San Jose Marriott and San Jose Convention Center
    San Jose, California, United States
    25 February - 1 March 2018
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    Plan to attend SPIE Advanced Lithography

    The semiconductor industry continues to be a critical engine for global economic development, and ongoing advancement in IC lithography remains one key enabler for that engine. Despite the importance of lithography, the industry today stands at a crossroads of uncertainty. Lithographic techniques that can be cost-effective and move the IC roadmap forward for another decade or more remain elusive. Moreover, market considerations require the end users of lithography to constantly evolve their business models, R&D, and manufacturing strategies on a global basis. Historically, the lithography community has successfully met any challenge the semiconductor industry has faced, from bringing immersion lithography into mainstream production to working with chip designers on improving manufacturability. However, to continue the required technology progression will demand unprecedented ingenuity, cost efficiency and communication within the lithography community and across interdisciplinary lines.


    For the past 33 years, SPIE Advanced Lithography has played a key role in bringing the lithography community together to solve challenges required by the semiconductor industry. This highly successful symposium delivers the right combination of practical know how and cutting-edge research presented across five complementary conferences. Participants from academia to current production engineers share and learn about state-of-the-art lithographic tools, resists, metrology, materials characterization, and design and process integration. Through a series of provocative panel discussions and seminars, the symposium further probes current issues to be faced as we extend these technologies or try to switch to alternative technologies.


    SPIE Advanced Lithography is organized into five conferences:

    • Alternative Lithographic Technologies
    • Metrology, Inspection, and Process Control for Microlithography
    • Advances in Resist Materials and Processing Technology
    • Optical Microlithography
    • Design for Manufacturability through Design-Process Integration

    All conferences are organized by current practitioners of the art, and numerous short courses are taught by recognized industry experts. Additional information is available from the many manufacturers' exhibits, which allow tool makers and material suppliers to showcase new products while interacting one-on-one with customers.


    We welcome your attendance and hope that you will join us at the San Jose Convention Center, San Jose, California for SPIE Advanced Lithography’s 34th year. We look forward to seeing you there!

    Christopher J. Progler
    Photronics Inc.
    2009 Symposium Chair
    Donis G. Flagello
    Nikon Corp. of America
    2009 Symposium Co-Chair

    Executive Committee
    Robert D. Allen, IBM Almaden Research Ctr.
    John A. Allgair, SEMATECH, Inc. and Advanced Micro Devices, Inc.
    Mircea Dusa, ASML US, Inc.
    Roxann L. Engelstad, Univ. of Wisconsin/Madison
    Donis G. Flagello, ASML US, Inc.
    Clifford L. Henderson, Georgia Institute of Technology
    Bruno La Fontaine, Advanced Micro Devices, Inc.
    Harry J. Levinson, Advanced Micro Devices, Inc.
    Christopher J. Progler, Photronics, Inc.
    Christopher J. Raymond, Nanometrics, Inc.
    Michael L. Rieger, Synopsys, Inc.
    Franklin M. Schellenberg, Mentor Graphics Corp.
    Vivek K. Singh, Intel Corp.

    Advisory Committee
    Robert D. Allen, IBM Almaden Research Ctr.
    William H. Arnold, ASML US, Inc.
    Timothy A. Brunner, IBM Thomas J. Watson Research Ctr.
    Ralph R. Dammel, AZ Electronic Materials USA Corp.
    Roderick R. Kunz, MIT Lincoln Lab.
    Harry J. Levinson, Advanced Micro Devices, Inc.
    Burn Lin, Taiwan Semiconductor Manufacturing Co., Ltd. (Taiwan)
    Chris A. Mack, lithoguru.com
    Victor Pol, Freescale Semiconductor, Inc.
    Michael T. Postek, National Institute of Standards and Technology
    Luc Van den Hove, IMEC (Belgium)
    C. Grant Willson, The Univ. of Texas at Austin
    Anthony Yen, Taiwan Semiconductor Manufacturing Co., Ltd. (Taiwan)