Embassy Suites by Hilton Denver
Denver, Colorado, United States
4 - 8 March 2018
Conference SSN02
Electroactive Polymer Actuators and Devices (EAPAD) XX
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Abstract Due:
21 August 2017

Author Notification:
30 October 2017

Manuscript Due Date:
5 February 2018

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Conference Chair
Conference Co-Chair
Program Committee
  • Barbar J. Akle, Lebanese American Univ. (Lebanon)
  • Tunku Ishak Al-Irsyad, Univ. Teknologi MARA (Malaysia)
  • Kinji Asaka, National Institute of Advanced Industrial Science and Technology (Japan)
  • Pavol Bauer, Technische Univ. Delft (Netherlands)
  • Siegfried G. Bauer, Johannes Kepler Univ. Linz (Austria)
  • Ray H. Baughman, The Univ. of Texas at Dallas (United States)
  • Václav Bouda, Czech Technical Univ. in Prague (Czech Republic)
  • Federico Carpi, Univ. degli Studi di Firenze (United Kingdom)
  • Suresh Chandra, Institute of Technology, Banaras Hindu Univ. (India)
  • Hyouk Ryeol Choi, Sungkyunkwan Univ. (Korea, Republic of)
  • Gal deBotton, Ben-Gurion Univ. of the Negev (Israel)
  • Toribio Fernández Otero, Univ. Politécnica de Cartagena (Spain)
  • Yahya A. Ismail, A'Shargiyah Univ. (Oman)
  • Edwin W. H. Jager, Linköping Univ. (Sweden)
  • Giedrius Janusas, Kaunas Univ. of Technology (Lithuania)
  • Kwang Jin Kim, Univ. of Nevada, Las Vegas (United States)
  • Gabor M. Kovacs, EMPA (Switzerland)
  • Maarja Kruusmaa, Univ. of Tartu (Estonia)

Program Committee continued...
  • Jinsong Leng, Harbin Institute of Technology (China)
  • John D. W. Madden, The Univ. of British Columbia (Canada)
  • Qibing Pei, Univ. of California, Los Angeles (United States)
  • Thelge Chaminda Peiris, MAS Innovation Ltd. (Sri Lanka)
  • Valentin Radu, Omicron Plus S.R.L. (Romania)
  • Mehdi Razzaghi-Kashani, Tarbiat Modares Univ. (Iran, Islamic Republic of)
  • Jonathan M. Rossiter, Univ. of Bristol (United Kingdom)
  • Anuvat Sirivat, Chulalongkorn Univ. (Thailand)
  • Anne Ladegaard Skov, Technical Univ. of Denmark (Denmark)
  • Ji Su, NASA Langley Research Ctr. (United States)
  • Minoru Taya, Univ. of Washington (United States)
  • I-Hsiang Tseng, Feng Chia Univ. (Taiwan)
  • Rocco Vertechy, Univ. degli Studi di Bologna (Italy)
  • Frédéric Vidal, Univ. de Cergy-Pontoise (France)
  • Gordon G. Wallace, Univ. of Wollongong (Australia)
  • Thomas Wallmersperger, Technische Univ. Dresden (Germany)
  • Qiming M. Zhang, The Pennsylvania State Univ. (United States)
  • Jian Zhu, National Univ. of Singapore (Singapore)
  • Pawel Zylka, Wroclaw Univ. of Technology (Poland)

Call for
Celebrating the 20th anniversary of the EAPAD conference

EAP actuators and devices are enabling many new technologies from smart wearables to soft robots. They have the pliability, low density, and the capacity for the large active displacements required for biomimetic and other mechanically flexible systems. Of particular interest is their potential to augment, improve upon, and possibly replace biological muscles. Besides their attractive characteristics as actuators, they are also being exploited to enable new types of soft generators or sensors. Development of effective and robust EAP mechanisms and devices requires improved theoretical and empirical understanding of their behavior, design concepts for efficient actuation, generation and sensing, and reliable and repeatable fabrication and characterization methods, as well as effective control algorithms and electronics. The objective of this conference is to identify the latest EAP device and material developments and improvements: enhance the understanding of their material behavior, including effective modeling of their electro-mechanics and chemistry, cover techniques of processing and characterization, and highlight new device applications. Further, this conference is seeking to promote the development of high performance EAP as smart materials and to increase the recognition of EAP as viable options for use in smart structures.

Papers are solicited on but not limited to the following EAP related topics:
  • advances in actuation, sensing, energy harvesting and proprioception using EAP devices
  • advances in EAP materials
  • theoretical models, analysis, and simulation including computational chemistry
  • measurement, testing, and characterization methods
  • manufacturing technologies, including printing, electroding, synthesis, processing, shaping, and fabrication
  • design and engineering of actuators, sensors, and their integration into systems
  • technology from miniature scale (MEMS, micro, and nano) to large devices
  • applications inartificial muscles, robotics, biomimetics, energy harvesting, medical, industry, etc.

  • driving electronics, system integration, and packaging

  • control algorithms for devices and their implementation in software and hardware.
2018 Keynote Talk: Origami-inspired engineering from minimally invasive surgery to exoplanet exploration, Brian Trease, Univ. of Toledo (USA)

Special Session: Celebrating the EAP Advances in The Last 20 Years

EAP-In-Action Demonstration Session
This Session that is held annually as part of the SPIE’s EAPAD conference is intended to turn the spotlight on Electroactive Polymers (EAP) materials and their applications as well as increase the recognition of their potential for smart structures. New materials and applications are continuing to emerge and this session is intended to provide the attendees an opportunity to see a demonstration of EAP materials in action. This Session offers a forum of interaction between the technology developers and potential users as well as a "hands-on" experience with this emerging technology. It provides a great opportunity to see the capability of state-of-the-art of EAP as potential actuators-of-choice. An award certificate will also be given to the top three Best EAP-in-Action Demonstration Award winners. Details can be found online on the Awards page.

To participate in this demonstration session, authors are encouraged to submit an abstract via the conference homepage and enter "EAP Demo" when prompted during the submission process. All demonstration participants will also be expected to give an oral presentation in the conference program and submit a manuscript for the conference proceedings. Details about oral presentations and manuscript submission instructions will be included in the Author Notification email sent on 30 October 2017.
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