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Microcertec
Company Description
MICROCERTEC is a 40-year-established company specialized in technical ceramics and glass, high-precision machining and microctechniques. We manufacture customized ceramic components and brazed ceramic-to-metal assemblies for the high-tech industries. We have had a long-standing experience with photonics applications ranging from lasers, infra-red detectors, imaging equipment or optical-fibre devices.
Our product and technology expertise covers the manufacturing of high-precision ceramic and glass components, as well as metallized 3D interconnect devices, hermetic ceramic-to-metal & glass-to-metal assemblies :
- chip carriers, electrical insulators and heat spreaders,
- laser reflectors, customized optical-fibre ceramic sleeves and ferrules,
- 3D interconnect devices,
- structural parts ,
- ceramic-to-metal and glass-to-metal hermetic packages and feedthroughs,
- brazed A.R coated window to metal cap assemblies.
Contact Information
47 Allée du Clos des Charmes
ZA Les Portes de la Forêt
Collegiens
France
Press Releases
| Microcertec ceramic 3D interconnect devices are smart solutions for photonics device packaging
Microcertec, a specialized French company in advanced ceramics, high precision-grinding and laser micromachining, offers customized ceramic 3D interconnect devices for packaging solutions in such applications as infra-red detectors, imaging devices, high-power laser diodes, semiconductor lasers or LED’s.
Ceramic 3D-interconnect chip carriers manufactured by Microcertec S.A.S prove to be smart and reliable solutions for packaging chips and integrated circuits. They enable designers to reduce the size and weight of the packaging still guaranteeing precision in positioning the electrode array. And not the least, ceramics offer better heat dissipation, electrical insulation and dimension stability at extreme temperatures than platics and metals.
Description of the technology : a 3-dimensional ceramic body is fully machined to the required shape and tolerances. A thin metal layer - gold in general - is then deposited onto by vacuum thin-film deposition technologies. Finaly, ablation of the metal layer is operated by a micro-machining laser which enables to precisely reveal the interconnection circuit.
Benefits of the laser-etching technology : compared with photolithography techniques for 2D surfaces, laser micro-machining enables the manufacturing of TRUE monolithic 3D interconnection devices, with more flexibility and no expensive tooling. Our technology allows the production of typical runs from prototypes to a few thousands of parts per year. It also ofen reveals to be a cheaper solution for prototypes and low-quantity batches of 2D or 2.5D formats because it only requires NC programming, mechanical fixtures and laser processing setting. Single parts can be treated, and if a change in the circuit pattern is required this only implies a programming modification.
Microcertec is an independent privately-owned company specialized in the manufacturing of customized components in advanced ceramics and high-precision grinding. The company has partnerships with associate companies specialized in customized thin-film coatings - Kerdry - and brazed ceramic-to-metal assemblies - PNL Innotech. Pacific Rim Engineering represents the three companies in the U.S.A.
Contact : Microcertec SAS, 47 allée du clos des charmes, 77090 Collégien – France. Tel: +33 (0)1 60 06 63 64. Email: alain.charbonnier@microcertec.com, ray@pacificrimintl.com, norman@pacificrimeng.com |
| Microcertec Presents its 3-D Interconnection Cube at Photoni
Chicago, December 3, 2008 (word count: 324)
High-resolution images are available on request.
Microcertec S.A.S combines its expertise of precision-grinding of ceramics with thin-film metallizing and laser micromachining with the aim of offering customized carriers or packaging solutions for such applications as, for instance, infrared detectors, high-power laser diodes, semiconductor lasers or LEDs. The company will present its 3-D interconnection chip carrier at Photonics West 2009 in San Jose, Calif., from Jan. 27 to 29, on the French Pavilion at booth 6142.
3-D interconnection ceramic chip carriers are smart solutions for packaging photonics devices. The chip carriers manufactured by Microcertec S.A.S prove to be smart and reliable solutions for packaging chips and integrated circuits. They enable designers to reduce the size and weight of the packaging while guaranteeing precision in positioning the electrode array. Ceramics also offer better heat dissipation, electrical insulation, and dimension stability at extreme temperatures than plastics and metals.
Description of the technology: A three-dimensional ceramic body is fully machined to the required shape and tolerances. A thin metal layer is then deposited onto by vacuum thin-film deposition technology. Finally, ablation of the metal layer is operated by a micromachining laser which enables to precisely reveal the interconnection circuit.
Benefits of the laser-etching technology: Compared with photolithography techniques for 2-D surfaces, laser micromachining enables the manufacturing of monolithic 3-D interconnection devices, with more flexibility and no expensive tooling. Microcertec's technology allows the production of typical runs from prototypes to a few thousands of parts per year.
It also often proves to be a cheaper solution for prototypes and low-quantity batches of 2-D or 2.5-D formats because it only requires NC programming and laser processing setting. Single parts can be treated and there is usually no need for expensive fixtures. If a change in the circuit pattern is required this only implies a programming modification.
Microcertec is an independent privately owned company specialized in the manufacturing of customized components in advanced ceramics using techniques of precision grinding, high-precision ultrasonic machining, laser micromachining and thin-film metallizing.
For more information, please contact:
MICROCERTEC
Alain Charbonnier
ZA Les Portes de la Fôret
47 allée du Clos des Charmes
77615 Collégien
FRANCE
Tel.: +33 (0)1 60 06 63 64
E-mail: alain.charbonnier@microcertec.com
Web: www.microcertec.com
or:
FRENCH TECHNOLOGY PRESS OFFICE
205 North Michigan Avenue, Suite 3740
Chicago, IL 60601
Fax: (312) 327-5261
E-mail: contact.ftpo@ubifrance.fr |
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