Date:
25 June 2008
Time:
1:30 PM - 5:30 PM
Location:
Marseille, France
Course Level:
Introductory
CEU:
.35
Instructor:
David A. Dorn, PELCO (United States)
Members:
$240.00 | Non-members:
$290.00
Course Details
This course provides a review of CMOS imager technologies looking at architectures, designs, and applications. Performance differences between different types of CMOS imaging arrays (3T, 4T, 5T, and 6T) are covered. CMOS imager architectures for the pixel design and readout circuitry are presented along with fundamental performance limitations and tradeoffs associated with each configuration. Pixel design layouts and physical stacks are shown for 3T, 4T, 5T, and 6T along with performance impacts associated with layout configurations. Different configurations of readout multiplexers are shown along with associated noise, speed, power, accuracy, and features. System applications are discussed along with system impacts associated with different sensor architectures. The current status of the technology is reviewed with a look at future research and development trends.
Learning Outcomes
This course will enable you to:
- describe CMOS imager architectures including pixel and readout designs
- describe operating CMOS camera systems for commercial and scientific imaging applications
- explain the layout and physical construction of different CMOS imager types
- explain how CMOS arrays are fabricated
- describe system applications of CMOS imagers and associated performance tradeoffs
- list specifications and requirements to select a sensor for your imaging application
- recognize performance differences between different CMOS imager topologies and technologies
- assess performance parameters associated with different CMOS imagers
- become familiar with current and future imaging technologies and applications
Intended Audience
This course is for scientists, engineers, and managers involved with high performance CMOS imaging sensors and camera systems.
Instructor
David A. Dorn is currently the manager of the applied technology group for Pelco. Previously he was with Ball Aerospace Inc. leading efforts that have advanced both the engineering and science associated with space-based focal plane arrays (FPAs) at wavelengths from the UV to the IR. With a background originally in detectors, Dorn has been able to optimize how focal plane packages and electronics can maximize the performance of imaging sensors. Dorn has led teams that have built FPAs for the WFC3, ACS, and STIS instruments aboard the Hubble Space telescope, the NIRCam and NIRSpec instruments aboard the James Webb Space Telescope, in addition to FPAs for planetary instruments including HiRise and Ralph. He has authored 25 publications and has patents for CCD and CMOS innovations. Dorn is an Inductee into the Space Technology Hall of Fame for Commercialization of CCD detector technology.
