The 35th Annual SPIE Photomask Symposium, organized by SPIE and BACUS, the International Technical Group of SPIE, provides the forum to present the newest findings, to discuss the most exciting trends, and to ponder reliable solutions in this rapidly developing industry and their effects on the lithography.
In 2015, mask making and mask makers continue to support the requirements for more complex optical extensions to realize 10 nm and below. These elements will continue to put pressure on the industry. The mask makers must excel at optical multiple patterning, EUV, NIL, DSA and all the other varieties of photolithography to support the wafer technology with patterning solutions. As EUV lithography continues to move closer to volume manufacturing we shall focus on EUV reticles and related infrastructures as a key enabler. We also continue to discuss how 450mm wafers implementation, scaling of non-IC patterning such as display panel and MEMS, will impact the mask industry.
As Symposium Chair and Symposium Co-Chair, we urge you to participate by submitting your abstracts, and to encourage your colleagues to participate, and most of all, encourage your company to continue to support Photomask Technology.
Hope to see you again in Monterey!
Dai Nippon Printing Co., Ltd.
2015 Symposium Chair
Bryan S. Kasprowicz
2015 Symposium Co-Chair
2015 BACUS Steering Committee
Frank Abboud, Intel Corp.
Paul Ackmann, GLOBALFOUNDRIES Inc.
Paul C. Allen, Toppan Photomasks, Inc.
Michael D. Archuletta, RAVE LLC
Artur Balasinski, Cypress Semiconductor Corp.
Uwe F. W. Behringer, UBC Microelectronics
Peter D. Buck, Mentor Graphics Corp.
Brian Cha, Samsung Electronics Co., Ltd.
Michael Watt, Shin-Etsu MicroSi, Inc.
Thomas B. Faure, IBM Corp.
Brian J. Grenon, Grenon Consulting
Jon Haines, Micron Technology Inc.
Naoya Hayashi, Dai Nippon Printing Co., Ltd.
Mark Jee, HOYA Corp. USA
Bryan S. Kasprowicz, Photronics, Inc.
Patrick M. Martin, Applied Materials, Inc.
M. Warren Montgomery, College of Nanoscale Sciences & Engineering (CNSE)
Wilbert Odisho, KLA-Tencor, Inc.
Michael T. Postek, National Institute of Standards and Technology
Abbas Rastegar, SEMATECH North
Emmanuel Rausa, Consultant
Douglas J. Resnick, Canon Nanotechnologies, Inc.
Bala Thumma, Synopsys, Inc.
Jacek K. Tyminski, Nikon Research Corp. of America
Thomas Struck, Infineon Technologies AG
Jim N. Wiley, ASML US, Inc.
Larry S. Zurbrick, Keysight Technologies, Inc.