The Journal of Micro/Nanolithography, MEMS, and MOEMS (JM3) (formerly the Journal of Microlithography, Microfabrication, and Microsystems, 2002-2006) publishes peer-reviewed papers on the development of lithographic, fabrication, packaging, and integration technologies necessary to address the needs of the electronics, micro-optoelectromechanical systems, and photonics industries. The scope is broad to facilitate synergy and interest between the communities served by the journal.
Topical areas covered include: tools, processes, and materials associated with the lithography of structures that have submicrometer features; technologies to shape three-dimensional structures leading to the fabrication of active and passive electronic, electromechanical, optoelectronic, and opto-electro-mechanical devices, as well as passive optical devices; and core processes and technologies necessary for packaging and integration, with a focus on wafer-scale and other volume integration methods.
Key topics include:
- Optical lithography
- Emerging lithographic systems and techniques
- Resolution enhancement techniques
- Innovative illumination and aperture filtering schemes
- Antireflection coatings
- Optical proximity correction
- Critical-dimension control
- Alignment
- Defect reduction
- Yield improvement
- Resist technology and processing
- Metrology
- Inspection
- Binary and phase-shifting mask technology
- Etching and patterning technologies
- Plating technologies
- Replication
- Surface micromachining
- Bulk micromachining
- Focused ion beam technologies
- Fabrication and lithography for three-dimensional systems
- MEMS/MOEMS
- Micro-optics
- Novel package design
- Modeling
- Enabling materials
- Interconnect technology
- Integration processes
- Wafer-scale packaging
- Three-dimensional packaging
- Active and passive alignment
- Alignment structures
- Microassembly
- Structural integrity
- Microcooling systems
- Microsystem design and applications
In addition to contributed research papers, JM3 occasionally includes special section papers in key areas of technology. Special sections are assembled by guest editors. See the Editorial Schedule for a list of forthcoming special section topics and dates.
JM3 Utilizes e-First Publication
SPIE Journals are published online in an article-at-a-time (or e-First) publication mode.
- Authors benefit from an accelerated publication process, with articles being published online as they are approved.
- Researchers gain access to research much earlier compared to print publication.
Additionally, JM3 uses six-digit citation identifiers (CIDs) instead of page numbers. For more information, see the Citation Format page.
Impact Factor
Due to the journal's title change in 2007, JM3 received two impact factors for 2008:
Impact factor of old title (J. Microlith. Microfab. Microsyst.): 1.217
Impact factor of new title (J. Micro/Nanolith. MEMS MOEMS): 1.067
Unified impact factor for both titles: 1.142
Rankings:
Old title (J. Microlith. Microfab. Microsyst.):
27th out of 64 journals in Optics
36th out of 50 in Nanoscience & Nanotechnology
103rd out of 229 in Electrical & Electronic Engineering
91st out of 191 in Multidisciplinary Materials Science
New title (J. Micro/Nanolith. MEMS MOEMS):
30th out of 64 journals in Optics
39th out of 50 in Nanoscience & Nanotechnology
114th out of 229 in Electrical & Electronic Engineering
104th out of 191 in Multidisciplinary Materials Science
5-Year Impact Factor:
5-year impact factor of old title (J. Microlith. Microfab. Microsyst.): 1.024
5-year impact factor of new title (J. Micro/Nanolith. MEMS MOEMS): 1.100
For more information about how title changes affect impact factors, see the Thomson ISI website.
ISSN:
Current ISSN: 1932-5150 (print); 1932-5134 (online).
Previous ISSN (years 2002-2006)*: 1537-1646 (print); 1817-6461 (online).
*JM3 was published under the title Journal of Microlithography, Microfabrication, and Microsystems from 2002-2006.
Abstracting and Indexing:
JM3 is abstracted and indexed in many leading scientific databases, including Science Citation Index Expanded; Materials Science Citation Index; Current Contents/Physical, Chemical & Earth Science; Current Contents/Engineering, Computing & Technology; Inspec; Scopus; Ei Compendex; and Chemical Abstracts.
Author Information
Subscription Information