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Micro/Nano Lithography

Multimedia presentations: SPIE Advanced Lithography 2017

Plenary talks and keynote presentations drew capacity crowds at the world's premier lithography event.

14 March 2017, SPIE Newsroom. DOI: 10.1117/2.3201703.10

The following presentations consist of audio and slides.

Inspection and Metrology to Support the Quest for Perfection: Photolithography for the Sub-10nm Nodes

Ben (Bin-Ming) Tsai, KLA-Tencor Corp. (USA)
Ben (Bin-Ming) Tsai
KLA-Tencor Corporation (USA) 

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Materials Innovation: It's No Longer Only About Resolution

Nobu Koshiba, President and CEO of JSR Corp (Japan)
Nobu Koshiba
JSR Corp. (Japan)

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Stochastics and the phenomenon of line-edge roughness

Chris Mack, Lithoguru (USA)
Chris A. Mack
Lithoguru.com (USA) 

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Optical 3D nano-fabrication: top-down and bottom up approaches

Satoshi Kawata, Osaka University (Japan)
Satoshi Kawata
Osaka University (Japan)

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Enabling sub-10nm node lithography: presenting the NXE:3400B EUV scanner with improved overlay, imaging, and throughput

Mark van de Kerkhof, ASML (Netherlands)
Mark van de Kerkhof
ASML (Netherlands) 

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Flat Optics with Metasurfaces: Beyond Refractive and Diffractive Optics

Mohammadreza Khorasaninejad, Harvard School of Engineering and Applied Sciences (USA)
Mohammadreza Khorasaninejad
Harvard School of Engineering and Applied Sciences (USA) 

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Metrology capabilities and needs for 7nm and 5nm logic nodes

Benjamin Bunday, SEMATECH (USA)
Benjamin Bunday

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Applying NIL for device fabrication and challenges in nano-defect management

logo for AL17
Tatsuhiko Higashiki
Toshiba Corp. (Japan)

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Technology Development: the "In Between"

logo for AL17
David Fried
Coventor, Inc. (USA)

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