Dr. Tejinder Singh

Early Career Professional Member | Senior Principal Member of Technical Staff at Dell Technologies
Singh, Tejinder
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SPIE Membership: 0.9 years
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Social Media: LinkedIn
ORCID iD: https://orcid.org/0000-0002-5870-6204
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Profile Summary

Tejinder Singh received the Ph.D. degree in electrical and computer engineering from the University of Waterloo, Waterloo, ON, Canada, in 2020. He is currently a Postdoctoral Scholar at NASA Jet Propulsion Laboratory (JPL), California Institute of Technology, Pasadena, CA, USA and also a Research Associate with the Centre for Integrated RF Engineering (CIRFE), Department of Electrical and Computer Engineering, University of Waterloo, Waterloo, ON, Canada. He held Microelectronics Research and Development Engineer position in industry from 2010 to 2012. From 2014 to 2015, he served as a University Instructor/Lecturer.

His current research interests include designing, modeling, characterization, and fabrication of phase change materials (PCMs) and microelectromechanical systems (MEMS) based RF devices for microwave and millimeter-wave (mmWave) applications. He has contributed in the development of PCM GeTe-based miniaturized components for mmWave applications.

Dr. Singh is a member of international professional bodies including IEEE MTT-S, IEEE EDS, OSPE, and IOP Science. He is a recipient of highly competitive and prestigious federal awards from Natural Sciences and Engineering Research Council of Canada (NSERC) including Postdoctoral Fellowship from 2020 to 2022 and Vanier Canada Graduate Scholarship from 2017 to 2020. He has also received the President’s Graduate Scholarship from 2017 to 2020, the Waterloo Institute of Nanotechnology (WIN) Nanofellowship from 2016 to 2017 and from 2017 to 2018. He has been awarded Brian L. Barge Microsystems Integration Award in Canada-wide research competition. His research contributions has been bestowed numerous accolades including the IEEE Harold Sobol Grant in 2019, First Place of the Student Paper Competition and Best Paper Award at IEEE MTT-S Int. Microw. Symp. (IMS 2019) and Best Paper Award at IEEE MTT-S Int. Microw. Workshop Series on Adv. Mater. Processes (IMWS-AMP 2018) to name a few.

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