Lithography continues to be challenged with extending patterning toward physical limits while remaining manufacturable and cost effective. State-of-the-art processes are now largely carried out using immersion imaging combined with multiple-exposure and etch processes. This is done while striving to bring EUV lithography closer to production readiness. Along with all of this, the lithography community is aggressively pursuing other new patterning approaches and driving implementation of complementary solutions. Success calls for unique interdisciplinary interactions and coordinated efforts between lithographers, layout designers, materials scientists, and metrology/process control engineers to enable cost efficient patterning solutions.
For the past 39 years, the SPIE Advanced Lithography Symposium has played a key role in bringing together the micro- and nanolithography community. The addition of other patterning related technology over the past several years has sought to solve the challenges presented by the continuous scaling of the semiconductor industry. A full spectrum of lithography and patterning topics are encompassed by this year’s Symposium across seven complementary conferences. Participants come from a broad array of backgrounds to share and learn about state-of-the-art lithographic tools, resists, metrology, materials, etch, design, and process integration. Through a series of provocative panel discussions and seminars, the symposium also probes current issues being faced as we extend current methods, move toward alternative approaches, and identify new ways to complement one technology with another.
Over the years, SPIE Advanced Lithography Symposium has provided the unique and primary forum for meeting and interacting with a wide range of industry experts, researchers, and key players working on patterning technology development. Attendance ensures that participants learn and share the latest developments in areas of central importance to many vital technology fields.
This year, the SPIE Advanced Lithography Symposium is structured into the following conferences. Joint sessions between the conferences also offer opportunities to cover topics common across these interest areas.
* Alternative Lithographic Technologies
* Extreme Ultraviolet Lithography
* Metrology, Inspection, and Process Control for Microlithography
* Advances in Patterning Materials and Processing Technology
* Optical Microlithography
* Design-Process-Technology Co-Optimization for Manufacturability
* Advanced Etch Technology for Nanopatterning
All conferences are organized by current practitioners of the art working together with organizing committees of experts in these fields. Numerous short courses have also been organized, which are taught by recognized experts from industry and academia. Additional information is available from the many manufacturers' exhibits which allow tool makers, material suppliers, and software groups to showcase new products while interacting one-on-one with participants.
We welcome your attendance and hope you will join us at the San Jose Convention Center, San Jose, California for SPIE Advanced Lithography's 40th year!
||Mircea V. Dusa
ASML US, Inc.
2015 Symposium Chair
Bruce W. Smith
Rochester Institute of Technology
2015 Symposium Co-Chair
Christopher Bencher, Applied Materials, Inc.
Jason P. Cain, Advanced Micro Devices, Inc.
Luigi Capodieci, GLOBALFOUNDRIES Inc.
Mircea V. Dusa, ASML US, Inc.
Sebastian U. Engelmann, IBM Thomas J. Watson Research Ctr.
Andreas Erdmann, Fraunhofer Institute of Integrated Systems and Device Technology
Christoph K. Hohle, Fraunhofer Institute for Photonic Microsystems
Kafai Lai, IBM Corp.
Qinghuang Lin, IBM Thomas J. Watson Research Ctr.
Eric M. Panning, Intel Corp.
Douglas J. Resnick, Canon Nanotechnologies, Inc.
Martha I. Sanchez, IBM Research - Almaden
Bruce W. Smith, Rochester Institute of Technology
John L. Sturtevant, Mentor Graphics Corp.
Thomas I. Wallow, ASML Brion Technologies
Obert R. Wood II, GLOBALFOUNDRIES Inc.
Robert D. Allen, IBM Research - Almaden
William H. Arnold, ASML US, Inc.
Timothy A. Brunner, IBM Thomas J. Watson Research Ctr.
Ralph R. Dammel, AZ Electronic Materials USA Corp.
Donis G. Flagello, Nikon Research Corp. of America
Harry J. Levinson, GLOBALFOUNDRIES Inc.
Burn Lin, Taiwan Semiconductor Manufacturing Co., Ltd.
Chris A. Mack, lithoguru.com
Wilhelm Maurer, Infineon Technologies AG
Christopher J. Progler, Photronics, Inc.
Michael T. Postek, National Institute of Standards and Technology
Luc Van den hove, IMEC
C. Grant Willson, The Univ. of Texas at Austin
Anthony Yen, Taiwan Semiconductor Manufacturing Co., Ltd.