Lithography today, and even more tomorrow, is challenged with cost-effectively extending immersion patterning toward physical limits. This is being carried out using multiple-exposure and etch processes while striving to bring EUV lithography to production readiness. In parallel, the lithography community is aggressively pursuing other newer technologies, such as directed self-assembly. Success calls for unique interdisciplinary interactions, and coordinated efforts between lithographers, layout designers, materials scientists, and metrology/process control engineers to enable cost efficient patterning solutions.
For the past 39 years, SPIE Advanced Lithography has played a key role in bringing together the lithography community. The addition of other patterning related technology over the past several years, has sought to solve the challenges presented by the continuous scaling of the semiconductor industry.
A full spectrum of lithographic and patterning technology is now present at the symposium across seven complementary conferences. Symposium participants come from a broad array of backgrounds to share and learn about state-of-the-art lithographic tools, resists, metrology, materials characterization, etch, design, and process integration. Also, through a series of provocative panel discussions and seminars, the symposium probes current issues being faced as we extend these technologies, switch to alternative technologies, or identify ways to complement one technology with another.
Over the years, SPIE Advanced Lithography has provided a unique forum for meeting and interacting with a wide-spectrum of industry experts and key industry players working on patterning technology developments.
SPIE Advanced Lithography is structured into seven conferences:
* Alternative Lithographic Technologies
* Extreme Ultraviolet Lithography
* Metrology, Inspection, and Process Control for Microlithography
* Advances in Patterning Materials and Processing Technology
* Optical Microlithography
* Design-Process-Technology Co-Optimization for Manufacturability
* Advanced Etch Technology for Nanopatterning
All conferences are organized by current practitioners of the art, and numerous courses are taught by recognized industry experts.
Additional information is available from the many manufacturers' exhibits, which allow tool makers, material and software suppliers to showcase new products while interacting one-on-one with customers.
We welcome your participation in the 40th SPIE Advanced Lithography, and urge you to submit your abstracts to the appropriate conference as described in the call for papers. Relevant topics for new technology groups or panel discussions are also solicited.
||Mircea V. Dusa
ASML US, Inc.
2015 Symposium Chair
Bruce W. Smith
Rochester Institute of Technology
2015 Symposium Co-Chair
Christopher Bencher, Applied Materials, Inc.
Jason P. Cain, Advanced Micro Devices, Inc.
Luigi Capodieci, GLOBALFOUNDRIES Inc.
Mircea V. Dusa, ASML US, Inc.
Sebastian U. Engelmann, IBM Thomas J. Watson Research Ctr.
Andreas Erdmann, Fraunhofer Institute of Integrated Systems and Device Technology
Christoph K. Hohle, Fraunhofer Institute for Photonic Microsystems
Kafai Lai, IBM Corp.
Qinghuang Lin, IBM Thomas J. Watson Research Ctr.
Eric M. Panning, Intel Corp.
Douglas J. Resnick, Canon Nanotechnologies, Inc.
Martha I. Sanchez, IBM Research - Almaden
Bruce W. Smith, Rochester Institute of Technology
John L. Sturtevant, Mentor Graphics Corp.
Thomas I. Wallow, ASML Brion Technologies
Obert R. Wood II, GLOBALFOUNDRIES Inc.
Robert D. Allen, IBM Research - Almaden
William H. Arnold, ASML US, Inc.
Timothy A. Brunner, IBM Thomas J. Watson Research Ctr.
Ralph R. Dammel, AZ Electronic Materials USA Corp.
Donis G. Flagello, Nikon Research Corp. of America
Harry J. Levinson, GLOBALFOUNDRIES Inc.
Burn Lin, Taiwan Semiconductor Manufacturing Co., Ltd.
Chris A. Mack, lithoguru.com
Wilhelm Maurer, Infineon Technologies AG
Christopher J. Progler, Photronics, Inc.
Michael T. Postek, National Institute of Standards and Technology
Luc Van den hove, IMEC
C. Grant Willson, The Univ. of Texas at Austin
Anthony Yen, Taiwan Semiconductor Manufacturing Co., Ltd.