Today, lithographers are challenged with cost-effectively extending immersion lithography to physical limits using multiexposure and multiple-etch processes while striving to bring newer technologies, such as EUV lithography and directed self-assembly, to production readiness. Success will demand unprecedented ingenuity, cost efficiency and communication within the lithography community and across interdisciplinary lines.
For the past 38 years, SPIE Advanced Lithography Symposium has played a key role in bringing the lithography community together to solve challenges required by the semiconductor industry. The total spectrum of lithographic patterning technology is presented at this Symposium across seven complementary conferences. Symposium participants come from an extensive array of backgrounds to share and learn about state-of-the-art lithographic tools, resists, metrology, materials characterization, etch, and design and process integration. Through a series of provocative panel discussions and seminars, the symposium further probes current issues being faced as we extend these technologies or try to switch to alternative technologies. The SPIE Advanced Lithography Symposium also provides a unique forum for meeting and interacting with a wide spectrum industry experts and key players.
SPIE Advanced Lithography is organized into seven conferences:
- Alternative Lithographic Technologies
- Extreme Ultraviolet Lithography
- Metrology, Inspection, and Process Control for Microlithography
- Advances in Patterning Materials and Processing Technology
- Optical Microlithography
- Design-Process Co-Optimization for Manufacturability
- Advanced Etch Technology for Nanopatterning
All conferences are organized by current practitioners of the art and numerous courses are taught by recognized industry experts.
Additional information is available from the many manufacturers' exhibits, which allow tool makers and material and software suppliers to showcase new products while interacting one-on-one with customers. We welcome your participation and urge you to submit an abstract to the appropriate conference as described in the calls for papers. Relevant topics for new technology groups or panel discussions are also solicited.
We welcome your participation in SPIE Advanced Lithography's 39th year, and urge you to submit an abstract to the appropriate conference as described in the calls for papers. Relevant
topics for new technology groups or panel discussions are also solicited.
Harry J. Levinson
2014 Symposium Chair
Mircea V. Dusa
ASML US, Inc.
2014 Symposium Co-Chair
Christopher Bencher, Applied Materials, Inc.
Jason P. Cain, Advanced Micro Devices, Inc.
Luigi Capodieci, GLOBALFOUNDRIES Inc. Inc.
Mircea V. Dusa, ASML US, Inc.
Andreas Erdmann, Fraunhofer Institute of Integrated Systems and Device Technology
Christoph K. Hohle, IBM Thomas J. Watson Research Ctr.
Kafai Lai, IBM Corp.
Harry J. Levinson, GLOBALFOUNDRIES Inc.
Qinghuang Lin, GLOBALFOUNDRIES Inc.
Gottlieb S. Oehrlein, Univ. of Maryland, College Park
Eric M. Panning, Douglas J. Resnick, Molecular Imprints, Inc.
Martha I. Sanchez, IBM Almaden Research Ctr.
John L. Sturtevant, Mentor Graphics Corp.
Thomas I. Wallow, GLOBALFOUNDRIES Inc.
Obert R. Wood II, GLOBALFOUNDRIES Inc.
Robert D. Allen, IBM Almaden Research Ctr.
William H. Arnold, ASML US, Inc.
Timothy A. Brunner, IBM Thomas J. Watson Research Ctr.
Ralph R. Dammel, AZ Electronic Materials USA Corp.
Roxann L. Engelstad, Univ. of Wisconsin, Madison
Donis G. Flagello, Nikon Research Corp. of America
Harry J. Levinson, GLOBALFOUNDRIES Inc.
Burn Lin, Taiwan Semiconductor Manufacturing Co., Ltd.
Chris A. Mack, lithoguru.com
Wilhelm Maurer, Infineon Technologies AG
Christopher J. Progler, Photronics, Inc.
Michael T. Postek, National Institute of Standards and Technology
Luc Van den hove, IMEC
C. Grant Willson, The Univ. of Texas at Austin
Anthony Yen, Taiwan Semiconductor Manufacturing Co., Ltd.