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Micro/Nano Lithography

Will Tong: Alternative lithographic techniques

Advancing lithography to smaller and smaller dimensions will require a multidisciplinary approach and openness to new techniques.
8 May 2012, SPIE Newsroom. DOI: 10.1117/2.3201205.07

William M. Tong has more than 15 years of experience in the development of next-generation lithographies, including EUVL, nanoimprint, and e-beam. He has worked in the field of materials development for 15 years since receiving his Ph.D. in chemistry from UCLA in 1995, with a career spanning national labs (Lawrence Livermore & Lawrence Berkeley) and high-technology companies (Applied Materials and Hewlett Packard). After graduation from UCLA, he received a NSF International Postdoctoral Fellowship to work at Istituto di Struttura delle Materie in Frascati, Italy.

He joined Lawrence Livermore National Lab in 1997 to engage in the early-development EUVL, specializing in EUVL photomasks and multilayer coating technologies. From 2003 to 2008, he worked in Hewlett-Packard's R&D arm responsible for inkjet printing, and led the team that developed nanoimprint technologies; the team generated more than 30 patents on nanoimprint and other nanofabrication techniques. He was also the co-PI of the team that integrated the first memristor crossbar memory into a CMOS circuit. Tong is the first- or co-author of over 40 journal articles and has 20 patents filed, with 8 of them issued. Currently he is a research scientist in the REBL program at KLA-Tencor Corp. and is responsible for materials issues involving the DPG (Digital Pattern Generator), the column, and the cathode. He is chair of the Alternative Lithographic Techniques conference at SPIE Advance Microlithography symposium. He was interviewed there in March 2012.