tel: 206 616 4038
fax: 306 543 3842
E-mail:
babak@ee.washington.edu
Web: http://www.ee.washington.edu/faculty/parviz_babak/
Area of Expertise
Self-assembly, MEMS, Nanotechnology, Bionanotechnology
Biography
Babak Parviz received his graduate degrees in electrical engineering and physics from the University of Michigan. From 2000 to 2001 he was a device designer and a product manager for integrated optical switches at Nanovation Technologies Inc. From 2001 to 2003 he was a postdoctoral research fellow in the Department of Chemistry and Chemical Biology at Harvard University. Since 2003, he has been a faculty member in the Electrical Engineering Department at the University of Washington, where he currently serves as the associate director of the Micro-scale Life Sciences Center. Professor Parviz's areas of interest include self-assembly, research at the interface between electrical engineering and biology, MEMS, and nanotechnology. He has received a number of awards including the NSF CAREER Award and the MIT Technology Review's TR35.
Lecture Title(s)
Engineered Self-Assembly
Self-assembly is an omnipresent process in nature that contributes to the construction of complex functional biological systems across the size scale. Inspired in part by this observation, our group works on developing self-assembly as an engineering concept to construct functional electronic, photonic, and mechanical systems. This talk provides an overview of our recent experimental work in both micro and nano-scales to make structures and devices via self-assembly.
In the nano-scale, we will demonstrate how engineered covalent bonds and molecular structures can be used to build nano-scale molecular electronic devices. We will also discuss using self-assembled DNA templates for building integrated circuits from the bottom up and sub-diffraction limit waveguides.
In the micron-scale, we will show how self-assembly of microfabricated components can enable plastic electronics and flexible optoelectronics. We will conclude by discussing how 2 and 3 dimensional structures self-assembled from basic microfabricated building blocks can provide a venue for building 3D microprocessors and computing architectures on-demand.
