San Jose Marriott and San Jose Convention Center
San Jose, California, United States
21 - 25 February 2021
Conference AL101
Extreme Ultraviolet (EUV) Lithography XII
Conference Committee
Important Dates
Abstract Due:
2 September 2020

Author Notification:
19 October 2020

Manuscript Due Date:
27 January 2021

Conference Cosponsors
Conference Cosponsor
Call for
After more than three decades of research and development, Extreme Ultraviolet Lithography (EUVL) has entered the manufacturing phase. With that transition comes the challenges of yield, as well as extensibility of the technology. With use in both logic and DRAM manufacturing, what’s next? Multiple challenges need to be solved to ensure the extensibility of EUV lithography to meet the requirements of future logic and memory nodes. Examples include:
  • Tool stability and productivity
  • Improving mask materials, patterning, and defect mitigation
  • Improving mask and wafer-level metrology
  • Understanding EUV resist chemistry and improving resist resolution, sensitivity, and variability
  • Understanding all sources of stochastics variability and minimizing their impact on yield
  • Understanding how EUV patterning stacks integrate with process variability and design requirements
  • Concepts for EUV dimensional scaling, including higher NA and multipatterning

Simultaneously, the semiconductor patterning community is looking toward the future with higher numerical aperture EUV imaging and EUV-based multiple exposure techniques. Beyond the current nodes, progress will require innovative approaches in EUV sources, for both higher power and availability, continued development of mask architecture and imaging materials, and consideration of the creation of imaging systems, resists, and masks for higher numerical apertures or magnifications.

The Extreme Ultraviolet Lithography conference continues to be the leading forum for scientists and engineers from around the world to present and discuss research on the advancement of EUV lithography technologies. This conference welcomes submissions of original papers that emphasize recent technological advances, demonstrations, and investigations in the many related research areas, including efforts toward commercialization.

Technical and scientific papers advancing the state of the art in EUV Lithography in the following areas are solicited:

  • integration learning and yield
  • patterning stacks and etch transfer
  • patterning defects
  • resolution enhancement techniques
  • EUV impact on design optimization
  • in-fab inspection and control
  • multi-patterning EUVL
  • imaging simulations and source-mask optimization
  • OPC relevant effects, models, and computational techniques
  • extendibility and future of EUV lithography
  • substrates and blanks
  • aerial imaging, patterned, and blank mask inspection
  • actinic, e-beam, and DUV inspection methods
  • defect mitigation and repair
  • absorber materials and patterning
  • mask roughness
  • pellicle development and platform integration
  • architectures for higher numerical apertures
  • mask writing techniques
Exposure Tools
  • tool design and innovation
  • throughput, defectivity and productivity
  • imaging performance
  • focus, dose, and overlay control
  • aberrations, flare, and out-of-band light
  • high-NA or anamorphic imaging systems
  • power scaling
  • efficiency and reliability
  • source characterization
  • source collectors, cleaning, and lifetime
EUV Resists
  • resolution
  • design for stochastics
  • sensitivity improvement
  • negative-tone platforms
  • emerging organic and inorganic materials and novel chemistries
  • high NA
  • novel materials and developers
  • defectivity characterization and control
  • resist fundamentals and experimental studies of EUV radiation chemistry
  • modeling and simulations.
Students submitting papers to AL101 (EUV Lithography) and AL105 (Optical Microlithography) will be considered for the ASML Best Student Paper. This award is given each year at this conference and recognizes extraordinary work achieved by students interested in the microlithography field, and strongly supports the contributions made to scientific advancement at the conference. The award includes a plaque along with a monetary award to help the student's future research activities.
Conference Committee
Conference Chair
Conference Co-Chair
Program Committee
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