For the past 40 years, SPIE Advanced Lithography has played a key role in bringing together the micro- and nanolithography community. The addition of other lithography-related technology over the past several years has sought to address the patterning integration challenges presented by the continuous scaling of the semiconductor industry. A full spectrum of lithography and patterning topics are encompassed by this year's symposium across seven complementary conferences. Participants come from a broad array of backgrounds to share and learn about state-of-the-art lithographic tools, resists, metrology, materials, etch, design, and process integration. Through a series of provocative panel discussions and seminars, the symposium also probes current issues being faced as we extend current methods, move toward alternative approaches, and identify new ways to complement one technology with another.
Over the years, SPIE Advanced Lithography has provided the unique and primary forum for meeting and interacting with a wide range of industry experts, researchers, and key players working on patterning technology development. Attendance ensures that participants learn and share the latest developments in areas of central importance to many vital technology fields.
This year, SPIE Advanced Lithography is structured into the following conferences. Joint sessions between conferences also offer opportunities to cover topics common across these interest areas.
* Alternative Lithographic Technologies
* Extreme Ultraviolet Lithography
* Metrology, Inspection, and Process Control for Microlithography
* Advances in Patterning Materials and Processing Technology
* Optical Microlithography
* Design-Process-Technology Co-Optimization for Manufacturability
* Advanced Etch Technology for Nanopatterning
All conferences are organized by current practitioners of the art (conference chairs), working together with organizing committees that are experts in these fields. Numerous courses have also been organized, which are taught by recognized experts from industry and academia. Additional information is available from the many manufacturers' exhibits that allow tool makers, material suppliers, and software groups to showcase new products while interacting one-on-one with participants.
We welcome your attendance and hope you will join us in San Jose for SPIE Advanced Lithography's 41st year!
||Mircea V. Dusa
ASML US, Inc.
2016 Symposium Chair
Bruce W. Smith
Rochester Institute of Technology
2016 Symposium Co-Chair
Christopher Bencher, Applied Materials, Inc.
Jason P. Cain, Advanced Micro Devices, Inc.
Luigi Capodieci, KnotPrime Inc.
Joy Y. Cheng, Taiwan Semiconductor Manufacturing Co., Ltd.
Mircea V. Dusa, ASML US, Inc.
Sebastian U. Engelmann, IBM Thomas J. Watson Research Ctr.
Andreas Erdmann, Fraunhofer-Institut für Integrierte Systeme und Bauelementetechnologie IISB
Kenneth A. Goldberg, Lawrence Berkeley National Lab.
Christoph K. Hohle, Fraunhofer Institute for Photonic Microsystems
Jongwook Kye, GLOBALFOUNDRIES Inc.
Qinghuang Lin, IBM Thomas J. Watson Research Ctr.
Eric M. Panning, Intel Corp.
Martha I. Sanchez, IBM Research - Almaden
Bruce W. Smith, Rochester Institute of Technology
Vladimir A. Ukraintsev, Qorvo™
Todd R. Younkin, Intel Corp.
Robert D. Allen, IBM Research - Almaden
William H. Arnold, ASML US, Inc.
Timothy A. Brunner, IBM Corp.
Ralph R. Dammel, EMD Performance Materials Corp.
Donis G. Flagello, Nikon Research Corp. of America
Harry J. Levinson, GLOBALFOUNDRIES Inc.
Burn Lin, Taiwan Semiconductor Manufacturing Co., Ltd.
Chris A. Mack, lithoguru.com
Michael T. Postek, National Institute of Standards and Technology
Christopher J. Progler, Photronics, Inc.
C. Grant Willson, The Univ. of Texas at Austin
Anthony Yen, Taiwan Semiconductor Manufacturing Co., Ltd.