic of); Lei Wang, ASML (United States); Mark Simmons, Mu Feng, ASML San Jose (United States); Jun Lang, Byoung-il Choi, ASML US, Inc. (United States); Gilbert Kim, ASML Korea Co., Ltd. (Korea, Republic of); Hakyong Sim, Jongcheon Park, SK Hynix (Korea, Republic of); Gyun Yoo, JeonKyu Lee, Sung-woo Ko, SK Hynix, Inc. (Korea, Republic of); Jaeseung Choi, SK Hynix (Korea, Republic of); Cheolkyun Kim, Chanha Park, SK Hynix, Inc. (Korea, Republic of)
Show Abstract
Coffee Break 10:00 AM - 10:30 AM
Session 9:
SEM
Wednesday 27 February 2019
10:30 AM - 12:10 PM
Location: Convention Center, Grand Ballroom 220B
Session Chairs:
Benjamin D. Bunday, Abeam Technologies, Inc. (United States) ;
Shunsuke Koshihara, Hitachi High-Technologies Corp. (Japan)
What is prevalent CD-SEM's role in EUV era?
Paper 10959-38
Time: 10:30 AM - 10:50 AM
Author(s): Zhigang Wang, Yoshinori Momonoi, Katsumi Setoguchi, Makoto Suzuki, Satoru Yamaguchi, Hitachi High-Technologies Corp. (Japan)
Show Abstract
High voltage CD-SEM based metrology for 3D-profile measurement using depth-correlated BSE signal
Paper 10959-39
Time: 10:50 AM - 11:10 AM
Author(s): Wei Sun, Yasunari Sohda, Hiroya Ohta, Hitachi, Ltd. (Japan); Taku Ninomiya, Yasunori Goto, Hitachi High-Technologies Corp. (Japan)
Show Abstract
Deep-learning-based SEM image denoiser
Paper 10959-40
Time: 11:10 AM - 11:30 AM
Author(s): Dorin Cerbu, Sandip Halder, Philippe Leray, IMEC (Belgium)
Show Abstract
Development of automatic aberration correction method for in-line SEM
Paper 10959-41
Time: 11:30 AM - 11:50 AM
Author(s): Hideto Dohi, Hitachi High-Technologies Corp. (Japan); Zhaohui Cheng, Shingo Hayashi, Kotoko Hirose, Hitachi, Ltd. (Japan); Hideyuki Kazumi, Hitachi High-Technologies Corp. (Japan)
Show Abstract
FEM simulation for artificial generation of SEM pictures
Paper 10959-42
Time: 11:50 AM - 12:10 PM
Author(s): Duy Duc Nguyen, ASELTA Nanographics (France); Jean-Hervé Tortai, Univ. Grenoble Alpes, CNRS (France), CEA/LETI Minatec, LTM (France); Patrick Schiavone, ASELTA Nanographics (France)
Show Abstract
Lunch/Exhibition Break 12:10 PM - 1:30 PM
Session 10:
SEM and e-Beam Metrology
Wednesday 27 February 2019
1:30 PM - 3:10 PM
Location: Convention Center, Grand Ballroom 220B
Session Chairs:
Christopher J. Raymond, Nanometrics Inc. (United States) ;
Philippe Leray, IMEC (Belgium)
3D-SEM challenges: How can we profile in-die 3D geometry of the integrated circuits?
Paper 10959-43
Time: 1:30 PM - 1:50 PM
Author(s): Makoto Suzuki, Ayumi Doi, Hitachi High-Technologies Corp. (Japan)
Show Abstract
Investigating process variability at ppm level using advanced massive eBeam CD metrology and contour analysis
Paper 10959-44
Time: 1:50 PM - 2:10 PM
Author(s): Bertrand Le-Gratiet, STMicroelectronics S.A. (France); Stefan Hunsche, ASML US, Inc. (United States); Olivier Mermet, STMicroelectronics S.A. (France); Fuming Wang, Yongjun Wang, ASML US, Inc. (United States); Ton Kiers, Wim Tel, ASML Netherlands B.V. (Netherlands); Christian Gardin, STMicroelectronics S.A. (France)
Show Abstract
Depth measurement technique for extremely deep holes using back-scattered electron images with high voltage CD-SEM
Paper 10959-45
Time: 2:10 PM - 2:30 PM
Author(s): Takahiro Nishihata, Mayuka Osaki, Maki Tanaka, Hitachi, Ltd. (Japan); Takuma Yamamoto, Hitachi High-Technologies Corp. (Japan); Akira Hamaguchi, Chihiro Ida, Yusaku Suzuki, Toshiba Memory Corp. (Japan)
Show Abstract
Evaluation of the accuracy and precision of STEM and EDS metrology on horizontal GAA nanowire devices
Paper 10959-46
Time: 2:30 PM - 2:50 PM
Author(s): Hayley Johanesen, Michael Strauss, Anne Kenslea, Chris Hakala, Thermo Fisher Scientific Inc. (United States); Laurens Kwakman, Thermo Fisher Scientific Inc. (Netherlands); Werner Boullart, Hans Mertens, Yong Kong Siew, Kathy Barla, IMEC (Belgium)
Show Abstract
High-resolution low-shrinkage CD metrology for EUV resist using high voltage CD-SEM
Paper 10959-47
Time: 2:50 PM - 3:10 PM
Author(s): Daisuke Bizen, Hitachi High-Technologies Corp. (Japan), Hitachi, Ltd. (Japan); Shunsuke Mizutani, Hitachi High-Technologies Corp. (Japan); Makoto Sakakibara, Hitachi, Ltd. (Japan); Makoto Suzuki, Yoshinori Momonoi, Hitachi High-Technologies Corp. (Japan)
Show Abstract
Coffee Break 3:10 PM - 3:40 PM
Session 11:
Overlay
Wednesday 27 February 2019
3:40 PM - 5:20 PM
Location: Convention Center, Grand Ballroom 220B
Session Chairs:
Hugo Cramer, ASML Netherlands B.V. (Netherlands) ;
Richard M. Silver, National Institute of Standards and Technology (United States)
Improved accuracy and robustness for advanced DRAM with tunable multi-wavelength imaging and scatterometry overlay metrology
Paper 10959-48
Time: 3:40 PM - 4:00 PM
Author(s): John C. Robinson, KLA-Tencor Corp. (United States); Honggoo Lee, Sangjun Han, Minhyung Hong, Jieun Lee, Dongyoung Lee, Ahlin Choi, Chanha Park, SK Hynix, Inc. (Korea, Republic of); Dohwa Lee, Seongjae Lee, Jungtae Lee, Jeongpyo Lee, DongSub Choi, Sanghuck Jeon, Zephyr Liu, Hao Mei, KLA-Tencor Korea (Korea, Republic of); Eran Amit, Anna Golotsvan, Wayne Zhou, Eitan Herzel, Roie Volkovich, KLA-Tencor Israel (Israel)
Show Abstract
Edge placement error and line edge roughness
Paper 10959-111
Time: 4:00 PM - 4:20 PM
Author(s): Vassilios Constantoudis, Institute of Nanoscience and Nanotechnology (Greece), Nanimetrisis p.c. (Greece); George Papavieros, Institute of Nanoscience and Nanotechnology (Greece), Nanometrisis p.c. (Greece), Aristotle Univ. of Thessaloniki (Greece); Evangelos Gogolides, Institute of Nanoscience and Nanotechnology (Greece), Nanomatrisis p.c. (Greece)
Show Abstract
Color mixing in overlay metrology for greater accuracy and robustness
Paper 10959-50
Time: 4:20 PM - 4:40 PM
Author(s): Simon Mathijssen, ASML Netherlands B.V. (Netherlands)
Show Abstract
Smart implant-layer overlay metrology to enable fab cycle time reduction
Paper 10959-51
Time: 4:40 PM - 5:00 PM
Author(s): Leon van Dijk, Faegheh Hasibi, Maialen Larrañaga, ASML Netherlands B.V. (Netherlands); Anne Pastol, ASML France S.a.r.l. (France); Auguste Lam, STMicroelectronics S.A. (France); Richard J. F. van Haren, ASML Netherlands B.V. (Netherlands)
Show Abstract
Intra-field stress impact on global wafer deformation
Paper 10959-52
Time: 5:00 PM - 5:20 PM
Author(s): Richard J. F. van Haren, ASML Netherlands B.V. (Netherlands); Leon van Dijk, ASML (Netherlands); Jeffrey Mileham, Ultratech, a division of Veeco (United States); Jan Hermans, imec (Belgium)
Show Abstract
Session PS1:
Posters-Wednesday
Wednesday 27 February 2019
5:30 PM - 7:30 PM
Location: Convention Center, Hall 2
Session Chairs:
Byoung-Ho Lee, SK Hynix, Inc. (Korea, Republic of) ;
John C. Robinson, KLA-Tencor Corp. (United States)

Posters will be on display from 10:00 am to 5:00 pm, and again from 5:30 pm to 7:30 pm during the poster session. Come to view the high-quality papers that are presented in this alternative format, and interact with the poster authors who will be present during the poster session. Enjoy light refreshments while networking with your colleagues.

Full author or technical registration is required for entry to the poster session. Please wear your registration badge.
Application of aberration corrected low voltage SEM for metrology
Paper 10959-70
Time: 5:30 PM - 7:30 PM
Author(s): Zhaohui Cheng, Hitachi, Ltd. (Japan); Hideto Dohi, Hitachi High-Technologies Corp. (Japan); Shingo Hayashi, Kotoko Hirose, Hitachi, Ltd. (Japan); Hideyuki Kazumi, Hitachi High-Technologies Corp. (Japan)
Show Abstract
An optimized parameter guidance system for line/space CD metrology
Paper 10959-71
Time: 5:30 PM - 7:30 PM
Author(s): Nan Zhao, Lingling Pu, Teng Wang, Wentian Zhou, Ming Xu, Wei Fang, Hermes-Microvision Inc., USA (United States); Brian Lee, Hermes-Microvision, Inc. USA (United States)
Show Abstract
Metrology of 3D NAND in electron micrographs by scale space snakes
Paper 10959-72
Time: 5:30 PM - 7:30 PM
Author(s): Umesh P. S. Adiga, Michael Strauss, Ashley Tilson, Jason Arjavac, Jack Hagger, Dan Nelson, Justin Roller, Thermo Fisher Scientific Inc. (United States)
Show Abstract
Automated wafer defect classification using convolutional neural network
Paper 10959-73
Time: 5:30 PM - 7:30 PM
Author(s): Wei Fang, Chuan Li, Dongdong Wu, Yi-sing Hsiao, Cho Teh, ASML-HMI (United States)
Show Abstract
Sensitivity analysis of the through-focus scanning optical microscopy by the coherence degree of incident light
Paper 10959-75
Time: 5:30 PM - 7:30 PM
Author(s): Shin-Woong Park, Hwi Kim, Korea Univ. Sejong Campus (Korea, Republic of)
Show Abstract
Measurement system of film structure by interferometry and ellipsometry
Paper 10959-76
Time: 5:30 PM - 7:30 PM
Author(s): Ki-Nam Joo, Young Ho Yun, Chosun Univ. (Korea, Republic of)
Show Abstract
Process monitoring and control with tunable wavelength overlay coupled with simulation-to-measurement analysis
Paper 10959-77
Time: 5:30 PM - 7:30 PM
Author(s): Pedro Herrera, KLA-Tencor New York (United States); Kun Gao, KLA-Tencor China (China); Vidya Ramanathan, KLA-Tencor New York (United States); Chen Dror, KLA-Tencor Israel (Israel); Victoria Naipak, KLA-Tencor Corp. (United States); Tal Yaziv, Renan Milo, Nir BenDavid, KLA-Tencor Israel (Israel); Meng Wang, KLA-Tencor New York (United States); Hao Mei, Weihua Li, Xindong Gao, KLA-Tencor China (China); Dongyue Yang, Cheuk Wun Wong, Karsten Gutjahr, Xueli Hao, Tony Joung, Md. Motasim Bellah, DeNeil Park, Abhishek Gottipati, Yue Zhou, GLOBALFOUNDRIES Inc. (United States)
Show Abstract
Parallel active cantilever AFM tool for high-throughput inspection and metrology
Paper 10959-79
Time: 5:30 PM - 7:30 PM
Author(s): Mathias Holz, nano analytik GmbH (Germany)
Show Abstract
Detection of particle defect components on silicon wafer with laser induced breakdown spectroscopy combined laser cleaning technology
Paper 10959-81
Time: 5:30 PM - 7:30 PM
Author(s): Lituo Liu, Academy of Opto-Electronics (China); Xiaoya Yu, The Institute of Survival Technology and Effectiveness Evaluation of Flying Vehicle (China); Weihu Zhou, Xiaomei Chen, Rongyi Ji, Guannan Li, Academy of Opto-Electronics (China)
Show Abstract
Accurate vertical sidewall measurement by a metrological tilting-AFM for reference metrology of line edge roughness
Paper 10959-82
Time: 5:30 PM - 7:30 PM
Author(s): Ryosuke Kizu, Ichiko Misumi, Akiko Hirai, Satoshi Gonda, National Institute of Advanced Industrial Science and Technology (Japan)
Show Abstract
Casual modeling of yield
Paper 10959-83
Time: 5:30 PM - 7:30 PM
Author(s): Jeffrey Weintraub, Scott P. Warrick, Cirrus Logic, Inc. (United States)
Show Abstract
Monitoring and characterization of post etch overlay performance in relation to post lithography overlay performance (non-zero offset monitoring) in DRAM HVM
Paper 10959-84
Time: 5:30 PM - 7:30 PM
Author(s): Georg Erley, Steven Tottewitz, Qoniac GmbH (Germany); Kuoyao Chou, Eva Liu, Frank Yang, Harlan Hwang, Micron Technology Taiwan, Inc. (Taiwan); Patrick Lomtscher, Qoniac GmbH (Germany); Rex H. Liu, Afu Chiu, Hsiao-Lin Hsu, Qoniac Taiwan Ltd. (Taiwan)
Show Abstract
First results from the Large Dynamic Range Atomic Force Microscope for overlay metrology
Paper 10959-85
Time: 5:30 PM - 7:30 PM
Author(s): Gert Witvoet, TNO (Netherlands), Technische Univ. Eindhoven (Netherlands); Joost Peters, Stefan Kuiper, Sasan Keyvani, Rob Willekers, TNO (Netherlands)
Show Abstract
CD and OCD sampling scheme optimization for HVM environment
Paper 10959-86
Time: 5:30 PM - 7:30 PM
Author(s): Chanha Park, SK Hynix (Korea, Republic of); Hongoo Lee, SK Hynix, Inc. (Korea, Republic of); Dongyoung Lee, Ahlin Choi, SK Hynix (Korea, Republic of); Stefan Buhl, Wan-Soo Kim, Philip Groeger, Steffen Guhlemann, Qoniac GmbH (Germany); Seop Kim, Mingyu Kim, Qoniac Korea Ltd. (Korea, Republic of)
Show Abstract
Deep learning's impact on pattern matching for design based metrology and design based inspection
Paper 10959-87
Time: 5:30 PM - 7:30 PM
Author(s): Shuyang Dou, Shinichi Shinoda, Masayoshi Ishikawa, Ryou Yumiba, Yasutaka Toyoda, Hitachi, Ltd. (Japan); Hiroyuki Shindo, Masayuki Izawa, Hitachi High-Technologies Corp. (Japan); Masanori Ouchi, Hitachi (Japan)
Show Abstract
New imaging technique that enables detection of buried defects
Paper 10959-88
Time: 5:30 PM - 7:30 PM
Author(s): Vadim Kuchik, Dror Shemesh, Applied Materials Israel, Ltd. (Israel); Shinsuke Mizuno, Kenji Aoyama, Applied Materials Japan, Inc. (Japan); Oren Shua, Applied Materials Israel, Ltd. (Israel)
Show Abstract
Study on a feasibility of dark-field illumination for the near-field microscope
Paper 10959-89
Time: 5:30 PM - 7:30 PM
Author(s): Hangyeong Oh, Myongji Univ. (Korea, Republic of); Woojun Han, Myongji Univ. (Korea, Republic of); Yungi Lee, FST (Korea, Republic of); Jaisoon Kim, Myongji Univ. (Korea, Republic of)
Show Abstract
The effect of the underlayer roughness on the roughness of the ultrathin hafnium oxide film
Paper 10959-90
Time: 5:30 PM - 7:30 PM
Author(s): Jung-Hwan Kim, Korea Basic Science Institute (Korea, Republic of); Seunghyun Moon, Seoul National Univ. (Korea, Republic of), Korea Research Institut of Standards and Science (Korea, Republic of); Youn Sang Kim, Seoul National Univ. (Korea, Republic of), Advanced Institutes of Convergence Technology (Korea, Republic of); ChaeHo Shin, Korea Research Institute of Standards and Science (Korea, Republic of)
Show Abstract
Enhanced wafer overlay residuals control; deep sub-nanometer at sub-millimeter lateral resolution
Paper 10959-91
Time: 5:30 PM - 7:30 PM
Author(s): Avi Cohen, Carl Zeiss SMS Ltd. (Israel); Philippe Leray, Eren Canga, IMEC (Belgium); Vladimir Dmitriev, Kujan Gorhad, Yael Sufrin, Carl Zeiss SMS Ltd. (Israel)
Show Abstract
Area-framing optical defect review under optical resolution using multi-NA dark-field microscopy images
Paper 10959-92
Time: 5:30 PM - 7:30 PM
Author(s): Jun Ho Lee, Kongju National Univ. (Korea, Republic of); Junhee Jeong, Chirs Park, Nextin Inc. (Korea, Republic of); SHIN-WOONG PARK, HWI Kim, Korea University (Korea, Republic of)
Show Abstract
YieldStar uDBO overlay metrology in Samsung D1y DRAM volume production
Paper 10959-93
Time: 5:30 PM - 7:30 PM
Author(s): Jang-Sun Kim, SAMSUNG Electronics Co., Ltd. (Korea, Republic of); Jin-Moo Byun, ASML Korea Co., Ltd. (Korea, Republic of); Remco Lancee, ASML Netherlands B.V. (Netherlands); Jong-Hyun Hwang, Hyeon-Jun Ha, SAMSUNG Electronics Co., Ltd. (Korea, Republic of); Kwang Young Hu, ASML Korea Co., Ltd. (Korea, Republic of); Se-Ra Jeon, ASML Netherlands B.V. (Korea, Republic of); Won-Jae Jang, Hyung-Sub Son, ASML Korea Co., Ltd. (Korea, Republic of); Vidar van der Meijden, Marc Noot, Bartosz Foltynski, Lukasz Macht, Grzegorz Grzela, Cedric Grouwstra, ASML Netherlands B.V. (Netherlands)
Show Abstract
New Method removing SEM image noise to characterize CD & LWR
Paper 10959-94
Time: 5:30 PM - 7:30 PM
Author(s): Shinji Kobayashi, Satoru Shimura, Masashi Enomoto, Tokyo Electron Kyushu Ltd. (Japan); Robert Kern, Timothy Diller, Tony McDaniel, Nan Qin, Roger Serwy, Enthought, Inc. (United States); Thomas Reay, Enthought (United States)
Show Abstract
Alignment sampling by thorough run-to-run simulation
Paper 10959-95
Time: 5:30 PM - 7:30 PM
Author(s): Alex Ren, Ding Kai, Intel Semiconductor (Dalian) Ltd. (China); Boris Habets, Steffen Guhlemann, Norman Birnstein, Alexander Mühle, Patrick Lomtscher, Qoniac GmbH (Germany); Rex H. Liu, Qoniac Taiwan Ltd. (Taiwan)
Show Abstract
Overlay Run-2-Run control based on device structure measured overlay in DRAM HVM
Paper 10959-96
Time: 5:30 PM - 7:30 PM
Author(s): Hsiao Lun Chu, Foster Huang, Nanya Technology Corp. (Taiwan); Steven Tottewitz, Boris Habets, Patrick Lomtscher, Qoniac GmbH (Germany); Hsiao-Lin Hsu, Afu Chiu, Rex H. Liu, Qoniac Taiwan Ltd. (Taiwan)
Show Abstract
Analysis and modelling of patterned wafer nano-topography using multiple linear regression on design GDS and silicon PWG data
Paper 10959-97
Time: 5:30 PM - 7:30 PM
Author(s): Mehdi Kessar, Bertrand Le-Gratiet, STMicroelectronics S.A. (France); Pierre Lemaire, Lab. des Sciences pour la Conception, l'Optimisation et la Production de Grenoble (France); Virginie BROUZET, Delphine LE CUNFF, Victor GREDY, STMicroelectronics S.A. (France)
Show Abstract
Uniformity analysis of three-dimensional characteristics by CD-SEM for improving process development
Paper 10959-98
Time: 5:30 PM - 7:30 PM
Author(s): Yuki Ojima, Hitachi High-Technologies Corp. (Japan); Wataru Nagatomo, Hitachi High-Technologies America, Inc. (United States); Katsumi Setoguchi, Daisuke Hibino, Hitachi High-Technologies Corp. (Japan)
Show Abstract
Macro CDSEM 2D metrology supporting advance DRAM patterning process
Paper 10959-99
Time: 5:30 PM - 7:30 PM
Author(s): Roman Kris, Ishai Schwarzband, Grigory Klebanov, Elad Sommer, Liraz Gershtein, Bobin Mathew, Efrat Noifeld, Shimon Levy, Ran Alkoken, Olga Novak, Applied Materials Israel, Ltd. (Israel); Hiroshi Miroku, Applied Materials, Inc. (Japan); Dhananjay Rathore, Applied Materials, Inc. (United States); Sharon Duvdevani-Bar, Applied Materials, Inc. (Israel)
Show Abstract
Intra-field alignment for overlay feed-forward simulation with sampling optimization
Paper 10959-101
Time: 5:30 PM - 7:30 PM
Author(s): Cheng Hao Yang, Chun Chi Yu, United Microelectronics Corp. (Taiwan); Patrick Lomtscher, Martin Freitag, Steven Tottewitz, Boris Habets, Qoniac GmbH (Germany); Hsiao Lin Hsu, Rex H. Liu, Qoniac Taiwan Ltd. (Taiwan)
Show Abstract
In-depth analysis and research of additional components of the uncertainty budget using the finite element method
Paper 10959-102
Time: 5:30 PM - 7:30 PM
Author(s): Volodymyr V. Skliarov, National Scientific Ctr. "Institute of Metrology" (Ukraine), O.M. Beketov National Univ. of Urban Economy in Kharkiv (Ukraine)
Show Abstract
Characterization of STEM alignments and their automation
Paper 10959-103
Time: 5:30 PM - 7:30 PM
Author(s): Ashley Tilson, Thermo Fisher Scientific Inc. (United States); Silvia Aerts, Thermo Fisher Scientific Inc. (Netherlands)
Show Abstract
Analyze line roughness sources using power spectral density (PSD)
Paper 10959-104
Time: 5:30 PM - 7:30 PM
Author(s): Lingling Pu, Teng Wang, Hermes-Microvision Inc., USA (United States); Thomas J. Huisman, Ruben Maas, Maikel Goosen, Harm Dillen, ASML Netherlands B.V. (Netherlands); Philippe Leray, IMEC (Belgium); Wei Fang, Hermes-Microvision Inc., USA (United States)
Show Abstract
A diffraction-based overlay model based on FDTD method
Paper 10959-105
Time: 5:30 PM - 7:30 PM
Author(s): Buqing Xu, Ling Ma, Univ. of Chinese Academy of Sciences (China); Xiongfeng Zou, University of Chinese Academy of Sciences (China); Lisong Dong, Yayi Wei, Institute of Microelectronics (China)
Show Abstract
Verification and analysis of FEM for measurement of temperature distribution through the multilayer wall
Paper 10959-106
Time: 5:30 PM - 7:30 PM
Author(s): Volodymyr V. Skliarov, Pavel Neyezhmakov, National Scientific Ctr. "Institute of Metrology" (Ukraine), O.M. Beketov National Univ. of Urban Economy in Kharkiv (Ukraine); Alexander Prokopov, National Scientific Ctr. "Institute of Metrology" (Ukraine)
Show Abstract
A large field of view metrology SEM for massive CD measurement
Paper 10959-108
Time: 5:30 PM - 7:30 PM
Author(s): Fei Wang, Hermes-Microvision Inc., USA (United States); Nicola Kissoon, ASML (Belgium); Yi-Hsin Chang, Lingling Pu, Hermes-Microvision Inc., USA (United States); Stijn Schoofs, imec (Belgium); Harm Dillen, ASML Netherlands B.V. (Netherlands); Marc Kea, Amit Siany, Hermes-Microvision Inc., USA (United States)
Show Abstract
Denoising line edge roughness measurement using hidden Markov models
Paper 10959-112
Time: 5:30 PM - 7:30 PM
Author(s): George Papavieros, Institute of Nanoscience and Nanotechnology (Greece), Nanometrisis p.c. (Greece), Aristotle Univ. of Thessaloniki (Greece); Ioannis Kontoyiannis, Univ. of Cambridge (United Kingdom), Athens Univ. of Economics and Business (Greece); Vassilios Constantoudis, Evangelos Gogolides, Institute of Nanoscience and Nanotechnology (Greece), Nanometrisis p.c. (Greece)
Show Abstract
Defect learning with predictive sampling for process improvement
Paper 10959-113
Time: 5:30 PM - 7:30 PM
Author(s): Ian Tolle, Julie Lee, Dave Salvador, GLOBALFOUNDRIES Inc. (United States); Barry Saville, KLA-Tencor New York (United States); Poh Boon Yong, KLA-Tencor Corp. (United States); Gino Marcuccilli, KLA-Tencor England (United Kingdom)
Show Abstract
First demonstration of a 331-beam SEM
Paper 10959-114
Time: 5:30 PM - 7:30 PM
Author(s): Christof Riedesel, Ingo Müller, Nicolas Kaufmann, Andreas Adolf, Nico Kaemmer, Hans Fritz, Anna Lena Eberle, Dirk Zeidler, Carl Zeiss Microscopy GmbH (Germany)
Show Abstract
Thursday 28 February Show All Abstracts
Session 12:
Design Interactions with Metrology: Joint session with conferences 10959 and 10962
Thursday 28 February 2019
8:00 AM - 10:00 AM
Location: Convention Center, Grand Ballroom 220B
Session Chairs:
John A. Allgair, BRIDG (United States) ;
Ryoung-Han R. Kim, IMEC (Belgium)
AI: from deep learning to in-memory computing (Keynote Presentation)
Paper 10959-53
Time: 8:00 AM - 8:40 AM
Author(s): Hsiang-Lan Lung, Macronix (United States)
Show Abstract
Critical defect detection, monitoring and fix through process integration engineering by using D2DB pattern monitor solution
Paper 10962-20
Time: 8:40 AM - 9:00 AM
Author(s): Ming Tian, Yu Zhang, Tiapeng Guan, Jianghua Leng, Baojun Zhao, Lei Yan, Wei Hua, Shanghai Huali Microelectronics Corp. (China); Abhishek Vikram, Anchor Semiconductor, Inc. (United States); Guojie Chen, Hui Wang, Gary Zhang, Wenkui Liao, Anchor Semiconductor, Inc. (China)
Show Abstract
Massive metrology and failure identification for DRAM applications
Paper 10959-54
Time: 9:00 AM - 9:20 AM
Author(s): Harm Dillen, Dorothe Oorschot, Marleen Kooiman, Willem van Mierlo, Ziyang Wang, ASML Netherlands B.V. (Netherlands); Kang-San Lee, Jin-Woo Lee, ASML Korea Co., Ltd. (Korea, Republic of); Ruochong Fei, Shu-Yu Lai, Marc Kea, Hermes-Microvision Inc., USA (United States); Inhwan Lee, Hwan Kim, Junghyun Kang, Jaehee Hwang, Chang-Moon Lim, SK Hynix, Inc. (Korea, Republic of)
Show Abstract
Mark sensitivity of uDBO and IBO in advanced DRAM node
Paper 10962-21
Time: 9:20 AM - 9:40 AM
Author(s): Chun-Wei Chen, ASML Taiwan Ltd. (Taiwan); Kuo-Yao Chou, Venky Subramony, Szu-Fan Yang, Micron Technology Taiwan (Taiwan)
Show Abstract
3D optical proximity model optimization using inline 3DSEM metrology
Paper 10959-55
Time: 9:40 AM - 10:00 AM
Author(s): Shimon Levi, Applied Materials Israel, Ltd. (Israel); Hans-Jurgen Stock, Wolfgang Demmerle, Synopsys GmbH (Germany)
Show Abstract
Coffee Break 10:00 AM - 10:20 AM
2019 Karel Urbánek Best Student Paper Award Presentation
Thursday 28 February 2019
10:20 AM - 10:30 AM
Location: Convention Center, Grand Ballroom 220B
Session Chairs:
Vladimir A. Ukraintsev, Qorvo (United States) ;
Ofer Adan, Applied Materials Israel, Ltd. (Israel)

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Session 13:
Process Control
Thursday 28 February 2019
10:30 AM - 12:10 PM
Location: Convention Center, Grand Ballroom 220B
Session Chairs:
Philippe Leray, IMEC (Belgium) ;
Alexander Starikov, I&I Consulting (United States)
Contour based metrology: getting more from a SEM image
Paper 10959-56
Time: 10:30 AM - 10:50 AM
Author(s): Bertrand Le-Gratiet, Regis Bouyssou, Julien Ducoté, Christophe Dezauzier, Alain Ostrovsky, Charlotte Beylier, STMicroelectronics S.A. (France); Christian Gardin, STMiroelectronics S.A. (France); Paolo Petroni, Matthieu Milléquant, Alexandre Chagoya-Garzon, Patrick Schiavone, ASELTA Nanographics (France)
Show Abstract
Scatterometry and AFM measurement combination for area selective deposition process characterization
Paper 10959-57
Time: 10:50 AM - 11:10 AM
Author(s): Mohamed Saib, Alain Moussa, IMEC (Belgium); Joey Hung, Roy Koret, Nova Measuring Instruments Ltd. (Israel); Shaoren Deng, Andrea Illiberi, Jan Willem Maes, ASM Belgium N.V. (Belgium); Anne-Laure Charley, Philippe Leray, IMEC (Belgium)
Show Abstract
Localized power spectral density analysis on atomic force microscopy images for advanced patterning applications
Paper 10959-58
Time: 11:10 AM - 11:30 AM
Author(s): Alain Moussa, Mohamed Saib, Sara Paolillo, Frederic Lazzarino, IMEC (Belgium); Andrea Illiberi, Shaoren Deng, Jan Willem Maes, ASM Belgium N.V. (Belgium); Anne-Laure Charley, Philippe Leray, IMEC (Belgium)
Show Abstract
Focus budget improvement using optimized wafer edge settings
Paper 10959-59
Time: 11:30 AM - 11:50 AM
Author(s): Lucas Lamonds, Bryan Orf, Micron Technology, Inc. (United States); Xaver Thrun, Georg Erley, Philip Groeger, Boris Habets, Qoniac GmbH (Germany); Michael Frachel, Micron Technology (United States); Alexander Muehle, Qoniac GmbH (Germany)
Show Abstract
New approach for APC and measurement sampler interaction in a complex process mix logic fab
Paper 10959-60
Time: 11:50 AM - 12:10 PM
Author(s): Laurent Lecarpentier, Aymen Mili, Jean De-Caunes, Bertrand Le-Gratiet, STMicroelectronics S.A. (France)
Show Abstract
Lunch Break 12:10 PM - 1:30 PM
Session 14:
Inspection II
Thursday 28 February 2019
1:30 PM - 3:10 PM
Location: Convention Center, Grand Ballroom 220B
Session Chairs:
Masafumi Asano, Tokyo Electron Ltd. (Japan) ;
Xiaomeng Chen, Taiwan Semiconductor Manufacturing Co. Ltd. (Taiwan)
Multiple beam inspection(MBI) for 7nm node and beyond: technologies and applications
Paper 10959-61
Time: 1:30 PM - 1:50 PM
Author(s): Eric Long Ma, Kevin Chou, Martin Ebert, Xuedong Liu, Weiming Ren, Xuerang Hu, Martijn Maassen, Weihua Yin, Aiden Chen, Fei Wang, Hermes-Microvision Inc., USA (United States); Oliver Patterson, Hermes-Microvision Inc. (United States)
Show Abstract
Optical and SEM inspection methods addressing EUV pattern fidelity challenges
Paper 10959-62
Time: 1:50 PM - 2:10 PM
Author(s): Shimon Levi, Aner Avakrat, Applied Materials Israel, Ltd. (Israel)
Show Abstract
Prediction of signal characteristics for defect inspection using SEM image simulator
Paper 10959-63
Time: 2:10 PM - 2:30 PM
Author(s): Toshiyuki Yokosuka, Chahn Lee, Hitachi, Ltd. (Japan); Koichi Kurosawa, Hajime Kawano, Hideyuki Kazumi, Hitachi High-Technologies Corp. (Japan)
Show Abstract
Voltage contrast edge placement estimation for overlay, CD, and local uniformity metrology
Paper 10959-64
Time: 2:30 PM - 2:50 PM
Author(s): Cyrus E. Tabery, ASML US, Inc. (United States); Vito Rutigliani, IMEC (Belgium); Simon Hastings, ASML US (United States); Etienne de Poortere, ASML US (Netherlands); Luke Wang, Hermes Microvision (United States); Philippe Leray, Guillaume Schelcher, IMEC (Belgium); Yongjun Wang, ASML US (United States)
Show Abstract
Process window discovery methodology for extreme ultraviolet (EUV) lithography
Paper 10959-65
Time: 2:50 PM - 3:10 PM
Author(s): Sandip Halder, IMEC (Belgium); Kaushik Sah, Andrew Cross, KLA-Tencor Corp. (United States); Christophe Beral, IMEC (Belgium); Antonio Mani, KLA-Tencor Corp. (United States); Philippe Leray, Dieter Van den Heuvel, IMEC (Belgium); Vidyasagar Anantha, KLA-Tencor Corp. (United States)
Show Abstract
Coffee Break 3:10 PM - 3:40 PM
Session 15:
Optical Metrology and Late News
Thursday 28 February 2019
3:40 PM - 5:40 PM
Location: Convention Center, Grand Ballroom 220B
Session Chairs:
Ofer Adan, Applied Materials Israel, Ltd. (Israel) ;
Vladimir A. Ukraintsev, Qorvo (United States)
Effect of aperture stop location, illumination wavelength, and objective design for improved illumination in optical microscopes
Paper 10959-66
Time: 3:40 PM - 4:00 PM
Author(s): Ravi Kiran Attota, Emil Agocs, National Institute of Standards and Technology (United States)
Show Abstract
Influence of sidewall perturbations of CD-SEM line roughness metrology
Paper 10959-67
Time: 4:00 PM - 4:20 PM
Author(s): Benjamin D. Bunday, aBeam Technologies, Inc. (United States); Chris A. Mack, Lithiguru.com (United States)
Show Abstract
Spectroscopic reflectometry in the EUV for critical dimension metrology
Paper 10959-68
Time: 4:20 PM - 4:40 PM
Author(s): Lukas Bahrenberg, Serhiy Danylyuk, RWTH Aachen Univ. (Germany); Robert Michels, Fraunhofer-Institut für Lasertechnik (Germany); Sven Glabisch, Moein Ghafoori, Sascha Brose, RWTH Aachen Univ. (Germany); Jochen Stollenwerk, Peter Loosen, Fraunhofer-Institut für Lasertechnik (Germany)
Show Abstract
Visualization of 3D structure of semiconductor device by Dig and See using GFIS-SIM
Paper 10959-69
Time: 4:40 PM - 5:00 PM
Author(s): Shinichi Matsubara, Hitachi, Ltd. (Japan)
Show Abstract
Deep learning nanometrology of line edge roughness
Paper 10959-109
Time: 5:00 PM - 5:20 PM
Author(s): Vassilios Constantoudis, Institute of Nanoscience and Nanotechnology (Greece), Nanometrisis p.c. (Greece); George Papavieros, Institute of Nanoscience and Nanotechnology (Greece), Nanometrisis p.c. (Greece), Univ. of Thessaloniki (Greece); Eva Giannatou, Harris Papagrorgiou, Institute for Language and Speech Processing (Greece); Gian Francesco Lorusso, Vito Rutigliani, Frieda van Roey, IMEC (Belgium); Evangelos Gogolides, Institute of Nanoscience and Nanotechnology (Greece), Nanometrisis p.c. (Greece)
Show Abstract
Novel method to achieve CD modeling in the presence of higher diffraction orders
Paper 10959-110
Time: 5:20 PM - 5:40 PM
Author(s): Liequan Lee, Shankar Krishnan, KLA-Tencor Corp. (United States); Chi-Fu Yen, Shyh-Shii Pai, Taiwan Semiconductor Manufacturing Co. Ltd. (Taiwan); Nick Weihan Chang, Hsien-Hung Chang, Li-Shiuan Tsai, Sheng-Yang Tseng, Jan-Hau Chang, Yung-Hsiang Lin, Taiwan Semiconductor Manufacturing Co. Ltd. (China); Chu-Han Chiu, KLA-Tencor Taiwan (Taiwan); Phillip Atkins, KLA-Tencor Corp. (United States)
Show Abstract
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