Mr. Siegfried Kowalsky

Sales Manager
ATV Technologie GmbH


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Summary
Batch type and In Line VACUUM REFLOW Soldering/Brazing OVENS: void free solder joints

MEMMS-PACKAGE SEALING with GETTER activation

THERMO COMPRESSION BONDER 450°C/1 100°C: TLP Soldering, Ag sintering, constrained LTCC, glass embossing

QUARTZ TUBE Furnaces: LPCVD, VECSEL oxidation, LTCC sintering

Manual DIAMOND SCRIBERS: to 200 mm

IR LPCVD/ALD System, 1050°C, temperature/pressure alternation

BSET EQ GAS PLASMA SYSTEMS:
etching/cleaning/ashing/stripping/RI Etching, functional de-capsulation/de-layering
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