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SPIE Photonics West 2018 | Call for Papers




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Optoelectronics & Communications

Wafer-level camera and chip-scale packaging

Tessera Technologies Inc., a leading provider of miniaturization technologies for the electronics industry, will showcase its portfolio of optics solutions at Photonics West, including its new OptiMLTM WLC, a wafer-level camera technology for mobile device applications, and its new SHELLCASE® RT Wafer-Level Chip-Scale Packaging (WLCSP) technology, now available for packaging 300mm (12") wafers.

The SHELLCASE RT solution is a high-yield, highly reliable manufacturing solution for image sensors used in next-generation mobile devices including mobile phones and PDAs. The technology enables very low profile camera modules, providing OEMs with greater design flexibility and an innovative tool in the development of thinner mobile devices.

The OptiML WLC is designed to significantly advance the integration of miniaturized cameras in mobile phones, personal computers, security cameras and other electronics. By enabling cameras to be manufactured at the wafer level, it drastically reduces the size and total bill of material cost of camera modules. Using OptiML WLC technology, thousands of lenses can be manufactured simultaneously on a wafer and then bonded at the wafer level to create the optical element of the camera. By using reflow-compatible materials to build the lenses, the camera assembly is simplified, enabling reduced costs. OptiML WLC technology also reduces the size of the camera to a minimum, delivering up to 50 percent of size reduction over conventional modules in today's camera phones.

Tessera will be at Stand 727.