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Micro/Nano Lithography

Yan Borodovsky: The various paths to next-generation lithography

The march to the next node will depend on overcoming barriers and exploiting multiple solutions before "next generation" becomes "this generation," says Intel's lithography director.

13 March 2013, SPIE Newsroom. DOI: 10.1117/2.3201303.04

Yan Borodovsky is an Intel Senior Fellow and Director of Advanced Lithography in Intel's Technology and Manufacturing Group, responsible for directing Intel's multi-generational advanced lithography definition and progress. Borodovsky has been involved in the development of lithography tooling and advanced patterning techniques since he joined Intel in 1987 as a staff engineer. He was appointed Intel Fellow in January 1999 and Intel Senior Fellow in November of 2003.

He received master's degree in Solid State Devices and Physics from Politechnical Institute in Tula, Russia, in 1971. After graduation, he joined the Nuclear Research Institute of the Ukrainian Academy of Science, Kiev, as an engineer involved in the research and development of solid state spectrometers of nuclear radiation. He left the former Soviet Union in 1979 and started his work at Syncal Corp. developing high-temperature semiconductor materials for deep space thermoelectric conversion devices.

In 1982, Borodovsky joined Advanced Micro Devices as Lithography Staff Engineer. In 1985, he moved to Oregon to join ATEQ Corporation, where he designed and developed optical systems and optical testing equipment for the original CORE 2000 Laser Writer.

He is a Fellow of SPIE and has authored numerous papers in SPIE Proceedings since 1995.