Please join us in San Jose, California, 17-21 January for Electronic Imaging 2010.
On behalf of IS&T-The Society for Imaging Science and Technology and SPIE, we would like to invite you and your colleagues to join us at the 22nd annual Symposium on Electronic Imaging.
Electronic Imaging 2010 will features 21 technical conferences covering all aspects of electronic imaging, from image sensing to display and hardcopy. Topics will include, but not be limited to, sensors, digital photography, color hardcopy, human vision, image processing and compression, image quality, image security, and multimedia imaging systems. Augmenting the oral and poster presentations will be a set of technical courses taught by experts from academia and industry. There will also be demonstrations by representatives from the imaging industry.
This year we are very excited to add three new conferences - Imaging and Printing in a Web 2.0 World, 3D Image Processing (3DIP) and Applications, and Computer Vision and Image Analysis of Art - to our already expansive range of topics.
Imaging is pervasive in the human experience, be it photographs that we take in our everyday lives to those that are used in space exploration, medical imaging, entertainment, science, or national security. Electronic Imaging 2010 is the one international conference where papers on all aspects of electronic imaging are presented, and where you can develop both your career and business by networking with leading researchers and entrepreneurs in the field.
Here are ten reasons for you to join us at Electronic Imaging 2010:
- Share your work with your peers by presenting an oral or poster paper.
- Learn about leading edge technology and science across a broad range of imaging disciplines.
- Gain from the insight of recognized experts in the electronic imaging field by attending the plenary sessions.
- Network with fellow scientists, engineers, mangers, and entrepreneurs.
- Enhance your knowledge in a specific area by taking one or more of the many short courses offered.
- Showcase your technology at a special demonstration session.
- Participate in panel sessions that discuss the current and future states of electronic imaging technologies and products.
- Become a vital part of the imaging community by volunteering to be a committee member at one of the many conferences.
- Attend the receptions and coffee breaks and develop life-long relationships with other experts in industry, government, and academia.
- Enjoy the inviting business, cultural, and entertainment offerings found in Silicon Valley.
We look forward to seeing you in San Jose and sharing with you the joy of the entire spectrum of electronic imaging.
Symposium Chair:
Jan Allebach
Purdue Univ. (United States)
Symposium Cochair:
Sabine Süsstrunk
Ecole Polytechnique Federale de Lausanne (Switzerland)
Short Course Chair:
Gaurav Sharma
Univ. of Rochester (United States)
Symposium Steering Committee:
Jan Allebach, Symposium Chair, Purdue University
Sabine Süsstrunk, Symposium CoChair, École Polytechnique Fédérale de Lausanne (Switzerland)
Nitin Sampat, Rochester Institute of Technology
Suzanne E. Grinnan, IS&T Executive Director
Jeanne Anderson, SPIE Event Manager
Ron L. Scotti, SPIE Science & Technology Advisor
Technical Organizing Committee
Gady Agam, Illinois Institute of Technology (United States)
David Akopian, The Univ. of Texas at San Antonio (United States)
Adnan M. Alattar, Digimarc Corp. (United States)
Jaakko T. Astola, Tampere Univ. of Technology (Finland)
Atilla M. Baskurt, Univ. Claude Bernard Lyon 1 (France)
Anna Bentkowska-Kafel, Courtauld Institute of Art (United Kingdom)
Erik Bodegom, Portland State Univ. (United States)
Charles A. Bouman, Purdue Univ. (United States)
David P. Casasent, Carnegie Mellon Univ. (United States)
Chaomei Chen, Drexel Univ. (United States)
Jim Coddington, Museum of Modern Art (United States)
Reiner Creutzburg, Fachhochschule Brandenburg (Germany)
Edward J. Delp III, Purdue Univ. (United States)
Jana Dittmann, Otto-von-Guericke-Univ. Magdeburg (Germany)
Neil A. Dodgson, Univ. of Cambridge (United Kingdom)
Margaret Dolinsky, Indiana Univ. (United States)
Karen O. Egiazarian, Tampere Univ. of Technology (Finland)
Reiner Eschbach, Xerox Corp. (United States)
Zhigang Fan, Xerox Corp. (United States)
Susan P. Farnand, Rochester Institute of Technology (United States)
David Fofi, Univ. de Bourgogne (France)
Frans Gaykema, Océ Technologies B.V. (Netherlands)
Theo Gevers, Univ. van Amsterdam (Netherlands)
Onur Guleryuz, DoCoMo Communications Labs. USA, Inc.
Ernest L. Hall, Univ. of Cincinnati (United States)
Ming C. Hao, Hewlett-Packard Labs. (United States)
Nicolas S. Holliman, Durham Univ. (United Kingdom)
Francisco Imai, Samsung Information Systems America, Inc. (United States)
Olivier Laligant, Univ. de Bourgogne (France)
Laurence Likforman-Sulem, Telecom ParisTech (France)
Qian Lin, Hewlett-Packard Labs. (United States)
Gabriel G. Marcu, Apple Computer, Inc. (United States)
Ian E. McDowall, Fakespace Labs, Inc., United States)
Nasir D. Memon, Polytechnic Institute of NYU (United States)
Valérie Nguyen, CEA Leti MINATEC (France)
Thrasyvoulos N. Pappas, Northwestern Univ. (United States)
Jinah Park, Korea Advanced Institute of Science and Technology (Korea, Republic of)
Ilya Pollak, Purdue Univ. (United States)
Alessandro Rizzi, Univ. degli Studi di Milano (Italy)
Bernice E. Rogowitz, IBM Thomas J. Watson Research Ctr. (United States)
Juha Röning, Univ. of Oulu (Finland)
Amir Said, Hewlett-Packard Labs. (United States)
Nitin Sampat, Rochester Institute of Technology (United States)
Raimondo Schettini, Univ. degli Studi di Milano-Bicocca (Italy)
Cees Snoek, Univ. van Amsterdamn (Netherlands)
David G. Stork, Ricoh Innovations, Inc. (United States) and Stanford Univ. (United States)
Shoji Tominaga, Chiba Univ. (Japan)
Frédéric Truchetet, Univ. de Bourgogne (France)
Patrick J. Wolfe, Harvard Univ. (United States)
Pak Chung Wong, Pacific Northwest National Lab. (United States)
Andrew J. Woods, Curtin Univ. of Technology (Australia)
Feng Xiao, Fairchild Imaging (United States)
