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Journal of Micro/Nanolithography, MEMS, and MOEMS Special Section Calls for Papers

To submit a manscript for consideration in a Special Section, please prepare the manuscript according to the journal guidelines and use the Online Submission SystemLeaving site. A cover letter indicating that the submission is intended for this special section should be included with the paper. Papers will be peer‐reviewed in accordance with the journal's established policies and procedures. Authors who pay the voluntary page charges will receive the benefit of open access.

View the list of special sections that have already been published on the SPIE Digital Library.

Calls for Papers:

Alternative Lithographic Technologies V

July - September 2016

Alternative Lithographic Technologies V

Guest Editors:

Chris Bencher
Applied Materials Inc.
Santa Clara, California United States
E-mail: Chris_Bencher@amat.com

Ricardo Ruiz
HGST, a Western Digital Company
San Jose, California, United States
E-mail: ruiz.ric@gmail.com

Call for Papers: Several options exist to extend the semiconductor technology roadmap to the 14-nm node and beyond. Both top-down and bottom-up lithographic technologies are now part of the ITRS roadmap, and among the candidates are maskless lithography, nanoimprint lithography, and directed self-assembly. In addition to enabling cost effective solutions for the logic and memory markets, these lithographic solutions also hold the promise of enabling many other key markets that also require high-resolution lithography. Included in this list are patterned media for hard disk drives, high brightness light-emitting diodes, and several display-related applications.

Any lithographic technology needs to address several key requirements beyond just resolution. Critical parameters include defectivity, overlay, and throughput. In addition, any consideration for high-volume manufacturing must include a supporting infrastructure that facilitates a seamless integration of the new technology into a production facility. To address these key parameters and encourage the development of these technologies, we invite the submission of technical papers that will aid in moving these lithographic technologies forward. Both theoretical and experimental papers are welcome in the following areas:

Directed Self-Assembly (DSA)

  • Design and integration strategies
  • Defect management, registration, and throughput
  • Metrology strategies and issues
  • Essential shapes, dimension control
  • Novel 2-D and 3-D DSA concepts and implementations
  • Novel materials, such as phase-segregating materials, molecular scaffolds, and molecular nanostructures
  • Predictive material, process, and compact models
  • Patterning of NIL templates and masks for non-IC applications, such as hard disk drives

Alternative Pattern Integration Techniques

  • Spacer multiple patterning
  • Self-aligned strategies
  • Selective deposition

Nano-Imprint Lithography (NIL)

  • Thermal, UV, J-FIL, soft, and roll-to-roll imprint lithography, and novel imprint processes
  • Tooling and design, including alignment and overlay
  • Resists and novel materials
  • Defectivity, including defect sources and defect detection
  • Master and daughter mask/templates, including fabrication, metrology, cleaning, and replication
  • Nanometrology for NIL
  • Device fabrication using NIL

Direct-Write Mask-Less Lithography (ML2)

  • Single-beam or multibeam electron beam lithography (EBL) and ion-beam lithography
  • Massively parallel multibeam or multipixel EBL for wafer, mask, and template patterning
  • Electro-optical MEMS technologies
  • Electron sources and optics, data path management, registration, and overlay control
  • Methods for achieving CD and LER control
  • High-throughput electron beam resists and resist processes

Other Novel Lithographic Approaches

  • Including the use of plasmonics, micromirror optical lithography, interferometric lithography, tip-based nanolithography, scanning array lithography, dip pen printing, and drop-on-demand inkjet lithography

Alternative, Non-IC Applications

  • Including bioelectronics and genomics, photovoltaics and related energy applications, disk drives and patterned media, flat panel displays, optoelectronics and LEDs, photonic crystals, negative-refractive-index/metamaterials, nanopatterned sensors, building blocks for defect-tolerant computing, smart resists, and self-healing materials.

All papers will undergo the standard peer-review process for the Journal of Micro/Nanolithography, MEMS and MOEMS (JM3). Manuscripts should be submitted to SPIE according to the journal guidelines at http://spie.org/jm3. A cover letter indicating that the submission is intended for this special section should be included. For more information, please contact the guest editors or jm3@spie.org.

Closed for submissions.


Published Special Sections:

Control of Integrated Circuit Patterning Variance, Part 2: Image Placement, Device Overlay, and Critical Dimension (April-June 2016)
Guest Editor: Alexander Starikov

Photomask Manufacturing Technology (April-June 2016)
Guest Editors: Masato Shibuya, Morihisa Hoga, and Kiwamu Takehisa

Extending VLSI and Alternative Technology with Optical and Complementary Lithography (April-June 2016)
Guest Editors: Kafai Lai and Andreas Erdmann

On the Interface of Holography and MEMS (October-December 2015)
Guest Editors: Partha Banerjee, Pierre-Alexandre Blanche, Christophe Moser, and Myung K. Kim

Alternative Lithographic Technologies IV (July-September 2015)
Guest Editors: Douglas J. Resnick, Ricardo Ruiz, and Hans Loeschner

Control of Integrated Circuit Patterning Variance Part 1: Metrology, Process Monitoring, and Control of Critical Dimension (April-June 2015)
Guest Editors: Alexander Starikov and Matthew Sendelbach

Continuation of Scaling with Optical and Complementary Lithography (January-March 2015)
Guest Editors: Kafai Lai and Andreas Erdmann

Holistic/Hybrid Metrology (October-December 2014)
Guest Editors: Alok Vaid and Eric Solecky

Alternative Lithographic Technologies III (July-September 2014)
Guest Editors: Douglas J. Resnick, Christopher Bencher, and Ricardo Ruiz

Metrology and Inspection for 3-D Integrated Circuits and Interconnects (January-March 2014)
Guest Editors: Yi-sha Ku and Alexander Starikov

Emerging MOEMS Technology and Applications (January-March 2014)
Guest Editors: M. Edward Motamedi, Joel Kubby, Patrick Ian Oden, and Wibool Piyawattanametha

Optical Lithography Extension Beyond the 14-nm Node (January-March 2014)
Guest Editors: Will Conley and Kafai Lai

Advanced Fabrication of MEMS and Photonic Devices (October-December 2013)
Guest Editors: Georg von Freymann, Mary Ann Maher, and Thomas J. Suleski

Advanced Plasma-Etch Technology (October-December 2013)
Guest Editors: Ying Zhang, Qinghuang Lin, and Gottlieb S. Oehrlein

Alternative Lithographic Technologies (July-September 2013)
Guest Editors: Will Tong and Douglas J. Resnick

Photomasks for EUV Lithography (April-June 2013)
Guest Editors: Christopher J. Progler and Frank E. Abboud

Alternative Lithographic Technologies (July-September 2012)
Guest Editors: William M. Tong, Douglas J. Resnick, and Benjamin Rathsack

Directed Self-Assembly (July-September 2012)
Guest Editors: Daniel P. Sanders and William H. Arnold

Reliability, Packaging, Testing, and Characterization of MEMS and MOEMS III (April-June 2012)
Guest Editors: Sonia M. García-Blanco and Rajeshuni Ramesham

EUV Sources for Lithography (April-June 2012)
Guest Editors: Vivek BAkshi and Anthony Yen

Dimensional Metrology with Atomic Force Microscopy: Instruments and Applications (January-March 2012)
Guest Editors: Ronald Dixson and Ndubuisi G. Orji

Theory and Practice of MEMS, NEMS, and MOEMS (January-March 2011)
Guest Editor: Yu-Cheng Lin

Reliability, Packaging, Testing, and Characterization of MEMS and MOEMS II (October-December 2011)
Guest Editor: Rajeshuni Ramesham

Line-Edge Roughness (October-December 2011)
Guest Editors: Chris A. Mack and Will Conley

Metrology (October-December 2011)
Guest Editors: Moshe Preil and Shaunee Cheng

BioMEMS, Theory and Practice of MEMS/NEMS, and Sensors (July-September 2010)
Guest Editor: Yu-Cheng Lin

Extreme-Ultraviolet Lithography (October-December 2009)
Guest Editors: Kevin Cummings and Kazuaki Suzuki

Reliability, Packaging, Testing, and Characterization of MEMS and MOEMS (July-September 2009)
Guest Editors: Rajeshuni Ramesham and Allyson L. Hartzell

Computational Lithography (July-September 2009)
Guest Editors: Donis Flagello and Chris Mack

Theory and Practice of MEMS/NEMS/MOEMS, RF MEMS, and BioMEMS (April-June 2009)
Guest Editor: Yu-Cheng Lin

Extreme-Ultraviolet Interference Lithography (April-June 2009)
Guest Editor: Franco Cerrina

Double-Patterning Lithography (January-March 2009)
Guest Editor: William H. Arnold

Silicon-Based MOEMS and Their Applications (April-June 2008)
Guest Editors: Harald Schenk and Wibool Piyawattanametha

Resolution Enhancement Techniques and Design for Manufacturability (July-September 2007)
Guest Editor: Alfred K. K. Wong

Bio-MEMS and Microfluidics (April-June 2006)
Guest Editors: Wanjun Wang and Ian Papautsky

Nanopatterning (January-March 2006)
Guest Editors: Kees Eijkel, Jill Hruby, Glen Kubiak, M. Scott, Volker Saile, and Steven Walsh

MOEMS Design, Technology, and Applications (October-December 2005)
Guest Editor: M. Edward Motamedi

Polarization and Hyper-NA Lithography (July-September 2005)
Guest Editor: Donis Flagello and Christopher J. Progler

Next Generation Lithography (January-March 2005)
Guest Editor: Walt Trybula

Mask Technology for Optical Lithography (April-June 2004)
Guest Editor: Kevin D. Cummings and Frank M. Schellenberg

Immersion Lithography (January-March 2004)
Guest Editor: William H. Arnold

Surface Micromachining (October-December 2003)
Guest Editors: Jeffry J. Sniegowski and James H. Smith

Micro-Optics for Photonic Networks (October-December 2003)
Guest Editor: Thomas J. Suleski

Lithography for Sub-100-nm Device Fabrication (October-December 2002)
Guest Editor: William H. Arnold

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