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    Author Submission and Chair Review System

      

    Eighth International Conference on Thin Film Physics and Applications (TFPA13)


    Dates: 20-23 September 2013
    Location: Shanghai, China


    Manuscript submissions for the TFPA 2013 conference will go through the SPIE Submission and Review System.

    Submit Your Manuscript 

    You will be asked to provide information about your submission, including complete author information.

    An account is required to submit a manuscript or review manuscript submissions for this conference. You can create an account when you click on the link below, or if you already have an SPIE account, you can sign in:

    TFPA 2013: Eighth International Conference on Thin Film Physics and Applications

    Manuscript Due date: 27 November 2013 - Full length manuscript.

    Manage Your Active Submissions

    Authors: Complete your submission, submit a revision, or view the status of your manuscript.

    Chairs and Committee Members: Access and review manuscripts.


    If you have questions about the submission process, please contact Stephanie Kaiser, SPIE Proceedings Coordinator, stephaniek@spie.org, or call +1 360 685 5402. SPIE hours are Monday-Friday, 8 am to 5 pm Pacific Time.

    If you have questions about the meeting, please see the meeting website at http://218.193.147.7:8080/TFPA2013/.