Author Submission & Chair Review System


Tenth International Conference on Thin Film Physics and Applications (TFPA 2019)

Dates: 19-22 May, 2019 Location: Hyatt Regency Qingdao, Qingdao, China


Manuscript submissions for the Tenth International Conference on Thin Film Physics and Applications will go through the SPIE Submission and Review System.

Submit Your Manuscript

You will be asked to provide information about your submission, including complete author information.

An account is required to submit, or review submissions for this conference. You can create an account when you click on the link below, or if you already have an SPIE account, you can sign in:

Tenth International Conference on Thin Film Physics and Applications

Manuscript Due Date: 24 April 2019

Manage Your Active Submissions

Authors:
Complete your submission, submit a revision, or view the status of your submission.

Chairs and Committee Members: Access and review submissions

If you have questions about the submission process, please contact Ms. Pat Wight, SPIE Proceedings Coordinator, mailto:patw@spie.org, or call +1 360 685 5526. SPIE hours are Monday-Friday, 8 am to 5 pm Pacific Time.

If you have questions about the meeting or registration, please see the meeting website at http://pldtfpa2019.htcis.net/