Many ways to shrink: The right moves to 10 nanometer and beyond Martin van den Brink, President and CTO, ASML
With mobile devices such as smartphones outpacing other market segments, the demand for low-power chips, enabled by continued device shrink, continues to be strong. The semiconductor industry’s drive to innovate is relentless, R&D pipelines are filled, and IC manufacturers have multiple options to continue scaling. This presentation will examine the different technology options for the 10 nanometer node and beyond.
More than 70 presentations in 2014
Mask Making: Mask data preparation • Substrates and materials • Patterning tools and processes • Resist and resist processing • Etch techniques • Metrology • Inspection • Repair • Cleaning, contamination, and haze • Simulation of mask making
9-inch Glass: Impact of 450mm wafers on reticle and infrastructure • Tool developments to support larger blanks • Material developments
SPIE Photomask Technology is co-located with SPIE Scanning Microscopies 2015, a multidisciplinary conference for advancing scanning microscopy technologies and applications. Two conferences for one registration, plus access to multidisciplinary connections and information.
SPIE Scanning Microscopies Monterey Conference Center and Monterey Marriott Monterey, California, United States 29 September - 1 October 2015
Important Author Dates
Abstract Due Date 13 April 2015
Author Notification 25 May 2015
Manuscripts Due 31 August 2015
Sign Up for Email Updates
Receive email updates on SPIE Photomask Technology.