KLA-Tencor Corporation announces the eS805TM, a new electron-beam inspection system for leading-edge chip manufacturers. Benefiting from more than 20 years of KLA-Tencor's e-beam inspection development and manufacturing expertise, the eS805 offers strong capability in detection of very small defects and defects that cause electrical problems in the integrated circuit, such as opens, shorts or reliability issues. The eS805 is also designed to provide supplementary information to the fab's optical inspection systems, with the goal of boosting the ability of the optical inspectors to preferentially capture defects that matter.
The high performance of the new eS805 is driven by the following advances:
- New image computer, new auto-focus subsystem, and higher beam current densities than other commercially available systems, enabling detection of buried electrical defects in "voltage contrast" ("VC") mode over relatively large areas of the die;
- Architecture designed to elicit significant signal from defects hidden at the bottom of high aspect ratio (HAR) structures such as FinFETs and 3D flash; and
- Advanced algorithms that, together with the new image computer and auto-focus system, enable efficient capture of small defects within non-periodic structures, such as logic areas of the cell.
The eS805 is upgradeable from any previous eS3x or eS8xx-series e-beam inspection system, an approach that helps protect a fab's capital investment.