Plan to Participate!
The semiconductor industry continues to be a critical engine for global economic development and ongoing advancement in IC lithography remains one key enabler for that engine. Despite the importance of lithography, the industry today stands at a crossroad of uncertainty. Lithographic techniques that can be cost effective and move the IC roadmap forward for another decade or more remain elusive. Moreover, market considerations require the end users of lithography to constantly evolve their business models, R&D, and manufacturing strategies on a global basis. Historically, the lithography community has successfully met any challenge the semiconductor industry has faced, from bringing immersion lithography into mainstream production to working with chip designers on improving manufacturability. However, to continue the required technology progression will demand unprecedented ingenuity, cost efficiency and communication within the lithography community and across interdisciplinary lines.
For the past 33 years, the SPIE Advanced Lithography Symposium has played a key role in bringing the lithography community together to solve challenges required by the semiconductor industry. This highly successful Symposium delivers the right combination of practical know how and cutting edge research presented across 5 complementary conferences. Participants from academia to current production engineers are represented to share and learn about state-of-the-art lithographic tools, resists, metrology, materials characterization, and design and process integration. Through a series of provocative panel discussions and seminars, the Symposium further probes current issues to be faced as we extend these technologies or try to switch to alternative technologies.
The Symposium is organized into five conferences:
Alternative Lithographic Technologies
Metrology, Inspection, and Process Control for Microlithography
Advances in Resist Materials and Processing Technology
Optical Microlithography
Design for Manufacturability through Design-Process Integration
All conferences are organized by current practitioners of the art and numerous short courses are taught by recognized industry experts. Additional information is available from the many manufacturers' exhibits, which allow tool makers and material suppliers to showcase new products while interacting one-on-one with customers.
We welcome your participation and urge you to submit an abstract to the appropriate conference as described in the calls for papers. Relevant topics for new technology groups or panel discussions are also solicited.
Join us at the San Jose Convention Center, San Jose, California for the SPIE Advanced Lithography's 34th year. We look forward to seeing you there!
Christopher J. Progler
Photronics Inc.
2009 Symposium Chair
Donis G. Flagello
ASML US, Inc.
2009 Symposium Co-Chair
Executive Committee
Robert D. Allen, IBM Almaden Research Ctr.
John A. Allgair, SEMATECH, Inc. and Advanced Micro Devices, Inc.
Mircea Dusa, ASML US, Inc.
Roxann L. Engelstad, Univ. of Wisconsin/Madison
Donis G. Flagello, ASML US, Inc.
Clifford L. Henderson, Georgia Institute of Technology
Bruno La Fontaine, Advanced Micro Devices, Inc.
Harry J. Levinson, Advanced Micro Devices, Inc.
Christopher J. Progler, Photronics, Inc.
Christopher J. Raymond, Nanometrics, Inc.
Michael L. Rieger, Synopsys, Inc.
Franklin M. Schellenberg, Mentor Graphics Corp.
Vivek K. Singh, Intel Corp.
Advisory Committee
Robert D. Allen, IBM Almaden Research Ctr.
William H. Arnold, ASML US, Inc.
Timothy A. Brunner, IBM Thomas J. Watson Research Ctr.
Ralph R. Dammel, AZ Electronic Materials USA Corp.
Roderick R. Kunz, MIT Lincoln Lab.
Harry J. Levinson, Advanced Micro Devices, Inc.
Burn Lin, Taiwan Semiconductor Manufacturing Co., Ltd. (Taiwan)
Chris A. Mack, lithoguru.com
Victor Pol, Freescale Semiconductor, Inc.
Michael T. Postek, National Institute of Standards and Technology
Luc Van den Hove, IMEC (Belgium)
C. Grant Willson, The Univ. of Texas at Austin
Anthony Yen, Taiwan Semiconductor Manufacturing Co., Ltd. (Taiwan)
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Announcements from Advanced Lithography 2008
Fritz Zernike and the Advances in Optical Microlithography
The 5th Frits Zernike Award for Microlithography is given annually for outstanding accomplishments in microlithographic technology, especially those furthering the development of semiconductor lithographic imaging solutions.
Martin van den Brink, ASML BV, Netherlands, is the 2008 Frits Zernike Award winner in recognition of his pioneering contributions to the advancement of optical lithographic exposure tools.
This Award is made possible by the generous sponsorships from
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The Diana Nyyssonen Memorial Award for Best Paper of 2007 for the conference Metrology, Inspection, and Process Control for Microlithography
Awarded to Mathew Sendelbach, Javier Ayala, IBM Microelectronic Div.; Pedro H. Herrera, KLA-Tencor Corp.
For paper: Predicting electrical measurements by applying scatterometry to complex spacer structures [6518-75]
Presented by John A. Allgair, 2008 Conference Chair
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The 2008 Best Student Paper Award for Optical Microlithography
Awarded to Juliet A. Rubinstein, Univ. of California/Berkeley
For paper: Post-Decomposition Assessment of Double Patterning Layouts [6924-23]
This award was made possible by the generous sponsorship from
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The 2007 C. Grant Willson Best Paper Award for the Advances in Resist Materials and Processing Technology conference
Awarded to Daniel P. Sanders, Linda K. Sunberg, Phillip J. Brock, Richard A. DiPietro, Hoa D. Troung, Robert D. Allen, IBM Almaden Research Ctr.;
For paper: Fluoro-alcohol materials with tailored interfacial properties for immersion lithography lithography [6519-3]
Presented by: Clifford L. Henderson, 2008 Conference Chair
This award was made possible by the generous sponsorships from
