• Photomask Technology 2014
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Monterey Conference Center and Monterey Marriott
Monterey, California, United States
16 - 18 September 2014
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Plan to Attend

On behalf of SPIE, BACUS, and the Organizing Committee, we welcome you to the 33rd Annual SPIE Photomask Symposium in Monterey. California. This annual meeting continues to be the premier worldwide technical meeting for the photomask industry.

In 2014, mask making and mask makers continue to support the requirements for more complex optical extensions to support 10nm and below. These elements will continue to put pressure on the industry. The mask makers must excel at optical double/triple patterning, EUV, NIL, and all the other varieties of photolithography to support the wafer technology with patterning solutions. AS EUV lithography continues to move closer to volume manufacturing we shall focus on EUV reticles as a key enabler. We continue to discuss when and how 450mm wafers will impact the reticle industry.

The 34th Annual SPIE Photomask Symposium, organized by SPIE and BACUS, the International Technical Group of SPIE, provides the forum to present the newest findings, to discuss the most exciting trends, and to ponder reliable solutions in this rapidly developing industry and their effects on the semiconductor lithography.

Welcome to beautiful Monterey. Not only will you have a great experience attending the sessions, you will also have fun on the California Coast in the middle of its best season.


Paul Ackmann

Paul W. Ackmann
2014 Symposium Chair


Naoya Hayashi

Naoya Hayashi
Dai Nippon Printing Co., Ltd.
2014 Symposium Co-Chair




2014 BACUS Steering Committee

Frank Abboud, Intel Corp.
Paul C. Allen, Toppan Photomasks, Inc.
Michael D. Archuletta, RAVE LLC
Artur Balasinski, Cypress Semiconductor Corp.
Uwe F. W. Behringer, UBC Microelectronics
Peter D. Buck, Mentor Graphics Corp.
Brian Cha, Samsung
Glenn R. Dickey, Shin-Etsu MicroSi, Inc.
Brian J. Grenon, Grenon Consulting
Thomas B. Faure, IBM Corp.
Jon Haines, Micron Technology Inc.
Naoya Hayashi, Dai Nippon Printing Co., Ltd.
Mark Jee, HOYA Corp. USA
Bryan S. Kasprowicz, Photronics, Inc.
Oliver Kienzle, Carl Zeiss SMS GmbH
Patrick M. Martin, Applied Materials, Inc.
M. Warren Montgomery, College of Nanoscale Sciences & Engineering (CNSE)
Wilhelm Maurer, Infineon Technologies AG
Wilbert Odisho, KLA-Tencor, Inc.
Abbas Rastegar, SEMATECH North
Emmanuel Rausa, Plasma-Therm LLC
Douglas J. Resnick, Canon Technologies, Inc.
Bala Thumma, Synopsys, Inc.
Jacek K. Tyminski, Nikon Precision Inc.
Larry S. Zurbrick, Agilent Technologies, Inc.


Important Dates

Late Abstract Submissions will be considered by the Conference Chairs.

Manuscripts Due

18 August 2014

For questions about your presentation or the meeting, contact Pat Wight, the Conference Program Coordinator.

For questions about your manuscript only, please contact Joel Shields, the Conference Proceedings Coordinator

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