Defining the Future of Electronic Imaging

Please join us for Electronic Imaging (EI) 2012 at the Hyatt Regency San Francisco Airport in Burlingame, California 22-26 January 2012.

On behalf of the Society for Imaging Science and Technology (IS&T) and SPIE, we would like to invite you and your colleagues to join us at the 24th annual EI Symposium.

The 2012 Electronic Imaging Symposium will feature 21 technical conferences covering all aspects of electronic imaging, from image sensing to display and hardcopy. Topics will include, but are not limited to, sensors, computational photography, color hardcopy, human vision, image, video and 3D processing and compression, image quality, image/video security and forensics, multimedia imaging systems, and 3D displays. Augmenting the plenary, oral, and interactive paper presentations will be a set of technical courses taught by experts from academia and industry. There will also be demonstrations by representatives from the imaging industry.

EI 2012 takes place at the same time as Photonics West, the world's leading photonics, laser, and biomedical optics event. Transportation and free entrance to the Photonics West Exhibit will be available to EI 2012 attendees.

Imaging is pervasive in the human experience, be it through photographs that we take in our everyday lives to those that are used in space exploration, medical imaging, entertainment, science, or security. Electronic Imaging 2012 is the one international conference where papers on all aspects of electronic imaging are presented, and where you can develop both your career and business by networking with leading researchers and entrepreneurs in the field.

Here are 10 reasons for you to join us at EI 2012:

1. Share your work with your peers by presenting an oral or interactive paper.
2. Learn about leading edge technology and science across a broad range of imaging disciplines.
3. Gain insight from recognized experts in the electronic imaging field by attending the plenary sessions.
4. Network with fellow scientists, engineers, managers, and entrepreneurs.
5. Enhance your knowledge in a specific area by taking one or more of the many short courses offered.
6. Showcase your technology at a special demonstration session.
7. Participate in panel sessions that discuss the current and future states of electronic imaging technologies and products.
8. Become a vital part of the imaging community. Do so by volunteering to be a committee member at one of the many conferences.
9. Benefit from concurrent timing with Photonics West and visit its exhibit..
10. Enjoy the inviting business, cultural, and entertainment offerings found in San Francisco and the Silicon Valley.

We look forward to seeing you at EI 2012 and sharing the joy of the electronic imaging spectrum with you!

Symposium Chair:

 


 Majid Rabbani  
 Eastman Kodak Company (United States)

 Gaurav Sharma  
 Univ. of Rochester (United States)

 Geoff Wolfe  
 Canon Information Systems Research Australia Pty Ltd. (Australia)

Majid Rabbani, Symposium Chair, Eastman Kodak Co.
Gaurav Sharma, Symposium Cochair, Univ. of Rochester
Sabine Süsstrunk, Past Symposium Chair, École Polytechnique Fédérale de Lausanne (Switzerland)
Geoff Wolfe, Short Course Chair, Canon Information Systems Research Australia Pty. Ltd. (Austrailia)
Nitin Sampat, Technical Advisory Chair, Rochester Insitute of Technology
Suzanne E. Grinnan, IS&T Executive Director
Ron Scotti, SPIE Science and Technology Advisor
Rob Whitner, SPIE Event Manager

Technical Organizing Committee:

Sos S. Again, The Univ. of Texas at San Antonio (United States)
David Akopian, The Univ. of Texas at San Antonio (United States)
Adnan M. Alattar, Digimarc Corp. (United States)
Jan P. Allebach, Purdue Univ. (United States)
Atilla M. Baskurt, Univ. of Lyon (France) 
Sebastiano Battiato, Univ. degli Studi di Catania (Italy)
Philip R. Bingham, Oak Ridge National Lab. (United States)
Charles A. Bouman, Purdue Univ. (United States)
Peter D. Burns, Consultant (United States)
David P. Casasent, Carnegie Mellon Univ. (United States)
Chaomei Chen, Drexel Univ. (United States)
Reiner Creutzburg, Fachhochschule Brandenburg (Germany)
Huib de Ridder, Technische Univ. Delft (Netherlands)
Edward J. Delp, Purdue Univ. (United States)
Jeffrey M. DiCarlo, Intuitive Surgical, Inc. (United States)
Tiarna Doherty, Smithsonian American Art Museum (United states)
Margaret Dolinsky, Indiana Univ. (United States)
Antoine Dupret, École Supérieure d'Ingénieurs en Electronique et Electrotechnique (France)
Karen O. Egiazarian, Tampere Univ. of Technology (Finland)
Reiner Eschbach, Xerox Corp. (United States)
Zhigang Fan, Xerox Corp. (United States)
Gregg E. Favalora, Optics for Hire (United States)
Frans Gaykema, Océ Technologies B.V. (Netherlands)
Atanas P. Gotchev, Tampere Univ. of Technology (Finland)
Onur G. Guleryuz, DoCoMo Communications Labs. USA, Inc. (United States)
Ming C. Hao, Hewlett-Packard Labs. (United States)
Nicolas S. Holliman, Durham Univ. (United Kingdom)
Francisco H Imai, Canon Development Americas Inc. (United States)
David L. Kao, NASA Ames Research Ctr. (United States)
Lyndon Kennedy, Yahoo! Research (United States)
Edmund Y. Lam, The Univ. of Hong Kong (China)
Qian Lin, Hewlett-Packard Labs. (United States)
Gabriel G. Marcu, Apple Inc. (United States)
Ian E. McDowall, Fakespace Labs, Inc. (United States)
Nasir D. Memon, Polytechnic Institute of NYU (United States)
Valérie Nguyen, CEA Leti MINATEC (France)
Thrasyvoulos N. Pappas, Northwestern Univ. (United States)
Ilya Pollak, Purdue Univ. (United States)
John Recker, Hewlett-Packard Labs. (United States)
Alessandro Rizzi, Univ. degli Studi di Milano (Italy)
Brian Rodricks, Fairchild Imaging (United States)
Bernice E. Rogowitz, Visual Perspectives Consulting (United States)
Juha Röning, Univ. of Oulu (Finland)
Amir Said, Hewlett-Packard Labs. (United States)
Nitin Sampat, Rochester Institute of Technology (United States)
Nicu Sebe, Univ. degli Studi di Trento (Italy)
Robert Sitnik, Warsaw Univ. of Technology (Poland)
Cees G. M. Snoek, Univ. van Amsterdam (Netherlands)
Robert L. Stevenson, Univ. of Notre Dame (United States)
Christian Viard-Gaudin, Univ. of Nantes (France)
Guijin Wang, Tsinghua Univ. (China) 
Ralf Widenhorn, Portland State Univ. (United States)
Patrick J. Wolfe, Harvard Univ. (United States)
Pak C. Wong, Pacific Northwest National Lab. (United States)
Andrew J. Woods, Curtin Univ. (Australia)
Feng Xiao, Fairchild Imaging (United States)
Richard Zanibbi, Rochester Institute of Technology (United States)