tel: 404 385 0525
fax: 404 894 2866
E-mail:
cliff.henderson@chbe.gatech.edu
Web: http://www.chbe.gatech.edu
Area of Expertise
Optical lithography, photoresist materials science, micro/nanofabrication, microelectronic/optoelectronic/MEMS/NEMS devices
Biography
Professor Henderson obtained his B.S. in Chemical Engineering from Georgia Tech and his M.S. and Ph.D. degrees from the University of Texas at Austin. He spent a short time with Motorola in their Advanced Products Research and Development Lab before returning to academia at Georgia Tech in 1998. His current research interests include: optical lithography, photoresist materials science, stereolithography, rapid prototyping and rapid manufacturing, polymer thin film science and technology, micro- and nanofabrication, and microelectronic/optoeletronic/MEMS/NEMS devices. His research group focuses thematically on: (1) developing new materials and processes for micro- and nanofabrication, (2) developing a fundamental understanding of the physiochemical processes that occur in such materials and processes, and (3) developing models that can be used to describe, control, and design such systems. He has authored or coauthored over 100 papers and holds 6 patents in areas related to polymeric materials, lithography, and materials and methods for micro- and nanofabrication.
Lecture Title(s)
Developing New Materials & Methods for Micro- and Nanomanufacturing: Enabling advancement in electronics, energy, biology, and beyond
The ability to form high resolution two dimensional and three dimensional structures in various organic and inorganic materials is a critical and enabling technology in a wide variety of modern applications ranging from the now seemingly mundane to the cutting edge. For example, all of the modern electronic devices (e.g. computers, cell phones, iPods, digital cameras, etc.) that we take for granted rely on the use of microprocessors and memory devices that possess device features smaller than 100 nm in size. For comparison, a human hair is approximately 50 microns (50,000 nm) in diameter. The critical and enabling technology for mass producing such microelectronic devices are the combination of lithographic materials, processes, and tools used to pattern the nanoscale device elements that constitute the transistor device active layers and the subsequent electrical interconnect layers. However, moving forward there are a number of challenges in terms of the materials, tools, and economics of such micro- and nanofabrication technologies that threaten the continued advancement of microelectronics. Solutions to these problems will require new materials and new material processing approaches. The first part of this presentation will review the current state of the art in such lithography technologies, the current materials challenges being faced, and how we are developing solutions to these challenges. Although much of their roots lie in microelectronics processing, micro- and nanofabrication techniques have expanded to be an enabling technology in a variety of other fields including data storage (CDs, DVDs, etc.), solar energy conversion, tissue engineering, sensing, separations, and many others. Therefore, a brief discussion of some of these emerging areas for micro- and nanofabrication will also be presented. Highlights of our work on developing new materials and novel micro- and nanofabrication methods based on stereolithography that can provide new capabilities in applications ranging from microfluidic devices to tissue engineering scaffolds will also be discussed.
