Nextreme Inc. announces the availability of its Ultra-High Packing Fraction OptoCooler module, targeting cooling and temperature control requirements for optoelectronics, electronics, medical, military, and aerospace applications and specifically optimized for laser diode, LED, and advanced sensor products.
In doing so, the start-up aims to solve the continuous design challenge of power leakage and hot spots, leading to uneven temperatures across a chip. According to the company, the OptoCooler removes a maximum of 420 mW of heat at 25°C ambient in an active footprint of 0.55 mm2. As a result, the module can pump a heat density up to 78 W/cm2; at 85°C, these values increase to 610 mW and 112 W/cm2, respectively.
"The OptoCooler module is the industry's first thermoelectric device to offer a heat pumping density in excess of 70 W/cm2, a 10-fold increase in heat pumping capacity over conventional TEC [thermoelectric component] modules," said Dave Koester, VP of engineering at Nextreme, in a statement.
With its thin-film thermal bump technology at its core, the OptoCooler can be integrated directly into electronic and optoelectronic packaging to deliver more than 45°C of cooling for a variety of thermal management applications.
Nextreme will be demonstrating the OptoCooler at the SPIE Photonics West conference, January 22 to 24.