Please join us in Taipei for SPIE Lithography Asia - Taiwan 2008!
It is our great pleasure to invite you to participate in the first SPIE Lithography Asia conference, featuring presentations from leading researchers, developers, and innovators. This is your opportunity to present your research and meet with others working at the leading edge of semiconductor device technologies.
The semiconductor industry has expanded globally for several decades, and now a major portion of microelectronics products are manufactured in Asia. This has brought an increasing segment of R&D for lithography processes and equipment technology to Asia as well. Furthermore, the pace of innovation and development has progressively accelerated in recent years. This conference is intended to stimulate a face-to-face exchange of the latest developments of microlithography techniques used in the current and future electronics manufacturing process.
We invite you to present and participate in this important international forum, and look forward to seeing you in Taipei this November.
Alek C. Chen
ASML Taiwan Ltd.
Conference Chair
Burn Lin
Taiwan Semiconductor Manufacturing Co. Ltd.
Conference Cochair
Anthony Yen
Taiwan Semiconductor Manufacturing Co. Ltd.
Conference Cochair
Program Committee
Woo Sung Han, Chair, SAMSUNG Electronics Co., Ltd. (South Korea); Geert Vandenberghe, Cochair, IMEC (Belgium); Nigel R. Farrar, Cymer, Inc. (USA); Donis G. Flagello, ASML US, Inc. (USA); Kohji Hashimoto, Toshiba Corp. (Japan); Naoya Hayashi, Dai Nippon Printing Co., Ltd. (Japan); Tokuyuki Honda, Canon Inc. (Japan); Peter Huang, United Microelectronics Corp. (Taiwan); Hideki Ina, Canon Inc. (Japan); Soichi Inoue, Toshiba Corp. (Japan); Masaomi Kameyama, Nikon Corp. (Japan); Ho-young Kang, ASML Korea Co., Ltd. (USA); Edmund Yin-Mun Lam, The Univ. of Hong Kong (Hong Kong China); Benjamin Szu-Min Lin, Powerchip Semiconductor Corp. (Taiwan); Hyekeun Oh, Hanyang Univ. (South Korea); Junichi Onodera, Tokyo Ohka Kogyo Co., Ltd. (Japan); Christopher J. Progler, Photronics, Inc. (USA); Wen Bin Wu, AU Optronics Corp. (Taiwan); Kuen-Yu Tsai, National Taiwan Univ. (Taiwan); Dong-Gyu Yim, Hynix Semiconductor Inc. (South Korea); Gary Zhang, Rohm and Haas Electronic Materials (USA)
