In 2014, mask making and mask makers continue to support the requirements for more complex optical extensions to support 10nm and below. These elements will continue to put pressure on the industry. The mask makers must excel at optical double/triple patterning, EUV, NIL, and all the other varieties of photolithography to support the wafer technology with patterning solutions. AS EUV lithography continues to move closer to volume manufacturing we shall focus on EUV reticles as a key enabler. We continue to discuss when and how 450mm wafers will impact the reticle industry.
The 34th Annual SPIE Photomask Symposium, organized by SPIE and BACUS, the International Technical Group of SPIE, provides the forum to present the newest findings, to discuss the most exciting trends, and to ponder reliable solutions in this rapidly developing industry and their effects on the semiconductor lithography.
As Symposium Chair and Symposium Co-Chair, we urge you to participate by submitting your abstracts, and to encourage your colleagues to participate, and most of all, encourage your company to continue to support Photomask technology.
It should be another great year in Monterey!
Paul W. Ackmann
2014 Symposium Chair
Dai Nippon Printing Co., Ltd.
2014 Symposium Co-Chair
2014 BACUS Steering Committee
Frank Abboud, Intel Corp.
Paul Ackmann, GLOBALFOUNDRIES Inc.
Paul C. Allen, Toppan Photomasks, Inc.
Michael D. Archuletta, RAVE LLC
Artur Balasinski, Cypress Semiconductor Corp.
Uwe F. W. Behringer, UBC Microelectronics
Peter D. Buck, Mentor Graphics Corp.
Brian Cha, Samsung
Glenn R. Dickey, Shin-Etsu MicroSi, Inc.
Brian J. Grenon, Grenon Consulting
Thomas B. Faure, IBM Corp.
Jon Haines, Micron Technology Inc.
Naoya Hayashi, Dai Nippon Printing Co., Ltd.
Mark Jee, HOYA Corp. USA
Bryan S. Kasprowicz, Photronics, Inc.
Oliver Kienzle, Carl Zeiss SMS GmbH
Patrick M. Martin, Applied Materials, Inc.
M. Warren Montgomery, College of Nanoscale Sciences & Engineering (CNSE)
Wilhelm Maurer, Infineon Technologies AG
Wilbert Odisho, KLA-Tencor, Inc.
Abbas Rastegar, SEMATECH North
Emmanuel Rausa, Plasma-Therm LLC
Douglas J. Resnick, Molecular Imprints, Inc.
Bala Thumma, Synopsys, Inc.
Jacek K. Tyminski, Nikon Precision Inc.
Larry S. Zurbrick, Agilent Technologies, Inc.