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Micro/Nano Lithography

William T. Siegle Plenary presentation: Contact Printing to EUV: Lessons Learned from the Art of Lithography

Presented at SPIE Advanced Lithography 2013

26 February 2013, SPIE Newsroom. DOI: 10.1117/2.1201302.97

William T. Siegle Independent Consultant and ASML Advisory Board Member In his talk, "Contact Printing to EUV: Lessons Learned from the Art of Lithography," William Siegle discusses advances made lithography technology.

EUV with its 13.5nm wavelength promises relief from 193nm limits, notes Siegle. While prototype machines are operating in a number of customer fabs, the productivity required for economical manufacturing insertion has not yet been demonstrated. Other alternatives, such as e-beam or nanoimprint have shown promising laboratory results, and show lots of activity at this conference each year. But a viable path to production insertion for these alternatives is not visible, and substantial industrialization investment would be required.

Nevertheless, the dedication and ingenuity of our worldwide talents always seems to find a way. Many lessons have been learned, with in all likelihood, more to come.

Bill (William T.) Siegle enjoyed a 25-year career at IBM where he became the Director of the Advanced Technology Center in East Fishkill. He joined Advanced Micro Devices in Sunnyvale in 1990 as Vice President of Technology, and retired in 2005 as Sr. VP of Technology and Manufacturing. He has served on the boards of SRC and Sematech, and the public companies Etec, DuPont Photomasks and currently ASML. He has been involved with lithography throughout his career, as both an enabler and a user.