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SPIE Lithography Asia 13 - 15 October 2010
Incheon, Republic of Korea

SPIE Lithography Asia—Korea

The Call for Papers will be available 1 March.

It is our great pleasure to invite you to participate in the third SPIE Lithography Asia conference, featuring presentations from leading researchers, developers, and innovators, and building on last year’s very successful conference.

This is your opportunity to present your research and connect with others working at the leading edge of semiconductor device and flat panel display (FPD) technologies.



Conference topics include:

Emerging Lithographic Technology and Nanofabrication

 
  • Optical lithography extension (shorter than 157 nm)
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  • EUV lithography
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  • E- and ion- beam technology
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  • Nano-imprint lithography
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  • Application on nanostructures
  • Optical Microlithography

     
  • ArF immersion lithography
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  • RET technology
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  • Double exposure/double patterning lithography
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  • OPC modeling
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  • Photo cluster automation
  • Advances in Resist Material and Processing

     
  • Emerging resist materials
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  • Advancement in immersion resists
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  • Resist process optimizations
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  • Resist material for LCD application
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  • Double exposure material
  • Metrology, Inspection, and Process Control

     
  • Advancement in CD metrology
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  • Advancement in overlay metrology
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  • Advancement in defect inspection
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  • Process control for CD and overlay
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  • Emerging metrology technology
  • LCD Application

     
  • Imaging technology
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  • Process control
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  • Material technology
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  • Automation and productivity
  • Sponsors

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    Important Dates

    Abstract Due Date:
    30 June 2009

    Post-Deadline Submissions
    Late abstract submissions may be accepted, subject to chair approval

    Author Notification Date:
    10 August 2009

    Full-Length Manuscripts Due:
    26 October 2009


    Innovation Starts Here


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