KLA-Tencor Corporation recently announced two new wafer inspection systems and a new electron-beam review system to address defect issues at the 3Xnm / 2Xnm nodes. The 2830 Series brightfield wafer inspection platform uses a revolutionary high-power plasma light source to illuminate defect types whose size or location made them impossible to detect repeatably before now. The Puma 9500 Series darkfield wafer inspection platform introduces breakthrough optics and image acquisition technology that give it twice the resolution at twice the speed of its predecessor-allowing the new Puma tools to monitor more layers and more defect types at darkfield speeds. The eDR-5210 e-beam review and classification system features second-generation electromagnetic-field immersion technology, engineered to deliver extraordinary image quality and actionable defect classification results in a high productivity package.
When the new inspection and review systems work interdependently, they can preferentially detect and report yield-relevant defects, enabling fabs to more rapidly identify and remedy complex defect issues at the 3Xnm and 2Xnm nodes.
"While many other equipment companies have been focused on scaling back programs and delaying new platforms during the downturn, KLA-Tencor has continued to invest heavily in developing next-generation products," remarked Mike Kirk, Ph.D., vice president and general manager of the Wafer Inspection Group at KLA-Tencor. "Each has the flexibility for use in multiple applications, and is designed for extendibility to or from the next device generation, so that fabs can maximize re-use of their investment in capital equipment."