Various Venues
    See Details Below, United States
    1 May - 31 December 2015
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    Defining the Future of Electronic Imaging

     

    IS&T

    SPIE logo

    Please join us for Electronic Imaging (EI) 2015 at the Hilton San Francisco Union Square, San Francisco, California, 8-12 February 2015.

    On behalf of the Society for Imaging Science and Technology (IS&T) and SPIE, we would like to invite you and your colleagues to join us at the 27th annual EI Symposium.

    The 2015 Electronic Imaging Symposium will feature 21 technical conferences covering all aspects of electronic imaging, from image sensing to display and hardcopy. Topics include 3D displays and processing, computational and digital photography, augmented and virtual reality, human vision, color imaging and perception, image and video processing, compression, and communication, mobile imaging, imaging sensors, image quality, media security and forensics, and computer vision. A set of technical courses taught by experts from academia and industry augment our main technical program of plenary, oral, and poster presentations. Technology demonstrations by industry and academia participants showcase the latest developments driving next generation electronic imaging products.

    Imaging is pervasive in the human experience, be it photographs that we take in our everyday lives to those that are used in space exploration, medical imaging, entertainment, science, or security. Come to Electronic Imaging 2015 to learn about the latest developments and buzz in all of these areas and to network with leading researchers and entrepreneurs in the field.

    Here are 10 reasons for you to join us at EI 2015:

    1. Learn about the latest developments in technology and science across a broad range of imaging disciplines
    2. Broaden your perspective and gain valuable insights from plenary sessions that highlight how recent research is changing the future of electronic imaging
    3. Share your work with your peers by presenting a paper
    4. Network with fellow scientists, engineers, managers, and entrepreneurs
    5. Enhance your knowledge in a specific area by taking one or more short courses from our many offerings
    6. Showcase your technology at our demonstration session; get known and build valuable business connections and partnerships
    7. Participate in panel sessions that discuss the current and future states of electronic imaging technologies and products
    8. Become a vital part of the imaging community. Volunteer to be a committee member at one of the many conferences
    9. Take advantage of the concurrent timing of Photonics West by visiting the leading exhibit on photonics, laser, and biomedical optics with over 19,000 attendees. Free entrance to the Photonics West Exhibition will be available to EI 2015 attendees
    10. Enjoy the business, cultural, and entertainment offerings in San Francisco and the Silicon Valley.

    We look forward to seeing you at EI 2015 and sharing the thrills of the complete spectrum of developments in electronic imaging with you!

    2015 Symposium Chair
    Sheila S. Hemami 
    Northeastern Univ. (United States)

     

    2015 Symposium Co-Chair
    Choon-Woo Kim
    Inha Univ. (Republic of Korea)

     

    2015 Short Course Chair
    Majid Rabbani
    Eastman Kodak Co. (United States)

     

     

    Symposium Steering Committee:
    Sheila S. Hemami, Symposium Chair, Northeastern Univ. (United States)
    Choon-Woo Kim, Symposium Co-Chair, Inha Univ. (Korea, Republic of)
    Majid Rabbani, Eastman Kodak Co. (United States)
    Andrew J. Woods, Curtin Univ. (Australia)
    Sergio R. Goma, Qualcomm Inc. (United States)
    Kevin J. Matherson, Microsoft Corp. (United States)
    Joyce E. Farrell, Stanford Univ. (United States)
    Suzanne E. Grinnan, IS&T Executive Director (United States)
    Rob Whitner, SPIE Event Manager (United States)

     

    Technical Committee:

    Sos S. Agaian, The Univ. of Texas at San Antonio (United States)

    David Akopian, The Univ. of Texas at San Antonio (United States)

    Adnan M. Alattar, Digimarc Corp. (United States)

    Jan P. Allebach, Purdue Univ. (United States)

    Charles A. Bouman, Purdue Univ. (United States)

    Matthias F. Carlsohn, Computer Vision and Image Communication at Bremen (Germany)

    David Casasent, Carnegie Mellon Univ. (United States)

    Reiner Creutzburg, Fachhochschule Brandenburg (Germany)

    Huib de Ridder, Technische Univ. Delft (Netherlands)

    Margaret Dolinsky, Indiana Univ. (United States)

    Antoine Dupret, Commissariat à l'Énergie Atomique (France)

    Karen O. Egiazarian, Tampere Univ. of Technology (Finland)

    Reiner Eschbach, Xerox Corp. (United States)

    Zhigang Fan, Xerox Corp. (United States)

    Gregg E. Favalora, Optics for Hire (United States)

    Todor G. Georgiev, Qualcomm Inc. (United States)

    Atanas P. Gotchev, Tampere Univ. of Technology (Finland)

    Onur G. Guleryuz, FutureWei Technologies, Inc. (United States)

    Ming C. Hao, Hewlett-Packard Labs. (United States)

    Chad D. Heitzenrater, Air Force Research Lab. (United States)

    Nicolas S. Holliman, Durham Univ. (United Kingdom)

    Francisco H. Imai, Canon U.S.A., Inc. (United States)

    David L. Kao, NASA Ames Research Ctr. (United States)

    Nasser Kehtarnavaz, The Univ. of Texas at Dallas (United States)

     Edmund Y. Lam, The Univ. of Hong Kong (Hong Kong, China)

    Bart Lamiroy, Lehigh Univ. (United States)

    Mohamed-Chaker Larabi, Univ. de Poitiers (France)

    Qian Lin, Hewlett-Packard Labs. (United States)

     Mark A. Livingston, U.S. Naval Research Lab. (United States)

    Robert P. Loce, Xerox Corp. (United States)

    Gabriel G. Marcu, Apple Inc. (United States)

    Ian E. McDowall, Fakespace Labs, Inc. (United States)

    Nasir D. Memon, Polytechnic Institute of New York Univ. (United States)

    Kurt S. Niel, Fachhochschule Wels (Austria)

    Maria V. Ortiz Segovia, Océ Print Logic Technologies (France)

    Thrasyvoulos N. Pappas, Northwestern Univ. (United States)

    William Puech, Lab. d'Informatique de Robotique et de Microelectronique de Montpellier (France)

    Eric K. Ringger, Brigham Young Univ. (United States)

    Alessandro Rizzi, Univ. degli Studi di Milano (Italy)

    Bernice E. Rogowitz, Visual Perspectives Consulting (United States)

    Juha Röning, Univ. of Oulu (Finland)

    Eli Saber, Rochester Institute of Technology (United States)

    Amir Said, Hewlett-Packard Labs. (United States)

    Nitin Sampat, Rochester Institute of Technology (United States)

    Ken D. Sauer, Univ. of Notre Dame (United States)

    Robert Sitnik, Warsaw Univ. of Technology (Poland)

    Robert L. Stevenson, Univ. of Notre Dame (United States)

    Radka Tezaur, Nikon Precision Inc. (United States)

    Sophie Triantaphillidou, Univ. of Westminster (United Kingdom)

    Philipp Urban, Fraunhofer-Institut für Graphische Datenverarbeitung (Germany)

    Ralf Widenhorn, Portland State Univ. (United States)

    Thomas Wischgoll, Wright State Univ. (United States)

    Andrew J. Woods, Curtin Univ. (Australia)

    Dietmar Wüller, Image Engineering GmbH & Co. KG (Germany)

    Sponsors

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