SPIE Digital Library Get updates from SPIE Newsroom
  • Newsroom Home
  • Astronomy
  • Biomedical Optics & Medical Imaging
  • Defense & Security
  • Electronic Imaging & Signal Processing
  • Illumination & Displays
  • Lasers & Sources
  • Micro/Nano Lithography
  • Nanotechnology
  • Optical Design & Engineering
  • Optoelectronics & Communications
  • Remote Sensing
  • Sensing & Measurement
  • Solar & Alternative Energy
  • Sign up for Newsroom E-Alerts
SPIE Photonics West 2017 | Register Today

SPIE Defense + Commercial Sensing 2017 | Call for Papers

Journal of Medical Imaging | Learn more

SPIE PRESS




Print PageEmail Page

Electronic Imaging & Signal Processing

Hyperspectral imaging sensor

Specim

SPECIM, Spectral Imaging Ltd, the world's leading manufacturer of hyperspectral imaging components and systems, has launched a new high resolution hyperspectral imaging sensor with exceptional performance and the dimensions required for Unmanned Aerial Vehicles (UAV) and other challenging applications.

The new V10M sensor operates in the VIS/NIR range of 380 - 1000 nm, and provides superior spectral and spatial imaging with negligible sub-pixel distortions (smile, keystone). The currently available sensor has an excellent spatial resolution of 1300 pixels, and a 2000 pixel version will be released later this year. The high resolution does not compromise the imaging speed, which reaches 100 images/s, and even higher rate with spectral binning. Superb optical light throughput, together with the most advanced and sensitive detector technology available, guarantees an excellent signal-to-noise ratio. The specifications meet the most demanding requirements for target detection with a wide swath width for efficiency in airborne uses, as well as provide superior performance in industrial quality control applications. The extreme performance from a light weight sensor of less than 0.9 kg (2 lb), including the spectrograph and camera, and in a format optimized to fit to small payload compartments and gimbals is the signature of the new M series sensors.

This compact new technology is particularly designed to increase the spatial resolution of push-broom hyperspectral imagers, and works with detector arrays up to 24 mm wide in the spatial dimension. The design is optimized for operation in harsh conditions, and provides the option of a user exchangeable fore optic.

www.specim.fi