Marinov, Val R.

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Dr. Val R. Marinov

Associate Professor
North Dakota State Univ

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Area of Expertise: laser methods for microelectronics packaging, ultrathin, ultra-small semiconductor dies, chip-in-paper and chip-on-flex packaging
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Val R. Marinov graduated magna cum laude with B.Sc. and M.Sc. degrees in manufacturing engineering from the Technical University, Rousse, Bulgaria, in 1979. He received his Ph.D. degree in manufacturing engineering from the Technical University of Sofia, Bulgaria in 1992.
He has seven years of industrial and more than 25 years of academic experience in the area of manufacturing engineering for metal, plastic, and electronic products. Currently, he is an Associate Professor of Manufacturing Engineering at North Dakota State University (NDSU), Fargo, ND. Prior to joining NDSU, he served on the faculty at Eastern Mediterranean University, Cyprus (1997–2000). His prior affiliations include the Technical University in Plovdiv, Bulgaria (1987–1997) and the Laboratory for Precision Machining and Machine Tools, Korea Advanced Institute of Science and Technology, Taejon, South Korea (1993–1994).
Since 2002 Dr. Marinov has been associated with the NDSU Center for Nanoscale Science and Engineering (CNSE), Fargo, ND, where he has been leading some of the most successful large research teams composed of undergraduate and graduate students, staff researchers, and NDSU faculty. Under his leadership and based on his recent invention, his research team was the first in the world to demonstrate in 2011 the use of lasers for contactless packaging of functional microelectronic devices. This work was featured in an NDSU press release and attracted the attention of many professionals in the field. Recently, Dr. Marinov’s team has reported, again for the first time, embedding ultrathin RFID chips in paper for applications such as security and financial paper, smart labels and tickets, RFID banknotes, and many more, using the laser-enabled advanced packaging (LEAP) technology pioneered by the team.
Dr. Marinov has (co)authored over fifty publications in broad and diversified fields, most recently in the area of laser methods for advanced microelectronics packaging.
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