Don't Miss the Optical Microlithography Webcast

The SPIE annual Optical Microlithography conference covers key advancements in the field of optical-, micro-, and nano-lithography as well as novel approaches to achieve state-of-the-art imaging solutions. This webcast includes 12 presentations from Day 1 of SPIE Advanced Lithography 2008, held on 26 February. Talks cover double patterning, EUV lithography, and low-k1 lithography.

Webcast signup includes:

•	PowerPoint slides and audio from the original presentations
•	Downloadable PDFs of each PowerPoint presentation
•	Downloadable PDF manuscripts of selected papers
•	A total of over 4 hours of content delivered by top authorities in optical microlithography
•	The audio and PowerPoints are available on demand, with no limit on how often you access them, until 10 March 2009
•	Access content from one of SPIE's most exciting meetings. It's a great resource for those unable to attend, or for attendees who want to hear the talks again, download slides, and read manuscripts.

Registration:

$79 for 2008 SPIE Advanced Lithography attendees

$149 for all others

View a Free Excerpt from William Arnold's "Toward 3-nm Overlay" presentation

Keynote Session

Introduction  Harry J. Levinson, Advanced Micro Devices, Inc. If It Moves, Simulate It  Andrew R. Neureuther, Univ. of California/Berkeley Interactions of Double-patterning Technology with OPC, Wafer Processing, and Design Flows Kevin D. Lucas, Synopsys, Inc. Toward 3-nm Overlay: An Integrated Error Budget for Double-patterning Lithography William H. Arnold, ASML US, Inc. The Future of EUVL  Winfried M. Kaiser, Carl Zeiss SMT AG (Germany), et. al.

Double Masking

A study of CD Budget in Spacer Patterning Process Hidefumi Mukai, Toshiba Semiconductor Co. (Japan), et al. Double Patterning for 32-nm and Below: An Update Jo M. Finders, ASML Netherlands B.V. (Netherlands), et al. Split and Design Guidelines for Double Patterning Vincent Wiaux, IMEC (Belgium), et al. Double Patterning Combined with Shrink Techniques to Extend ArF Lithography for Contact Holes to 22-nm Node and Beyond Xiangqun J. Miao, Applied Materials, Inc., et al.  Negative and Iterated Spacer Lithography Processes for Low Variability and Ultra-dense Integration Andrew E. Carlson, Univ. of California/Berkeley, et al. Double Patterning of Contact Array with Carbon Polymer Woo Yung Jung, Hynix Semiconductor Inc. (South Korea)

Low-k1 Lithography

Pixelated Phase Mask as Novel Lithography RET Yan A. Borodovsky, Intel Corp., et al. Comparative Study of Binary Intensity Mask and Attenuated Phase-shift Mask Using Hyper-NA Immersion Lithography for Sub-45-nm Era Tae-Seung Eom, Hynix Semiconductor Inc. (South Korea) et al.

Conference Chair: Harry J. Levinson, Advanced Micro Devices, Inc.
Conference Co-Chair: Mircea V. Dusa, ASML US, Inc.

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