Editor-in-Chief
Burn J. Lin, TSMC, Ltd., Taiwan
Senior Editors
William H. Arnold, ASML, USA
Hans Peter Herzig, Univ. of Neuchatel, Switzerland
M. Edward Motamedi, Revoltech Microsystems, USA
Thomas J. Suleski, Univ. of North Carolina at Charlotte, USA
Associate Editors
Jos Benschop, ASML, Netherlands
Thomas G. Bifano, Boston Univ., USA
Franco Cerrina, Univ. of Wisconsin, USA
Will Conley, Freescale Semiconductor Inc., USA
Kevin Cummings, ASML, USA
Ralph Dammel, AZ Electronic Materials, USA
Roxann Engelstad, Univ. of Wisconsin, USA
Donis Flagello, ASML, USA
John Hartley, State University of New York, Albany, USA
Tokuyuki Honda, Canon, Inc., Japan
Greg Hughes, SEMATECH, Inc., USA
Winfried Kaiser, Carl Zeiss, Germany
Randall L. Kubena, HRL, USA
Timothy P. Kurzweg, Drexel Univ., USA
Robin Liu, CombiMatrix Corp., USA
Roya Maboudian, Univ. of California/Berkeley, USA
Chris Mack, USA
Shinji Okazaki, Hitachi, Ltd., Japan
Soichi Owa, Nikon, Japan
Ian Papautsky, Univ. of Cincinnati, USA
Moshe Preil, ASML, USA
Chris Progler, Photronics, Inc., USA
Rajeshuni Ramesham, Jet Propulsion Lab., USA
John Rogers, Univ. of Illinois at Urbana-Champaign, USA
Kurt Ronse, IMEC, Belgium
Frank Schellenberg, Mentor Graphics, USA
Harald Schenk, Fraunhofer Inst. für Photonische Mikrosysteme, Germany
Stefan Sinzinger, Technische Univ. Ilmenau, Germany
Jeffry Sniegowski, MEMX, Inc., USA
Kazuaki Suzuki, Nikon, Japan
Vijay K. Varadan, Univ. of Arkansas, USA
Steven T. Walsh, Univ. of New Mexico, USA
Alfred Wong, Magma Design Automation, USA
Anthony Yen, Cymer Inc., USA
Hans Zappe, Univ. of Freiburg, Germany