Nordson MARCH, a Nordson company, announces its new SPHERETM Series plasma systems for wafer-level and 3D packaging applications. Based on Nordson MARCH's TRAKTM Series, the new series consists of the TrophoSPHERETM and StratoSPHERETMplasma treatment systems.
The systems perform descum, ashing (photoresist/polymer stripping), dielectric etch, wafer bumping, organic contamination removal, and wafer destress. Both systems support automated handling and processing of round or square wafers and can process thin wafers with or without a carrier, depending upon the wafer thickness.
The SPHERE Series models are differentiated by the size of their chambers.
The TropoSPHERE system has the smallest chamber. It is designed for high-throughput processing of semiconductor wafers and other flat substrates in sizes ranging from 76 mm (3 in.) to 200 mm (8 in.) in diameter for wafers held in open cassettes.
The StratoSPHERE plasma system handles semiconductor wafers up to 300 mm (12 in.) in diameter. Both series utilize a patented plasma chamber design that provides exceptional etch uniformity and process repeatability. The control architecture enables short plasma cycle times with very low overhead, ensuring that throughput is maximized and cost of ownership is minimized.