San Jose Convention Center
San Jose, California, United States
24 - 28 February 2019
Conference 10963
Advanced Etch Technology for Nanopatterning VIII
Monday - Tuesday 25 - 26 February 2019
Conference
Committee
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Conference Chair
Conference Co-Chair
  • Catherine B. Labelle, Intel Corp. (United States)

Program Committee
  • Efrain Altamirano-Sánchez, IMEC (Belgium)
  • Keun Hee Bai, SAMSUNG Electronics Co., Ltd. (Korea, Republic of)
  • Julie Bannister, Tokyo Electron America, Inc. (United States)
  • Maxime Darnon, LN2 CNRS (Canada)
  • Sebastian U. Engelmann, IBM Thomas J. Watson Research Ctr. (United States)
  • Eric A. Hudson, Lam Research Corp. (United States)
  • Kaushik A. Kumar, Tokyo Electron Ltd. (Japan)

Program Committee continued...
Monday 25 February Show All Abstracts
AL19 Plenary Session
Monday 25 February 2019
8:00 AM - 10:30 AM
Location: Convention Center, Grand Ballroom 220A

8:00 am to 8:30 am

Welcome and Announcements
Symposium Chairs: Will Conley, Cymer, An ASML Company (USA), and Kafai Lai, IBM T. J. Watson Research Ctr. (USA)

    *Introduction of New SPIE Fellows
    *Presentation of the Zernike Awards
    *Presentation of the Nick Cobb Memorial Scholarship
The Future is Quantum (Plenary Presentation)
Paper 10957-500
Time: 8:30 AM - 9:10 AM
Author(s): Dario Gil, IBM Research (United States)
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3D NAND flash technology: roadmap, process, design, and challenges (Plenary Presentation)
Paper 10957-501
Time: 9:10 AM - 9:50 AM
Author(s): Jeongdong Choe, Techinsights (Canada)
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Patterning in the Stressful World of 3D NAND (Plenary Presentation)
Paper 10957-502
Time: 9:50 AM - 10:30 AM
Author(s): Steven E. Steen, ASML (Netherlands)
Show Abstract
Coffee Break 10:30 AM - 11:00 AM
Session 1:
Keynote Session: Plasma Based Patterning Innovations
Monday 25 February 2019
1:30 PM - 3:30 PM
Location: Convention Center, Room 211B
Session Chairs:
Efrain Altamirano-Sánchez, IMEC (Belgium) ;
Keun Hee Bai, SAMSUNG Electronics Co., Ltd. (Korea, Republic of)
Patterning paradigm shift: from addition of two to the power of two (Keynote Presentation)
Paper 10963-1
Time: 1:30 PM - 2:10 PM
Author(s): Mircea V. Dusa, ASML Belgium N.V. (Belgium)
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Combining equipment sensors and control hardware with metrology and advanced computational methods for comprehensive 3D process control (Keynote Presentation)
Paper 10963-2
Time: 2:10 PM - 2:50 PM
Author(s): David Fried, Coventor, Inc., A Lam Research Company (United States); Dan Simon, Boaz Kenane, Lam Research Corp. (United States); Michael Jamiolkowski, Coventor, Inc. (United States); Andrew Bailey, Lam Research Corp. (United States); Marcus Carbery, Lam Research Corp. (Ireland); Lisheng Gao, Lam Research Corporation (United States); Ye Feng, Atashi Basu, Jiangtao Hu, Jason R. Shields, Richard A. Gottscho, Lam Research Corp. (United States)
Show Abstract
Etch aware computational patterning in the era of atomic precision processing (Keynote Presentation)
Paper 10963-3
Time: 2:50 PM - 3:30 PM
Author(s): Peter Ventzek, Tokyo Electron America, Inc. (United States); Alok Ranjan, TEL Technology Ctr., America, LLC (United States); Jun Shinagawa, Tokyo Electron America (United States)
Show Abstract
Coffee Break 3:30 PM - 4:00 PM
Session 2:
Materials and Etch Integration
Monday 25 February 2019
4:00 PM - 6:00 PM
Location: Convention Center, Room 211B
Session Chairs:
Eric A. Hudson, Lam Research Corp. (United States) ;
Kaushik A. Kumar, Tokyo Electron Ltd. (Japan)
Fabrication challenges and opportunities for high-mobility materials: from CMOS applications to emerging derivative technologies (Invited Paper)
Paper 10963-4
Time: 4:00 PM - 4:40 PM
Author(s): Nadine Collaert, Alireza Alian, Brice De Jaeger, Uthayasankararan Peralagu, Abhitosh Vais, Amey Walke, Liesbeth Witters, IMEC (Belgium); Hao Yu, IMEC (Belgium), KU Leuven (Belgium); Elena Capogreco, Katia Devriendt, Toby Hopf, Karine Kenis, Geert Mannaert, Alexey P. Milenin, Antony Peter, Farid Sebaai, Lieve Teugels, Dennis van Dorp, Kurt Wostyn, Naoto Horiguchi, Niamh Waldron, IMEC (Belgium)
Show Abstract
Metal organic cluster photoresists: new metal oxide systems (Invited Paper)
Paper 10963-5
Time: 4:40 PM - 5:20 PM
Author(s): Kazunori Sakai, Seok-Heon Jung, Wenyang Pan, Emmanuel Giannelis, Christopher K. Ober, Cornell Univ. (United States)
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SPARC: a novel technology for depositing conformal dielectric thin films with compositional tuning for etch selectivity (Invited Paper)
Paper 10963-6
Time: 5:20 PM - 6:00 PM
Author(s): Bhadri Varadarajan, Lam Research (United States)
Show Abstract
Tuesday 26 February Show All Abstracts
Session 3:
Patterning Process Control and Computational Patterning
Tuesday 26 February 2019
1:30 PM - 3:10 PM
Location: Convention Center, Room 211B
Session Chairs:
Ricardo Ruiz, HGST, Inc. (United States) ;
Yuyang Sun, Mentor, a Siemens Business (United States)
Scanner and etch co-optimized corrections for better overlay and CD control
Paper 10963-7
Time: 1:30 PM - 1:50 PM
Author(s): Ik-Hyun Jeong , Seung-Woo Koo, Hyun-Sok Kim, Jae-Wuk Ju, Young-Sik Kim, Yong-Tae Cho, Heung-Joo Kim, SK Hynix, Inc. (Korea, Republic of); Katja Viatkina, Tom van Hemert, Ruud de Wit, David Deckers, Owen Chen, Nang-Lyeom Oh, ASML Netherlands B.V. (Netherlands); Marcus Musselman, Marcus Carbery, Ssuwei Chen, Lucian Schmidt, Heidi Kwon, Jae Gyoo Lee, Lam Research Corp. (United States)
Show Abstract
Predicting and optimizing etch recipes for across the wafer uniformity
Paper 10963-8
Time: 1:50 PM - 2:10 PM
Author(s): Meghali Chopra, Roger Bonnecaze, Yang Ban, Sofia Helpert, SandBox Semiconductor (United States)
Show Abstract
Effective metal cleaning to increase MTBC by scanning ECR plasma (Conference Presentation)
Paper 10963-9
Time: 2:10 PM - 2:30 PM
Author(s): Kosa Hirota, Nanako Tamari, Shigeru Shirayone, Masahiro Sumiya, Hitachi High-Technologies Corp. (Japan)
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Integrated atomic scale CD control and local variability reduction techniques
Paper 10963-10
Time: 2:30 PM - 2:50 PM
Author(s): Toru Hisamatsu, Takayuki Katsunuma, Yoshihide Kihara, Masanobu Honda, Tokyo Electron Miyagi Ltd. (Japan)
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Using machine learning technology to accelerate the development of plasma etching processes
Paper 10963-11
Time: 2:50 PM - 3:10 PM
Author(s): Alexandre Derville, Guillaume Gey, Julien Baderot, Sergio Martinez, Guilhem Bernard, Johann Foucher, POLLEN Metrology (France)
Show Abstract
Coffee Break 3:10 PM - 3:40 PM
Session 4:
Atomic Layer Etching and Novel Plasma Techniques
Tuesday 26 February 2019
3:40 PM - 5:20 PM
Location: Convention Center, Room 211B
Session Chairs:
Jake O'Gorman, Hitachi High Technologies America, Inc. (United States) ;
Catherine Labelle, Intel Corp. (United States)
Opportunities and Challenges Utilizing Atomic Layer Etch for Lead Edge Technology Metal Line Widths (Invited Paper)
(Canceled)
Paper 10963-12
Time: 3:40 PM - 4:20 PM
Author(s):
Show Abstract
Peculiarities of selective isotropic Si etch to SiGe for nanowire and GAA transistors
Paper 10963-13
Time: 4:20 PM - 4:40 PM
Author(s): Christopher Catano, TEL Technology Ctr., America, LLC (United States); Nicholas Joy, Christopher Talone, Shyam Sridhar, Sergey Voronin, Peter Biolsi, TEL Technology Ctr. (United States); Alok Ranjan, TEL Technology Ctr. (Japan)
Show Abstract
Isotropic atomic layer etching of ZnO using acetylacetone and O2 plasma (Conference Presentation)
Paper 10963-14
Time: 4:40 PM - 5:00 PM
Author(s): Alfredo Mameli, Marcel A. Verheijen, Adrie Mackus, Fred Roozeboom, Erwin W.M. M. Kessels, Technische Univ. Eindhoven (Netherlands)
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Across-wafer sub-1 nm critical dimension uniformity control by etch tool correction
Paper 10963-16
Time: 5:00 PM - 5:20 PM
Author(s): Changwoo Lee, Lam Research (United States)
Show Abstract
Wednesday 27 February Show All Abstracts
Session 5:
EUV Patterning and Etch: Joint session with conferences 10957 and 10963
Wednesday 27 February 2019
8:20 AM - 10:00 AM
Location: Convention Center, Grand Ballroom 220A
Session Chairs:
Rich S. Wise, Lam Research Corp. (United States) ;
Anna Lio, Intel Corp. (United States)
EUV line-space pattern defect mitigation simulation using Coventor SEMulator3D to enable exposure dose reduction
Paper 10963-17
Time: 8:20 AM - 8:40 AM
Author(s): Daniel Sobieski, Rich Wise, Yang Pan, David Fried, Jengyi Yu, Nader Shamma, Lam Research Corp. (United States)
Show Abstract
Line roughness improvements on EUV 36nm pitch pattern by plasma treatment method
Paper 10963-18
Time: 8:40 AM - 9:00 AM
Author(s): Toshiharu Wada, Akiteru Ko, Peter Biolsi, TEL Technology Ctr., America, LLC (United States)
Show Abstract
Staggered pillar patterning using 0.33NA EUV lithography
Paper 10957-25
Time: 9:00 AM - 9:20 AM
Author(s): Danilo De Simone, Romuald Blanc, Jeroen Van de Kerkhove, Amir-Hossein Tamaddon, Roberto Fallica, Lieve van Look, Nouredine Rassoul, Frederic Lazzarino, Nadia Vandenbroeck, Pieter Vanelderen, Gian Lorusso, Frieda van Roey, Anne-Laure Charley, Geert Vandenberghe, Kurt Ronse, IMEC (Belgium); Kilyoung Lee, Junghyung Lee, Sarohan Park, Chang-Moon Lim, SK Hynix, Inc. (Korea, Republic of); Chan-Ha Park, SK Hynix (Korea, Republic of)
Show Abstract
Post-lithography roughness and stochastic failures mitigation study for 32nm pitch EUV L/S (Invited Paper)
(Canceled)
Paper 10963-19
Time: 9:20 AM - 10:00 AM
Author(s):
Show Abstract
Coffee Break 10:00 AM - 10:30 AM
Session 6:
Patterning Solutions for Emerging Applications
Wednesday 27 February 2019
10:30 AM - 12:10 PM
Location: Convention Center, Room 211B
Session Chairs:
Nihar Mohanty, Oculus VR, LLC (United States) ;
Maxime Darnon, LN2 CNRS (Canada)
Neuromorphic computing: new circuits and integration challenges (Invited Paper)
(Canceled)
Paper 10963-20
Time: 10:30 AM - 11:10 AM
Author(s):
Show Abstract
Enabling complimentary FET (CFET) fabrication: selective, isotropic etch of Group IV semiconductors (Conference Presentation)
Paper 10963-21
Time: 11:10 AM - 11:30 AM
Author(s): Subhadeep Kal, TEL Technology Ctr., America, LLC (United States); Yusuke Oniki, IMEC (Belgium); Matthew Falugh, Cheryl Pereira, Qi Wang, TEL Technology Ctr., America, LLC (United States); Frank Holsteyns, IMEC (Belgium); Jeffrey T. Smith, Aelan Mosden, Kaushik A. Kumar, TEL Technology Ctr., America, LLC (United States); Juergen Boemmels, Julien Ryckaert, IMEC (Belgium); Peter Biolsi, Trace Q. Hurd, TEL Technology Ctr., America, LLC (United States)
Show Abstract
Ultrahigh selective etching of Si3N4 over SiO2 using plasma-less dry process for 3D-NAND device applications
Paper 10963-22
Time: 11:30 AM - 11:50 AM
Author(s): Chih-Yu Hsu, Peng Shen, Air Liquide Labs. (Japan); Nathan Stafford, Air Liquide Electronics (United States)
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Promises of metasurfaces and challenges in scaling to mass production (Conference Presentation)
Paper 10963-23
Time: 11:50 AM - 12:10 PM
Author(s): Robert C. Devlin, John W. Graff, Pawel Latawiec, Metalenz Inc. (United States)
Show Abstract
Lunch/Exhibition Break 12:10 PM - 1:40 PM
Session 7:
Advanced Patterning Integration
Wednesday 27 February 2019
1:40 PM - 3:20 PM
Location: Convention Center, Room 211B
Session Chairs:
Julie Bannister, Tokyo Electron America, Inc. (United States) ;
Nicolas Possémé, CEA-LETI (France)
Scaling below 3nm node: the 3D CMOS integration paradigm (Conference Presentation) (Invited Paper)
Paper 10963-24
Time: 1:40 PM - 2:20 PM
Author(s): Julien Ryckaert, imec (Belgium)
Show Abstract
Plasma etch selectivity study and material screening for self-aligned gate contact (SAGC)
Paper 10963-25
Time: 2:20 PM - 2:40 PM
Author(s): Dunja Radisic, IMEC (Belgium); Marc Demand, Shihsheng Chang, Tokyo Electron Ltd. (Japan); Steven Demuynck, IMEC (Belgium); Kaushik A. Kumar, Tokyo Electron Ltd. (Japan); Lieve Teugels, IMEC (Belgium); Andrew W. Metz, Junling Sun, Jeffrey T. Smith, Tokyo Electron Ltd. (Japan); Toby Hopf, Farid Sebaai, Efrain Altamirano-Sánchez, IMEC (Belgium)
Show Abstract
Virtual fabrication and advanced process control improve yield for SAQP process assessment with 16 nm half-pitch
Paper 10963-26
Time: 2:40 PM - 3:00 PM
Author(s): Benjamin Vincent, Coventor (France); Stephane Lariviere, Chris Wilson, Ryan Kim, imec (Belgium); Joseph Ervin, Coventor (France)
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Integrated self-aligned quadruple patterning flow for sub-7nm application
Paper 10963-27
Time: 3:00 PM - 3:20 PM
Author(s): Eric Liu, Akiteru Ko, Peter Biolsi, TEL Technology Ctr., America, LLC (United States)
Show Abstract
Coffee Break 3:20 PM - 3:50 PM
Session 8:
Patterning Solutions for Emerging Applications II
Wednesday 27 February 2019
3:50 PM - 5:10 PM
Location: Convention Center, Room 211B
Session Chairs:
Jake O'Gorman, Hitachi High Technologies America, Inc. (United States) ;
Qinghuang Lin, ASML US, Inc. (United States)
Line edge roughness increase in DSA patterning due to shrink of PMMA etching residue (Invited Paper)
Paper 10963-28
Time: 3:50 PM - 4:30 PM
Author(s): Makoto Satake, Hitachi High Technologies America, Inc. (United States); Naoyuki Kofuji, Hitachi, Ltd. (Japan); Kenji Maeda, Hitachi High Technologies America, Inc. (United States)
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Simulation and optimization of etch on flexible substrates for roll-to-roll processing
Paper 10963-29
Time: 4:30 PM - 4:50 PM
Author(s): Sofia Helpert, Yang Ban, Meghali Chopra, Roger Bonnecaze, SandBox Semiconductor (United States)
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Blazed x-ray reflection gratings using electron-beam lithography and ion milling (Conference Presentation)
Paper 10963-30
Time: 4:50 PM - 5:10 PM
Author(s): Drew M. Miles, Randall L. McEntaffer, Fabien Grise, Chad Eichfeld, Ross McCurdy, The Pennsylvania State Univ. (United States)
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