The chip industry continues to name lithography as a critical challenge in fabricating next-generation integrated circuits. Historically, the lithography community has successfully met any challenge the semiconductor industry has faced, from bringing immersion lithography into mainstream production to working with chip designers on improving manufacturability. However, to continue the required IC technology progression will demand unprecedented ingenuity, the introduction of new lithographic technologies into production, greater cost efficiency, and communication within the lithography community and across interdisciplinary lines. With this in mind an additional conference on etch technology has been added to the Advanced Lithography Symposium.
For the past 35 years, SPIE Advanced Lithography has played a key role in bringing the lithography community together to solve challenges required by the semiconductor industry. Symposium participants come from an extensive array of backgrounds to share and learn about state-of-the-art lithographic tools, resists, metrology, materials characterization, and design and process integration. Through a series of provocative panel discussions and seminars, the symposium further probes current issues to be faced as we extend these technologies or try to switch to alternative technologies.
SPIE Advanced Lithography is organized into seven conferences:
• Alternative Lithographic Technologies
• Extreme Ultraviolet Lithography
• Metrology, Inspection, and Process Control for Microlithography
• Advances in Resist Materials and Processing Technology
• Optical Microlithography
• Design for Manufacturability through Design-Process Integration
• Advanced Etch Technology for Lithographic Patterning
All conferences are organized by current practitioners of the art and numerous courses are taught by recognized industry experts. Additional information is available from the many manufacturers' exhibits, which allow tool makers and material suppliers to showcase new products while interacting one-on-one with customers.
We welcome you to the San Jose Convention Center, San Jose, California for SPIE Advanced Lithography's 36th year.
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Donis G. Flagello
Nikon Research Corp. of America
2012 Symposium Chair
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Harry J. Levinson
GLOBALFOUNDRIES Inc.
2012 Symposium Co-Chair
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Executive Committee
Jason P. Cain, Advanced Micro Devices, Inc.
Will Conley, Dynamic Intelligence
Donis G. Flagello, Nikon Research Corp. of America
Kafai Lai, IBM Corp.
Harry J. Levinson, GLOBALFOUNDRIES Inc.
Mark E. Mason, Texas Instruments Inc.
Patrick P. Naulleau, Lawrence Berkeley National Lab.
Douglas J. Resnick, Molecular Imprints, Inc.
Mark H. Somervell, Tokyo Electron America, Inc.
Alexander Starikov, I&I Consulting
John L. Sturtevant, Mentor Graphics Corp.
William M. Tong, KLA-Tencor Corp
Thomas I. Wallow, GLOBALFOUNDRIES Inc.
Obert R. Wood II, GLOBALFOUNDRIES Inc.
Ying Zhang, Taiwan Semiconductor Manufacturing Co. Ltd. (Taiwan)
Advisory Committee
Robert D. Allen, IBM Almaden Research Ctr.
William H. Arnold, ASML US, Inc.
Timothy A. Brunner, IBM Thomas J. Watson Research Ctr.
Ralph R. Dammel, AZ Electronic Materials USA Corp.
Roxann L. Engelstad, Univ. of Wisconson, Madison
Roderick R. Kunz, MIT Lincoln Lab.
Harry J. Levinson, GLOBALFOUNDRIES Inc.
Burn Lin, Taiwan Semiconductor Manufacturing Co., Ltd. (Taiwan)
Chris A. Mack, lithoguru.com
Victor Pol, Freescale Semiconductor, Inc.
Christopher J. Progler, Photronics, Inc.
Michael T. Postek, National Institute of Standards and Technology
Luc Van den hove, IMEC (Belgium)
C. Grant Willson, The Univ. of Texas at Austin
Anthony Yen, Taiwan Semiconductor Manufacturing Co., Ltd. (Taiwan)
