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Hot Topics in Advanced Lithography Webcast Series - Immersion


Immersion Lithography - View archived webcast

Chair - Donis Flagello, Fellow, ASML Technology Development Center (Tempe, AZ)

Talk: Hot Topics in Advanced Lithography Series: Overview

Donis G. Flagello has worked in the photolithography field for over 24 years. He has published extensively in many aspects of image formation, including high NA imaging systems, polarization, aberration and lens metrology, optical system modeling and simulation. He currently has the position of Fellow at the ASML Technology Development Center, and he is an associate editor of optical lithography for the SPIE Journal of Micro/Nanolithography, MEms, and MOEMS.

Presenter - Colin Brodsky, Senior Engineering Manager, Lithography Development, IBM (Hopewell Junction, NY)

Talk: Immersion Lithography: Extending a Proven 45 nm Solution to 32nm and Beyond

Colin Brodsky received his PhD in Chemical Engineering from the University of Texas at Austin in 2001. He has numerous patents to his name, and has published many technical papers, including six with SPIE.

Presenter - Jack Chen, Sector Manager, Advanced Tooling, TSMC (Hsinchu, Taiwan)

Talk: Challenges of defect-free immersion lithography in production

After receiving an MA in Physics from Nanyang Technological University (Singapore), Jack Chen began his career in 1995 in Taiwan's first 8-inch wafer fabrication plant. Since then, he has been actively involved in the process development from 0.35μm, 0.25μm, 0.18μm, 0.13μm, 90nm and beyond. With full experiences in 365nm (I-line), 248nm (KrF) to 193nm (ArF) lithography technology, he is now in charge of the Advanced Lithograhy Tooling Center at TSMC.

You Will Learn:
Three approaches to resolution improvement in semiconductor manufacturing
· The latest advances in EUV lithography, including sources and masks
· How immersion techniques are making ever higher NAs possible
· Technical and budgetary issues in using double patterning to influence k1

Who Should View:
Researchers and engineers in semiconductor manufacturing
· Managers of lithography teams
· Purchasers of leading-edge lithographic machinery

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