Dr. Yiu-Ming Cheung, Ken, obtained a Higher Diploma in Applied Science from Hong Kong Polytechnics in 1982 and received the MSc and PhD degrees in Physics from Stevens Institute of Technology, New Jersey, USA, in 1988 and 1994, respectively.
He was Research Associate and Research Assistant during his graduate studies in NEC Research Institute at Princeton, New Jersey, USA, between 1991 and 1992. He was the Postdoctoral Teaching Fellow and the Project Manager in Physics Department of Hong Kong Baptist University from October 1994 to July of 1996. He has joined ASM Technology Hong Kong since July 1996. He is currently a senior R&D Manager of Enabling Technology for the company. He received 17 US patents and over 50 patents world-wide. He authored and co-authored 25 technical journal papers, over 50 technical articles in conferences proceedings and one chapter of a book on micro-joining processes. His works cover broadly on electronic packaging processes which include wedge aluminium wire-bonding process, piezoelectric cleaning and bonding processes, ultra-thin die attach and stacking process, laser micro-joining process and active alignment process for photonic packages, laser drilling, dicing and soldering processes for solar panels, laser dicing process for glass display panel and ultra-fine pitch flexible substrate, laser assisted fine-pitch flip-chip bonding process, C2 copper pillar flip-chip bonding process with NCP and NCF, and wafer de-bonding process by UV solid-state laser. He currently works on the development of the assembly processes for Fan-out Wafer/Panel Level Packages and massive bonding process of micro/mini-LED for large RGB display panel.
Dr. Cheung is Senior Member of IEEE and serves as General Co-chairman and Treasurer in EMAP2006. He was the Chairman of IEEE CPMT Hong Kong Chapter from year 2003 to 2004 and the Vice-Chair of the Chapter from year 1999 to 2002. He is also a Life Member of SPIE.