To submit a manscript for consideration in a Special Section, please prepare the manuscript according to the journal guidelines and use the Online Submission System.
FORTHCOMING SPECIAL SECTIONS:
Reliability, Packaging, Testing, and Characterization of MEMS and MOEMS II
Line-Edge Roughness
Metrology
BioMEMS, Theory and Practice of MEMS/NEMS, and Sensors
October-December 2010
Reliability, Packaging, Testing, and Characterization of MEMS and MOEMS II
Guest Editor:
Rajeshuni Ramesham
Jet Propulsion Laboratory
California Institute of Technology
4800 Oak Grove Drive
Pasadena, California 91109
Tel: 818-354-7190
E-mail: Rajeshuni.Ramesham@jpl.nasa.gov
Call for papers: The purpose of this special section is to provide a technical stage to publish recent advances made in reliability, packaging, testing, and characterization of microelectromechanical systems (MEMS) and micro-optoelectromechanical systems (MOEMS) for various applications. We are soliciting high-quality papers on the following topics:
(1) packaging process reliability, including packaging materials, assembly processes, bonding materials, wafer-level packaging, high-vacuum packaging, hermeticity, leak testing, new testing tools to monitor hermeticity, thin-film getters and activation techniques, packaging without hermeticity, MEMS assembly cleanroom science, issues in integration of MEMS/MOEMS and ICs/ASICs/FPGAs, nondestructive evaluation of packaged systems (x-ray, acoustic microscopy, IR), effects of extreme and harsh environments (low and high temperature, radiation, shock, vibration), commercial-off-the-shelf (COTS) solutions, simulations/models, lead-free solder, and predictions of life of packaged MEMS systems;
(2) BEOL process reliability issues, including production and yield improvement, yield improvement by reducing stiction, parametric test methods and/or test structures used to assure fabrication processes, release methods and techniques, yield modeling and process control methodologies;
(3) reliability methodology, including aging, dormancy, early life failures, accelerated life testing, predictive models, acceleration factors, design of experiments, physics of failure, reliability in design, measurement techniques and properties, data reduction and visualization, scaling issues, reliability tool development, automation, and device/system reliability;
(4) reliability of surfaces, including stiction, adhesion, lubrication, critical point drying methods, self-assembled monolayers (SAMs) or other coating materials, tribology, surface molecular contamination, particulate contamination, and contact resistance;
(5) reliability of materials, including fracture, static and cyclic fatigue, wear, and life-cycle predictability;
(6) testing methods, including qualification of devices or systems, environmental testing (shock, vibration, temperature extremes, humidity, power cycling, contact cycling), highly accelerated lifetime testing (HALT), verification, and automation;
(7) standards development, including testing and measurement standards of devices or MEMS materials properties;
(8) characterization methods, including metrology tool development, laser Doppler vibrometry, interferometric methods, confocal microscopy, automation, calibration, and comparison to models; and
(9) failure analysis, including identification of failure modes and mechanisms, novel analysis techniques, novel tools, and case histories.
The scope of this special section includes all new and interesting aspects of reliability, packaging, testing, and characterization of MEMS and MOEMS. Articles based on theoretical, experimental, and simulation results will be considered for publication. Manuscripts should be submitted to SPIE according to the journal guidelines. A cover letter indicating that the submission is intended for this special section should be included. All papers for this special section, both solicited and unsolicited, will go through the standard journal review process.
Manuscripts due April 1, 2010.
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October-December 2010
Line-Edge Roughness
Guest Editors:
Chris A. Mack
Lithoguru.com
1605 Watchhill Road
Austin, Texas 78703
Tel: 512-322-0980
E-mail: chris@lithoguru.com
Will Conley
Freescale Semiconductor
3501 Ed Bluestein Boulevard, M/S K-10
Austin, Texas 78721
Tel: 512-653-4859
E-mail: Will.Conley@freescale.com
Call for Papers: It seems likely that the ultimate resolution of most projection and direct-write lithography schemes is limited by line-edge and linewidth roughness (LER/LWR). In the sub-50-nm feature size regime, LER is already taking up a considerable amount of the overall feature size control budget and having measureable impact on device performance. At the 32-nm and below nodes, LER/LWR is an acknowledged manufacturing problem. For EUV lithography, the trade-offs between resist sensitivity, resolution, and LER may prove insurmountable to viable manufacturing. Thus, solving the issues surrounding LER is of extreme importance to the semiconductor industry. Papers are being solicited in the following areas:
- First principles and empirical models for LER (optics, resists, metrology, devices)
- Mask/optics impact on LER
- ArF and EUV photoresist formulation and performance with respect to LER
- Metrology for LER/LWR
- Transfer of LER during etching
- Device impact of LER/LWR.
Manuscripts due April 1, 2010.
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October-December 2010
Metrology
Guest Editors:
Moshe Preil
ASML
4211 Burton Drive
Santa Clara, California 95054
Tel: 408-368-4012
E-mail: moshe.preil@asml.com
Shaunee Cheng
IMEC
Kapeldreef 75
B-3001 Leuven, Belgium
Tel: 32 16281166
E-mail: shaunee.cheng@imec.be
Call for papers: Much of the attention of semiconductor lithographers is devoted to exposure tools and process. However, as feature sizes and process tolerances shrink, the requirements for metrology speed, precision, long-term stability, matching, process robustness, and total measurement uncertainty shrink as well. Current critical dimension (CD) and overlay metrology requirements for the 32-nm node and below are well below the size of a single silicon atom (0.25 nm). This creates an increasingly challenging environment for lithographic metrologists and drives the need both to improve existing metrology techniques as well as to develop new metrology technologies. Additional metrology challenges include the lack of calibrated standards for both CD and overlay; the need for increasing volumes of data to meet evolving process control requirements; and new metrology requirements imposed by double patterning, complex three-dimensional structures (vertical scaling), and other new forms of device scaling that drive the need for unique new measurements. We are soliciting papers for JM3 that explore new developments, issues, and solutions for both reticle and wafer level metrology, including:
- Overlay metrology
- CD metrology
- Defect metrology
- Sampling plans
- Cost/risk tradeoffs for integrated metrology
- Standards for accuracy
- Metrics of metrology uncertainty in the absence of calibrated standards
- Extension of existing metrology techniques and development of new metrology technologies
- Applications of advanced metrology for improved lithography process control.
Manuscripts due April 1, 2010.
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July-September 2010
BioMEMS, Theory and Practice of MEMS/NEMS, and Sensors
Guest Editor:
Yu-Cheng Lin
National Cheng Kung University
Department of Engineering Science
1 University Road, Tainan, Taiwan
Tel: +886-933-350-151, +886-6-276-2395
Fax: +886-6-276-2329
E-mail: yuclin@mail.ncku.edu.tw
Call for Papers: The theory, design, fabrication, and characterization of MEMS/NEMS, bioMEMS, and nanotechnologies have been making tremendous progress. We are calling prospective authors to submit worthwhile contributions in these fields for peer-reviewed and archived publication in a special section of JM3.
The special section will be comprised of the following subtopical areas (please select one when submitting your manuscript):
- BioMEMS,
- Theory, design, fabrication, and characterization of MEMS/NEMS,
- Physical and chemical sensors,
- Theory, design, fabrication, and characterization of nanostructured materials for biological and medical applications,
- Biological applications using nanoscale particles, devices, and systems.
A cover letter indicating that the submission is intended for this special section should be included. If your paper was presented at the IEEE Nanomed 2009 conference, please note this in the cover letter and make a reference to it in the manuscript.
Manuscripts should be prepared according to the journal guidelines and submitted at http://jm3.peerx-press.org/.
Closed for submissions.
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