• Advanced Lithography 2016
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San Jose Marriott and San Jose Convention Center
San Jose, CA , United States
21 - 25 February 2016
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Plan to Participate

Lithography continues to be challenged with extending patterning toward physical limits while remaining manufacturable and cost effective. State-of-the-art processes are now largely carried out using immersion imaging combined with multiple-exposure and etch processes. This is done while striving to bring EUV lithography closer to production readiness. Along with all of this, the lithography community is aggressively pursuing other new patterning approaches and driving implementation of complementary solutions. Success calls for unique interdisciplinary interactions and coordinated efforts between lithographers, layout designers, materials scientists, and metrology/process control engineers to enable cost efficient patterning solutions.

For the past 40 years, the SPIE Advanced Lithography Symposium has played a key role in bringing together the micro- and nanolithography community. The addition of other patterning related technology over the past several years has sought to solve the challenges presented by the continuous scaling of the semiconductor industry.

A full spectrum of lithographic and patterning technology is now present at the symposium across seven complementary conferences. Symposium participants come from a broad array of backgrounds to share and learn about state-of-the-art lithographic tools, resists, metrology, materials characterization, etch, design, and process integration. Also, through a series of provocative panel discussions and seminars, the symposium probes current issues being faced as we extend these technologies, switch to alternative technologies, or identify ways to complement one technology with another.

Over the years, SPIE Advanced Lithography Symposium has provided the unique and primary forum for meeting and interacting with a wide range of industry experts, researchers, and key players working on patterning technology development. This year, the SPIE Advanced Lithography Symposium is structured into the following conferences. All conferences are organized by current practitioners of the art, and numerous courses are taught by recognized industry experts.

* Alternative Lithographic Technologies
* Extreme Ultraviolet Lithography
* Metrology, Inspection, and Process Control for Microlithography
* Advances in Patterning Materials and Processing Technology
* Optical Microlithography
* Design-Process-Technology Co-Optimization for Manufacturability
* Advanced Etch Technology for Nanopatterning

We welcome your participation for SPIE Advanced Lithography's 41th year, and urge you to submit your abstracts to the appropriate conference as described in the call for papers. Relevant topics for new technology groups or panel discussions are also solicited. 
 

Mircea Dusa Mircea V. Dusa
ASML US, Inc.
2016 Symposium Chair
Bruce W. Smith

Bruce W. Smith
Rochester Institute of Technology
2016 Symposium Co-Chair



Executive Committee
Christopher Bencher, Applied Materials, Inc.
Jason P. Cain, Advanced Micro Devices, Inc.
Luigi Capodieci, GLOBALFOUNDRIES Inc.
Joy Y. Cheng, Taiwan Semiconductor Manufacturing Co., Ltd.
Mircea V. Dusa, ASML US, Inc.
Sebastian U. Engelmann, IBM Thomas J. Watson Research Ctr. 
Andreas Erdmann, Fraunhofer-Institut für Integrierte Systeme und Bauelementetechnologie IISB
Kenneth A. Goldberg, Lawrence Berkeley National Lab.
Christoph K. Hohle, Fraunhofer Institute for Photonic Microsystems
Jongwook Kye, GLOBALFOUNDRIES Inc.
Qinghuang Lin, IBM Thomas J. Watson Research Ctr.
Eric M. Panning, Intel Corp.
Martha I. Sanchez, IBM Research - Almaden
Bruce W. Smith, Rochester Institute of Technology
Vladimir A. Ukraintsev, DCG Systems, Inc.
Todd R. Younkin, Intel Corp. 

Advisory Committee
Robert D. Allen, IBM Research - Almaden
William H. Arnold, ASML US, Inc.
Timothy A. Brunner, IBM Corp.
Ralph R. Dammel, EMD Performance Materials Corp.
Donis G. Flagello, Nikon Research Corp. of America
Harry J. Levinson, GLOBALFOUNDRIES Inc.
Burn Lin, Taiwan Semiconductor Manufacturing Co., Ltd.
Chris A. Mack, lithoguru.com
Michael T. Postek, National Institute of Standards and Technology
Christopher J. Progler,
Photronics, Inc.
C. Grant Willson, The Univ. of Texas at Austin
Anthony Yen, Taiwan Semiconductor Manufacturing Co., Ltd.

Important Author Dates

Abstract Due Date
8 September 2015

Author Notification
22 October 2015

Manuscripts Due
25 January 2016


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