The chip industry continues to name lithography as a critical challenge in fabricating next generation integrated circuits. Historically, the lithography community has successfully met any challenge the semiconductor industry has faced, from bringing immersion lithography into mainstream production to working with chip designers on improving manufacturability. However, to continue the required IC technology progression will demand unprecedented ingenuity, cost efficiency and communication within the lithography community and across interdisciplinary lines.
For the past 34 years, the SPIE Advanced Lithography Symposium has played a key role in bringing the lithography community together to solve challenges required by the semiconductor industry. With the addition of a new conference in 2010 covering EUV lithography, the total spectrum of lithography technology is presented across 6 complementary conferences. Symposium participants come from an extensive array of backgrounds to share and learn about state-of-the-art lithographic tools, resists, metrology, materials characterization, and design and process integration. Through a series of provocative panel discussions and seminars, the Symposium further probes current issues to be faced as we extend these technologies or try to switch to alternative technologies.
The Symposium is organized into six conferences:
* Alternative Lithographic Technologies
* Extreme Ultraviolet Lithography
* Metrology, Inspection, and Process Control for Microlithography
* Advances in Resist Materials and Processing Technology
* Optical Microlithography
* Design for Manufacturability through Design-Process Integration
All conferences are organized by current practitioners of the art and numerous short courses are taught by recognized industry experts. Additional information is available from the many manufacturers' exhibits, which allow tool makers and material suppliers to showcase new products while interacting one-on-one with customers.
We welcome your attendance and hope that you will join us at the San Jose Convention Center, San Jose, California for SPIE Advanced Lithography’s 35th year. We look forward to seeing you there!
 | Christopher J. Progler
Photronics Inc.
2010 Symposium Chair |
 | Donis G. Flagello
Nikon Research Corp. of America
2010 Symposium Co-Chair |
Executive Committee
Robert D. Allen, IBM Almaden Research Ctr.
Will Conley, Freescale Semiconductor, Inc.
Mircea V. Dusa, ASML US,Inc.
Donis G. Flagello, Nikon Research Corp. of America
Daniel J. C. Herr, Semiconductor Research Corp.
Bruno La Fontaine, GLOBALFOUNDRIES Inc.
Patrick P. Naulleau, Lawrence Berkeley National Lab.
Christopher J. Progler, Photronics, Inc.
Christopher J. Raymond, Nanometrics, Inc.
Michael L. Rieger, Synopsys, Inc.
Mark H. Somervell, Tokyo Electron America, Inc.
Alexander Starikov, I&I Consulting
Joerg Thiele, Qimonda AG (Germany)
William M. Tong, Consultant
Advisory Committee
Robert D. Allen, IBM Almaden Research Ctr.
William H. Arnold, ASML US, Inc.
Timothy A. Brunner, IBM Thomas J. Watson Research Ctr.
Ralph R. Dammel, AZ Electronic Materials USA Corp.
Roxann L. Engelstad, Univ. of Wisconson, Madison
Roderick R. Kunz, MIT Lincoln Lab.
Harry J. Levinson, Advanced Micro Devices, Inc.
Burn Lin, Taiwan Semiconductor Manufacturing Co., Ltd. (Taiwan)
Chris A. Mack, lithoguru.com
Victor Pol, Freescale Semiconductor, Inc.
Michael T. Postek, National Institute of Standards and Technology
Luc Van den Hove, IMEC (Belgium)
C. Grant Willson, The Univ. of Texas at Austin
Anthony Yen, Taiwan Semiconductor Manufacturing Co., Ltd. (Taiwan)
