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Micro/Nano Lithography

Wafer processing metrology sensors


CyberOptics' 450 mm carbon fiber WaferSense® sensors are designed to obtain precise metrology data to optimize new processing equipment for shrinking 32 nm and 22 nm process tolerances.

CyberOptics' 450 mm sensors allow engineers to level processing equipment, reduce equipment vibration and set three axis wafer-transfer coordinates. Each wafer-like device follows the processing life of a wafer and reports real-time metrology data via a GUI.

The company's line of 450 mm metrology devices is available by special order: the Auto Teaching System (ATS450), Auto Vibration System (AVS450) and Auto Leveling System 2 Vertical (ALS2V450).

Engineers can implement CyberOptics' WaferSense sensors to optimize equipment and tools used to perform processes across the fab: photolithography; etch; diffusion; thin film; implant; metallization; chemical mechanical planarization (CMP) and fab automation.