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TECNISCO, LTD.
Company Description
TECNISCO is a subsidiary of Disco Corp. a worldwide manufacturer of dicing saws and grinding machines. We are doing processing services and able to supply customized parts that are manufactured with metal, ceramic, glass and silicon by its advanced high-precision processes and composite technologies.
TECNISCO's expertise includes: Dicing, Sandblasting, Milling (CNC machining), Assembling (AuSn, AuGe, AgCuIn, AgCu), Polishing, Bonding, Metallization (Plating, Sputtering, Vapor deposition) for
producing such as CuW, CuMoCu, CuAlNCu, Cu heatsinks (for High power laser diode ) and Structured glass wafer (for MEMS and Medical divice).
Contact Information
 2-2-15 Minami-Shinagawa
Shinagawa,Tokyo
Japan
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