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ZeroMicron Inc.
Company Description
Zeromicron (ZM), and its subsidiary company, Green Process (GP), are leaders in wafer polishing technology, with over 100+ years of combined experience in wafer polishing and related technologies. ZM manufactures many patented designs and IP for wafer polishing templates/carriers/holders, and pad dressers, for its significant global semiconductor, LED, & optoelectronics customers. ZM/GP take particular pride in providing prompt and reliable customer service, that combined with its unique wafer polishing products, and expertise in process development, provide substantial advantages which include: added template lifecycle, better wafer specs, flatness, geometries, higher removal rates/reduced polishing times, higher yields, fewer blowouts/breaks, higher throughput, etc., that reduce overall costs. ZM fixture designs can fit any tool or application, and are very effective for Sapphire, SiC, Si, Ge, GaAs, & other materials. ZM/GP have also developed a new generation of polishing machines, and related equipment, tools, consumables, & accessories. These ZM/GP polishing tools, in combination with the ZM fixtures and consumables, are designed to provide technology innovations that improve wafer quality/specs, throughput, yields, safety/handling, environmental quality, cost control, & other elements. These polishing machines are specifically engineered for Sapphire wafer polishing, as well as other materials/substrates for the semiconductor, LED, and optoelectronics industries.
Contact Information
 1482 N 4th St
San Jose,CA
United States
Press Releases
| Zeromicron Introduces New Green Process Wafer Polishing Machines, New High-Removal Sapphire Slurry, and Lapping/Cutting Vehicle
Announcement -- Zeromicron, Inc., together with its subsidiary, Green Process, has developed an innovative, eco-friendly, efficient, and durable, wafer polishing machine, to integrate with its many proprietary accessories, equipment, tools, fixtures, and consumables for enhanced planar surface technology, and volume wafer production for LED, Optoelectronics, Semiconductor, and other wafer materials processing applications. This “New Generation” of wafer polishing machines incorporates many design innovations intended to address the critical needs both the production and R&D wafer polishing applications. These machines are designed to be highly flexible, durable, and effective within a wide range of applications including Sapphire, SiC, Si, Ge, GaAs, InP, and other materials used in the LED, Optoelectronics, and Semiconductor industries. These machines are engineered to be easy to operate, reduce downtime, reduce slurry use, decrease polishing time, and improve safety handling features, while also providing green environmentally-friendly advantages. They are specifically targeted for harder materials such as Sapphire and SiC, but also capable of improved polishing on other materials. Some of the special features and advantages incorporated into the machine design include: specially-designed platen adaptor assembly for acceptance of innovative “quick-change” polishiong pad assembly; central feed “low-flow” slurry delivery system, providing more precise slurry delivery to the polishing interface; light-weight tilting polishing head for ease of inspection and removal/handling, as well as better precision contact with the polishing pad surface; high-heat tolerance in critical components; high durability for long life cycle precision polishing; special innovations in wafer/template carrier designs to improve wafer spinning dynamics, polishing results, handling, breakage, yields, throughput, and overall costs. These innovations address various critical needs of materials processing industries by [providing improvements In wafer flatness, surface roughness, geometries, removal rates, yields, yields, wafer damage, slurry delivery/use, reduced downtime, operator safety, environmental impacts, process control, overall cost reductions, and other critical elements.
Zeromicron also introduces a new polishing slurry, specifically engineered for polishing Sapphire, to provide higher removal rates (24 microns per hour removal based on single-side polish tests at certain polish parameters), improved throughput, with no diamond for less surface damage and higher yields.
Zeromicron also introduces a new water-based Lapping, wire saw cutting, and core drilling Additive/Vehicle for fast cut rates. This additive is NOT based on long-chain polymers. The ZM lapping vehicle/additive is fully formulated to be used as a recirculating lapping vehicle for the Ceramic, Sapphire, Silicon, and Quartz industries. This product is unique in that it incorporates non-toxic synthetic and organic components that fully encapsulate grinding and lapping abrasives, and hold them in suspension better than any known water-based vehicle. This vehicle is easy to mix, can fully suspend more abrasive than any other known product, and can be recirculated to extend the lifetime of the abrasive, such as Boron Carbide, Cubic Boron Nitride, and Diamond. It exhibits an extremely high viscosity when the slurry is at rest, thus providing highly effective stabilizing of the abrasive in suspension. Other advantages include accelerated cut rates , reduce scratching, reduced sub-surface damage, reduced edge damage, flatter parts, higher yields, and reduced costs. For more information contact Zeromicron. |
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