JDSU has developed what it is calling the first photonic integrated amplifier (PIA) platform.
The PIA platform will replace up to 50 discrete components with a single chip and will be up to 50% smaller than current solutions. JDSU is using its erbium doped fiber amplifier (EDFA) capabilities, combined with Planar Lightwave Circuit (PLC) technology, 980 nanometer (nm) pump lasers, and optical component technology to create the new amplifier platform.
As the use of voice, video, and data applications continues to grow and drive higher network traffic levels, Network Equipment Manufacturers (NEMs) and service providers are under constant pressure to continue improving their networks to support bandwidth demands in a cost-effective and space efficient way.
The new PIA platform will be the first reconfigurable amplifier solution that can be used for a variety of amplifier functions, making it possible for NEMs to use the solution either as a booster amplifier at transmit locations, as a pre-amplifier at receiver sites, or as an in-line amplifier in between locations that transmit and receive optical signals within a network.
The smaller size of the PIA platform will allow NEMs to put more functionality into a single network element, saving valuable space. Having an interchangeable product will also simplify product sparing, ordering, and tracking previously required by NEMs to support different network amplification needs.